轉職熱搜工作

1. 新產品設計開發測試及相關研發工作。 2. 熟悉散熱產品加工製程與工藝,做可量產性評估。 3. 配合業務拜訪客戶與客戶討論具體解熱設計方案。 4. 能獨立配合客戶進行專案開發作業;生產端的溝通檢討與問題排除。

1. 負責各類型空水冷散熱產品設計與優化 2. 藉由熱流分析及實驗驗證確保性能符合客戶需求 3. 與客戶及廠商即時溝通, 提供完整散熱方案 ※年底辦公室會遷至新北市五股

1.主要負責風扇機構設計 2.需熟AUTOCAD 與 PRO/E 2D/3D軟體應用 3.工作性質開發新專案與創新研發設計 4熟CAE Design 模擬軟體尤佳.(如 ANSYS_Fluent. Structural Analysis . Injection Molding Analysis.)

【工作內容】 1.產品機構開發、設計 2.產品雛樣設計、打樣，量產釋出前的問題分析對策評估 3.配合專案進行產品相關量測及儀器操作分析及改善

1.NB/DT產品的 Power 設計方案建議以及研討。 2.Power零件建議以及線路 Review. 3.進行Power的 Layout Placement and Traces Routing review. 4.需跨單位(如 EE/ME/RF/Thermal..)進行專業溝通以及合作. 5.新機種的RFQ proposal撰寫以及現場報告。

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for high-performance computing. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1. 根據專案規格, 制訂測試計劃與執行 2. 電子與電源硬體功能驗證測試、分析與製作測試報告 3. 環境可靠度實驗執行、分析與製作測試報告 4. 與開發端設計者如EE、Power、Thermal等合作, 驗證與解決設計問題 5. 參與專案開發會議與整合測試部門進度與報告 6. 回報測試進度與提供報告給客戶