轉職熱搜工作

1. IC封裝/晶圓凸塊技術開發與管理 2. 與封裝廠合作完成規劃之技術開發 3. 先進封裝技術開發,品質驗證與生產良率管理 4. 定期與不定期執行bumping/fan-out/WLCSP廠品質稽核

1. 數位設計GAI IDE平台架構需求分析、設計與整合。 2. 數位設計GAI應用開發與測試。 3. 數位設計GAI prompt engineering/RGA/AI-agent框架開發與測試。

Fully accountable with the team to deliver highly competitive ARM based CPU IP. Implementation skill required ranged from RTL, synthesis, DFT, Floorplan, Placement, CTS, Routing, Timing Closure, and physical verification.

Design the 5G and next-generation modem processor with cost effective, high speed, and low power hardware performance. This position will develop the modem processor that optimized for modem system. Co-work closely with software and system architecture colleague to analysis the sweet point of system performance and low power. In this position, you will push the physical performance to next level and co-work with place-and-route (PAR) team resolving the bottleneck of speed and power.

(請留意：為加快面試安排時間，僅限定投遞5個職缺)我們在找這樣的你：對行動通訊、無線及寛頻連結、家庭娛樂晶片解決方案有濃厚興趣；勇於表達意見，以團隊成功為目標，面對困難不輕易放棄，總是在想更好的做法，擁有創新及不斷學習的精神。聯發科技邀請您，與全球最頂尖的菁英一同合作，彼此激盪最新的創意與解法，共同挑戰每一個不可能。