轉職熱搜工作

1. CPU system design and performance analysis 2. System bus architecture and integration 3. IP and system verification 4. Debug Architecture related IP design and integration

1. Responsible for high-speed UCIE development, including architecture definition, verification, and customer support (familiar with architecture, firmware, debugging, optimization, and testing tasks). 2. Define architecture and specifications through simulations. ( Matlab ) 3. Develop test automation. 4. Collaborate with the team to establish system prototypes and optimize performance. 5. Achieve product integration for clients and support mass production.

1. Familiar with HSIO spec (PCIE, USB, UFS, DP, ...etc) and system usage scenario 2. Familiar with Windows and Android OS 3. Experienced with PC south bridge design 4. Experienced with PC USB host chipset design

1. USB4 Controller Development 2. Short term =＞ Improve current design quality of USB4 controller 3. Long term =＞ Next gen USB4 controller architecture define and implementation

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=19476&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Supervise the DTP quality performance to ensure customer-satisfactory design services. 2. Maintain DTP quality certification and automotive certification through quality guidance and audits. 3. Enhance DTP quality procedures from a technical perspective, covering the process from upstream to downstream. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1. Architecture design and RTL implementation for Smartphone and automotive chip 2. Smartphone SoC and mobile computing platform design. 3. System bus and high speed interface designs

1. 部門技術管理與技術支援與解決問題 2. 負責產品開發/電子迴路開發 3. 與廠商訂定IC與電子零件開發需求 4. 與客戶進行技術簡報與產品新需求開發 5.客訴處理

We are seeking skilled engineers for designing high-performance Virtualization and Interconnect Architecture and developing RTL for both Automotive and High-Performance Computing. Roles: 1. Develop, assess, and refine RTL to achieve performance, power, area, and timing goals. 2. Develop micro-architecture by exploring early high-level macro architectures, researching micro-architecture, and defining detailed specifications. 3. Coordinate co-design efforts between architecture, software, and hardware teams to achieve functional realization. 4. Develop and implement interconnect methodologies, such as simulation, emulation, implementation, and efficiency improvement.

1. Define power states and management hardware architecture for optimal power performance. 2. Design microprocessor-based power management controller and HW assistance designs. 3. Define power architecture by performing power rail tradeoff analysis with adaptive voltage scaling consideration