轉職熱搜工作

• Work with the architecture/micro-architecture/design teams to do white box testing. • Create testplans based on the micro-architecture document with the design team. • Build, maintain and upgrade testbenches and their components using UVM-based methods. • Build custom BFMs for co-sim based module level verification. • Add assertions and checkers to facilitate verification. • Work with the design team to do module level formal verification. • Create controlled random testcases. Pre-debug and provide debug reports. • Check functional coverage and code coverage.

1. Responsible for high-speed UCIE development, including architecture definition, verification, and customer support (familiar with architecture, firmware, debugging, optimization, and testing tasks). 2. Define architecture and specifications through simulations. ( Matlab ) 3. Develop test automation. 4. Collaborate with the team to establish system prototypes and optimize performance. 5. Achieve product integration for clients and support mass production.

1. Perform pre-silicon and post-silicon correlation and modeling related to adaptive voltage scaling and on-die sensor 2. Develop and improve post-silicon testing methodologies related to adaptive voltage scaling and on-die sensor

-規劃並執行高速介面（如 PCIe, USB, DP, UFS, CSI, UCIe）IP PHY 驗證。 -建立並維護測試平台，進行 System 與 Electrical 測試。 -使用 Scope, BERT, LA, Signal Analyzer 等儀器進行 Signal Integrity 與 Compliance Test。 -分析測試結果，協助 DE 及 SW 團隊解決問題。 -設計並開發硬體 PCB 評估板，支援系統驗證。

• Chip to Chip 介面類比 PHY 電路，例如 UCIe 標準或客製化的 Die to Die 連結類比電路設計 • HBM/DDR/LPDDR類比PHY電路設計與混合模式/高速電路設計等。

We are seeking skilled engineers for designing high-performance Virtualization and Interconnect Architecture and developing RTL for both Automotive and High-Performance Computing. Roles: 1. Develop, assess, and refine RTL to achieve performance, power, area, and timing goals. 2. Develop micro-architecture by exploring early high-level macro architectures, researching micro-architecture, and defining detailed specifications. 3. Coordinate co-design efforts between architecture, software, and hardware teams to achieve functional realization. 4. Develop and implement interconnect methodologies, such as simulation, emulation, implementation, and efficiency improvement.

1. AI processor subsystem架構與RTL設計 2. AI processor subsystem整合驗證與介面設計 3. AI processor subsystem效能與低功耗設計與分析

1. Develop high speed interface subsystem architecture and integrate PCIe, MIPI, or DisplayPort subsystem. 2. Develop security and FuSa function on PCIe, MIPI, or DisplayPor degital circuit.

• Lead the DV effort of a high-end CPU project. • Manage, coach and guide DV engineers. Follow up status and keep up the schedule. • Architect and implement top-module testbenches and their components using UVM-based methods. • Lead the effort of building in-house BFMs to facilitate co-sim based module level verification. • Architect and implement formal verification based module level testbench. • Work with the design team to create testplans. Implement checkers/assertions/coverage check points. • Work with validation folks to improve design visibility

1. Develop and implement tailored DRAM controller/PHY solutions for automotive applications. Validate functionality, improve design revisions and meet performance targets as well as system requirements. 2. Perform rigorous design testing and debugging in automotive environments. Troubleshoot and propose solutions for any issues occurring in post-silicon validation. 3. System Level Cache Design & Implementation: Design and implement system level cache strategies to optimize performance and efficiency across our product range. 4. System-Level Understanding: Exhibit a system-level understanding of performance trade-offs, system architecture, memory subsystems, and various memory technologies (DDR3, DDR4, DDR5, LPDDR3, LPDDR4, LPDDR5 etc.). 5 . Ensure that all designs comply with automotive industry standards and regulations, such as ISO 26262 and Automotive SPICE.