轉職熱搜工作

1.以數值方法進行旋轉機械與微波加熱相關之流場與熱傳模擬分析。 2.撰寫與彙整模擬分析結果之技術文件與報告。 3.其他臨時交辦事項

邀請加入國內最高標準的熱學與溫度計量技術團隊，共同維持國家溫度標準、發展關鍵量測技術，支援先進產業與科研應用。 1. 負責國家溫度標準之實現與追溯維持 2. 溫度校正與測試工作之規劃與執行 3. 先進熱學與溫度量測技術之研發與驗證 4. 熱學與溫度感測技術於先進產業製程之整合與應用

1. 領導Team member工作方向，提升小組士氣與維護和諧氣氛 2. 完成部級主管交代工作事項，與傳達訊息宣導事項 3. 新人訓練，建立共享資源，提升小組技術能力 4. 定期會議Review專案狀況，並適時提供建議引導小組解決問題 5. 與客戶端溝主要通窗口，有能力決定關鍵性參數，解決專案問題

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for high-performance computing. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1. Familiar to 2.5D or 3D PKG integration & development & mass production experience 2. From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration

工業技術研究院綠能所產業節能服務室招聘『工業節能診斷及應用技術研究員』，成為國內最完整具節電與節熱技術整合與實務經驗之團隊！，主要負責以下四項工作： 1. 節能技術研析：蒐集國內外節能技術最新發展資訊，研析國際先進工業節能技術與典範案例，以支援政府制定能源政策和產業節能方案規劃。 2. 工廠節能診斷服務：提供提供國內工業用戶節能技術輔導與評估提升設備效率服務，協助企業節能診斷，並提出具體可行的節能改善方案。 3. 能源法規之符合性稽查：執行工業能源用戶應遵守能源法規之稽核與管理。 4. ISO 50001輔導：協助企業建立ISO 50001能源管理系統，透過監測和評估節能行動的成效，以持續提升整體能源績效。