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  • SoC Modeling 工程師

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 2~3年工作經驗
    開發手機/平板SoC模擬及分析平台, 從系統效能,功率消耗,溫度控制...等多重面向分析產品競爭力, 進而從系統角度優化硬體架構及軟體控制策略。
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  • CPU post-silicon硬體設計驗證

    面議(經常性薪資達4萬元或以上) 新竹市東區 3~4年工作經驗
    根據不同專案使用的各種CPU架構: 1. 規畫用於system bring-up到量產所需的測試程式 2. 開發各類功能及SRAM測試程式(程式撰寫與模擬, 機台驗證) 3. 基於對CPU design的了解以及實驗設計, debug post-silicon DPPM, RMA問題
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  • 系統硬體研發工程師

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 2~3年工作經驗
    1. IC功能驗證 2. 公板/建議線路設計開發(OrCAD/PADS) 3. 協助FAE/客戶解決硬體問題
  • PCIe MAC 系統研發工程師

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 2~3年工作經驗
    負責PCIe MAC/PHY系統開發,包括軟體/韌體設計、IC功能驗證、系統效能優化、軟體驅動程式/SDK及客戶支援(熟悉架構、軟韌體、除錯、優化及測試相關工作) •開發PCIe Linux或嵌入式作業系統驅動程式 •開發自動化驗證(使用C, C++, Python) •與類比/數位團隊合作,從原型設計到量產共同開發晶片 •協助客戶設計導入並支援量產
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  • 資深電源管理系統架構工程師

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 6~7年工作經驗
    1. 平台電源管理系統架構設計與規格定義, 包含功耗/溫度/性能等系統分析. 2. 系統應用詳細電源需求與控制架構之分析與優化 3. 電源管理芯片規格制定與新技術之開發.
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  • 類比設計以及自動化流程開發顧問

    面議(經常性薪資達4萬元或以上) 40000元 台北市內湖區 8~9年工作經驗
    1. 高速類比電路設計 2. 類比設計以及自動化流程開發顧問
  • ASIC Implementation Engineer

    面議(經常性薪資達4萬元或以上) 新竹市東區 4~5年工作經驗
    - Logic/Physical Synthesis by using advanced optimization techniques(below N7) and generate optimized Gate Level Netlist for Timing, Area, Power. - Debug the timing/area/congestion issues and work with RTL & Physical designers to resolve them. - Run Formal Verification checks between RTL and Gate level netlist and debug the aborts, inconclusive and Logic Equivalency failures. - DFT insertion, ATPG and gate-level simulation - Developing Automation scripts and Methodology for all FE-tools including (Lint, CDC, RDC, Synthesis, STA, Power). - Interact with Physical Design Engineers and provide them with timing/congestion feedback.
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  • DFT Engineer for Advance Process Node & Package Technology

    面議(經常性薪資達4萬元或以上) 新竹市東區 4~5年工作經驗
    1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek: * Scan chain insertion & ATPG pattern generation * Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.) * Diagnosis to help manufacture process improvement 2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC: * PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation * Develop & integrate DFT-related RTL design modules to test chip
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  • <Data center>System Architect Design Engineer

    面議(經常性薪資達4萬元或以上) 新竹市東區 4~5年工作經驗
    1. Responsible for high-speed UCIE development, including architecture definition, verification, and customer support (familiar with architecture, firmware, debugging, optimization, and testing tasks). 2. Define architecture and specifications through simulations. ( Matlab ) 3. Develop test automation. 4. Collaborate with the team to establish system prototypes and optimize performance. 5. Achieve product integration for clients and support mass production.
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  • <Automotive>SoC Interconnect Architect, Designer, and Methodology Developer

    面議(經常性薪資達4萬元或以上) 新竹市東區 4~5年工作經驗
    We are seeking skilled engineers for designing high-performance Virtualization and Interconnect Architecture and developing RTL for both Automotive and High-Performance Computing. Roles: 1. Develop, assess, and refine RTL to achieve performance, power, area, and timing goals. 2. Develop micro-architecture by exploring early high-level macro architectures, researching micro-architecture, and defining detailed specifications. 3. Coordinate co-design efforts between architecture, software, and hardware teams to achieve functional realization. 4. Develop and implement interconnect methodologies, such as simulation, emulation, implementation, and efficiency improvement.
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