轉職熱搜工作

1.高效冷凍空調機電系統設計與開發 2.高效冷凍空調機電系統整合與效能驗證 3.低碳冷媒冷凍空調機電系統開發 4.熱管理模組開之設計、模擬、整合與驗證

CAE模擬、資料庫分析與預測模型生成 1.執行模擬如多體動力學、有限元素(結構或熱傳) 2.機器學習與預測模型建立 3.數據分析策略與框架建構 4.應用CAE模擬結果與量測數據生成預測模型 5.產出研究報告/期刊論文

1. Familiar in design for active cooling and passive cooling. 2. RFP/ RFQ thermal solution design and performance evaluation including the cost estimation. 3. According to projects to generate the document related to the thermal portion, like PTS, test plan for the thermal portion, design guide of the thermal portion. 4. Strong capability of thermal model building and running the thermal simulation by flotherm and icepak. 5. New technology research and study in thermal fields.

【Job Description】 1. 5-years+ experience on thermal system optimization, and manager experience on thermal team. Familiar with highly goal oriented simulation tools. (E.g. Anasys and Flotherm, preferred Flotherm.) 2. Developing, verifying and validation for smart device thermal systems, and co-work with HW, ME, for physical thermal solution design. As well as working with software team for thermal mitigation plan for products. 3. Integrating with multi-objective optimization, analysis and visualization of the entire product design space. Establishing ling-term collaboration with customers, so that we can thoroughly understand their research and needs and can be most productive in minimizing the time to market for new design. 【Core Responsibilities】 1. Leading thermal team to fulfill customer/products thermal optimization, requirements, and research needs. 2. Analyzing heats transfer and energy conversion components and systems including, but not limited to, thermal optimization on portable devices, e.g. mobile phone, tablet; smart watch, and smart speaker; IOT devices and related applications. 3. Utilize in-house, commercial, and custom developed software to provide customer thermal optimization solutions. 4. Develop, review and edit project reports, and report to customers. 5. Assist with developing proposals and new business leads. 6. Maintain and grow existing customer contact and relations.

1. CDU與機櫃解熱方案設計 (CDU and rack thermal solution design) 2. 專案在熱對策部分的執行與驗證 (Project execution and validation of thermal related portion) 3. 帶領小組成員專案執行與管理彙報 (Team member leading, project execution and manegement) 4. 開發新技術 (New technology research and study in thermal fields.) 5. 專案週期管理 (Project Mileston control)

1. Lead cross-functional development of L11 rack-level and CDU projects, including coordination of L12 data center integration and management. Candidates must demonstrate deep familiarity with L11/ L12 data center infrastructure design standards and deployment best practices. 2. Architect and optimize thermal solutions at the L11 rack level, encompassing both air-cooled and liquid-cooled configurations. Proven experience in balancing performance, reliability, and manufacturability is essential. 3. Drive the design and development of CDU systems supporting both air and liquid cooling technologies. Candidates should have hands-on experience in component selection, system validation, and supplier collaboration. 4. Next gen innovation in thermal and mechanical technologies. 5. Well team leading and lab management skill.

1. Develop and execute ATE and FCT testing plans for LAN switch products 2. Simulate network protocols such as LLDP, PoE, STP for test coverage 3. Lead pre-compliance testing for RF/EMC 4. Perform thermal, conducted/radiated EMI, and reliability testing

Founded in 2018, we‘re a Silicon-Valley based startup company aiming to revolutionize the touch user interface with our 3D Touch technology, and with this we could transform any surface into a “user interface” that dramatically change how human interact with technology. The company is funded by well-known company such as Sony, Bosch and Asahi Kasai, as well as several prestigious VCs in Silicon Valley. We‘re executing on a rigorously mapped vision, and we‘re looking for an enthusiastic contributor to take on an important role in organization. UltraSense Systems is looking for an experienced and skilled Automotive Qualification and Reliability Engineering leader. This candidate is responsible for defining, planning, and executing reliability validation activities for electronic modules used in automotive applications. This role ensures that product design and manufacturing processes meet the reliability requirements of automotive OEM and Tier-1 customers, in compliance with AECQ100, ISO16750, and customer-specific standards. Key Responsibilities: 1. Develop and execute module-level reliability validation plans (DVP&R) according to customer and industry standards (e.g., AEC-Q100/Q102/Q104, ISO 16750, IEC 60068) 2. Define reliability test matrix, sample size, stress levels, and acceptance criteria based on DFMEA and customer requirements 3. Coordinate design validation (DV) and production validation (PV) test activities with OEM or external testing partners 4. Perform failure analysis (FA) and root cause investigation on failed samples using techniques such as X-ray, SEM/EDX, cross-section, or thermal imaging 5. Collaborate with design, mechanical, and manufacturing teams to implement corrective and preventive actions (CAPA) for reliability issues 6. Ensure reliability documentation aligns with IATF 16949, APQP, and PPAP requirements. 7. Support customer reliability audits and respond to reliability-related technical questions or findings 8. Track and report reliability metrics, trends, and improvement actions across projects. Qualifications: Bachelor‘s or Master‘s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field. 3–7 years of experience in reliability, validation, or quality engineering within automotive, electronics, or semiconductor industries. Familiarity with automotive reliability standards such as: AEC-Q100 / Q102 / Q104 ISO 16750 (electrical and environmental stress) LV124, LV214 (for European OEMs) JESD22 series (JEDEC) Hands-on experience with environmental, mechanical, and electrical stress tests, e.g.: Thermal cycling, temperature/humidity bias (THB), vibration, mechanical shock, power cycling, ESD, etc. Knowledge of failure analysis tools and methods. Understanding of DFMEA, DVP&R, APQP, and PPAP processes. Strong analytical and communication skills; ability to work cross-functionally and interface with customers. Preferred Skills (Plus): Experience with automotive touch module, display, or camera systems. Knowledge of statistical tools (Minitab, JMP) for reliability data analysis (Weibull, lognormal). Familiar with supplier reliability management and component qualification. Certified Reliability Engineer (CRE) or equivalent certification is an advantage.

1. Develop 3.5D methodology from RTL to GDS and Package 2. Coordinate Thermal and PI/SI team to deal with high power design 3. Execute the project at different phases

1. 專案管理與團隊領導：主導 Notebook 專案開發流程（從概念到量產），控管開發時程（NPI Schedule）與設計品質。 2. 技術審核與風險控管：負責機構設計之關鍵審核（Technical Gatekeeping），針對轉軸、窄邊框、結構強度等高風險領域進行預判與防堵。 3. 跨部門協作與溝通：擔任技術決策核心，協調 ID、EE、Thermal 及 PM，解決系統配置與設計衝突。 4. 供應商管理與成本控制：管理模具 NRE 與零件單價，主導新製程（如 RHCM、鎂合金壓鑄）的供應商開發與量產良率談判。 5. 流程優化與人才培訓：導入 AI 與自動化設計工具，負責團隊績效考核、技術傳承（Lessons Learned）與新人指導。 ※依學經歷、工作年資敘薪