轉職熱搜工作

We are looking for AI hardware architect/designer to join our team and play a pivotal role in designing, developing, and optimizing architecture of the neural processing unit (NPU). As an architect/designer, you will be responsible for creating innovative hardware and software solutions that meet the performance, scalability, and efficiency requirements of our advanced NPU environment. The ideal candidate will have a strong background in computer architecture, microarchitecture, and digital design, as well as experience with industry-standard tools and methodologies. You are expected to transform novel ideas into practical proposals for future NPU products, and vet the proposals via prototyping. Extensive knowledge in compiler and operating system is a plus. International travel may be required.

1. 數位設計GAI IDE平台架構需求分析、設計與整合。 2. 數位設計GAI應用開發與測試。 3. 數位設計GAI prompt engineering/RGA/AI-agent框架開發與測試。

1. AI ISP 硬體架構設計 2. 系統power 與 bandwidth 設計 3. 相機規格制訂 4. ISP 硬體系統規格驗證規劃 5. 車用安全規劃

(請留意：為加快面試安排時間，僅限定投遞5個職缺)我們在找這樣的你：對行動通訊、無線及寛頻連結、家庭娛樂晶片解決方案有濃厚興趣；勇於表達意見，以團隊成功為目標，面對困難不輕易放棄，總是在想更好的做法，擁有創新及不斷學習的精神。聯發科技邀請您，與全球最頂尖的菁英一同合作，彼此激盪最新的創意與解法，共同挑戰每一個不可能。

1. 開發emulation/prototyping 相關的技術及使用流程 2. 建立CPU/GPU emulation/prototyping 驗證平台 3. 協助project team導入emulation/prototyping 技術 4. emulation/prototyping 使用及工具問題的支持 5. 管理 emulator 及prototyping 硬體與使用分配

AI Model development, system level modeling and HW/SW system level bottleneck analysis

1. 系統應用電源需求與控制架構分析 2. 電源管理晶片規格制定與驗證 3. 類比電路開發與驗證 4. 驗證電路板設計 5. 自動化測試開發

1. 平台電源管理系統架構設計與規格定義, 包含功耗/溫度/性能等系統分析. 2. 系統應用詳細電源需求與控制架構之分析與優化 3. 電源管理芯片規格制定與新技術之開發.

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation