轉職熱搜工作

*公司介紹: 外商公司已有165年歷史 於1971年進入台灣,為第一家在台灣設立LCD玻璃基板工廠並製造的供應商，在台中中部科學園區和台南科學園區建立了最現代、最高效率的生產工廠,提供市場領先技術製造高品質LCD玻璃基板. 工作內容 1. 機械背景,冷凍空調科系,希望有半導體廠/無塵室經驗 2. 廠內因切割玻璃產生的粉塵,進行空氣汙染的優化 3. 和不同的工程段合作,進行環境優化 4. 需要進入無塵室工作, 約占20％ 5. 帶領廠商做工程, 要有控廠/跟催工程進度的能力 6. 三年以上晶圓廠建廠或運轉經驗 7. 疫情穩定後,可能需要出差, 海外出差比列約15％, 但若需要隔離,就會以台灣為主, 屆時會依疫情狀況調整 8. 英文中等程度 9. 有AutoCAD or SolidWorks經驗,可以reviewing drawings and models加分 Scope of position: • Work with BOD (Bottom of drawing), Finishing, Inspection, and Packaging process areas for environmental optimization. • Work with expansion, rebuild, construction teams for new HVAC design and better enclosure capability. • Lead process change for quality improvement in Division-wide. • Define/refine base case of finishing attributes for process optimization improvement. • Review and analyze process data, performance, product data and respond to the result. • Plan, execute, tracking and document experimental design. • On site supervisor with external vendor and watch out the safety rule. Education and Experience: • BS Engineering degree. • HVAC or Semiconductor cleanroom operation equivalent experiences. • 3 years work experiences. • Construction experiences of HVAC or Semiconductor cleanroom. Required skills: • Cleanroom operation experience, skill and knowledge • Experiment design and data analysis skill • Project management skill. • Teamwork and communication skill. • Ability to work in different regions. • Mange external vendor. • English communication in written and verbal Desired skills: • HVAC design for class 10 Cleanroom system including MEP system. • Experience with cleanness control in multi-process production Fab. • Experience with AutoCAD or SolidWorks - capable of reviewing drawings and models • Experience in DMAIC methodology and 6-sigma project. • Use simple statistical tools and Designed Experiments (DOE) in process problem solving. • Thermal and fluid dynamics knowledge background - capable of reviewing the design calculation. • High level Excel using. • Chemistry-related knowledge. Soft skills: • Logical thinking for problem solving • Cross-cultural sensitivity. • Report and presentation skill. • Excellent communication and interpersonal skills, planning and organizing, building cross functional relationship. • Patience and perseverance. • Adapt to changing and fast-paced work. • Agile resilience. • Handle and arrange multiple tasks at the same time

Thermal Department Leader [工作內容] Ø 5-years+ experience on thermal system optimization, and manager experience on thermal team. Familiar with highly goal oriented simulation tools. (E.g. Ansys Icepak) Ø Developing, verifying and validation for smart device thermal systems, and co-work with HW, ME, for physical thermal solution design. As well as working with software team for thermal mitigation plan for products. Ø Integrating with multi-objective optimization, analysis and visualization of the entire product design space. Establishing ling-term collaboration with customers, so that we can thoroughly understand their research and needs and can be most productive in minimizing the time to market for new design. Ø Leading thermal team to fulfill customer/products thermal optimization, requirements, and research needs. Ø Analyzing heats transfer and energy conversion components and systems including, but not limited to, thermal optimization on portable devices, e.g. mobile phone, tablet; smart watch, and smart speaker; IOT devices and related applications. Ø Utilize in-house, commercial, and custom developed software to provide customer thermal optimization solutions. Ø Develop, review and edit project reports, and report to customers. Ø Assist with developing proposals and new business leads. Ø Maintain and grow existing customer contact and relations. Ø Extensive knowledge about heat transfer and energy conversion system is a must. Ø Ability to independently learn new engineering analysis tools and apply them into projects. Ø Previous research and development experience is preferred. Ø Software developing experience is requested, but not required.

大專以上機械/航空/物理/系/所畢，具10/6年以上Notebook PC或相關產品熱模組熱流設計/測試/熱事件排處經驗，具3/1年主管經驗者佳，略通英文。

伺服器熱處理(Thermal)設計經(副)理 熟悉Server熱處理(Thermal)原理及仿真分析, 俱有7年以上Server Thermal設計以及Simulation實務經驗,其中含3年以上主管經驗 大專以上電機, 機械或物理等相關科系畢業 俱備英文聽,說,讀,寫等溝通能力

*公司介紹: 外商公司已有165年歷史 於1971年進入台灣,為第一家在台灣設立LCD玻璃基板工廠並製造的供應商，在台南科學園區和台中中部科學園區建立了最現代、最高效率的生產工廠,提供市場領先技術製造高品質LCD玻璃基板. *我們正在尋找一個高度稱職的Modeling Simulation Development Engineer,未來您所會參與的工作內容如下 : Scope of Position and Day to Day Responsibilities: • Use knowledge of physics to build deep understanding of the materials and processes at CDT • Use existing tools and develop new analytical and numerical models to resolve process problems • Correlate simulation with experimental results • Support development and validation testing • Communicate results both orally and in written form of English • Protect Corning’s intellectual property by filing invention disclosures for patent application in timely fashion • Document all project findings in internal technical reports Required Skills: • Experience of using or programming in any one of the commercial software like ABAQUS, NASTRAN, ANSYS or DYNA3D • Strong foundation in physics and engineering science with programming skills • Sold Mechanics fundamental • Capability to design and plan the verification experiment for modeling • Creative/innovative problem solving via scientific or engineering methods • Results oriented and high commitment /energy • Sold Mechanics fundamental or computational fluid dynamics 參與實驗設計、計畫、執行 負責模擬分析 使用電腦及專業軟體進行模擬，校正設定條件，讓模擬接近真實情境 擅長使用工具:ABAQUS、C++、Java、Python、Pro/E 面試流程：一次面試，以視訊方式進行，一周內會得知結果

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 工作內容： 1. 協助實驗室的日常運作，測試樣品/夾具準備、測試、報告生成以及跟進，並支援先進封裝技術 2. 將負責熱機械材料測試（如：熱分析儀、萬能試驗機、剪切測試儀等）、工具/加工以及驗證電路封裝材料和加工方法 3. 熟悉ASTM、JEDEC、IPC或相關行業規範為佳 4. 了解熱機械測試方法，如：熱分析儀、萬能試驗機、剪切測試儀和工具顯微鏡等為佳。 5. 具有測試方法學或材料開發經驗尤佳。 Job Description： The position is focused on laboratory daily operation, test samples/fixture preparation, testing, report generation, and follow-up in support of advanced packaging technologies. This technician will be responsible for thermal and mechanical materials tests (ex: thermal analyzers, universal testing machines, shearing testers, etc.), tool/machining, and methodologies to validate the materials and processing of the IC package. 此職缺為派遣職，一年一簽

[南港]美商筆電品牌_硬體測試工程師 我們正在尋找對系統效能與產品品質有熱情的工程夥伴。本職務非常適合初階工程師，能在實際商用產品中，快速累積系統性工程經驗，並與資深 Thermal / Performance RD 團隊密切合作。 工作內容: 你將有機會： 1.從真實產品學工程 參與商用 Notebook / Desktop 的新產品導入（NPI）與量產支援 接觸實際出貨專案的 Thermal / Performance 測試與驗證 2.建立紮實的系統觀與實驗能力 規劃並執行 Design of Experiments（DOE） 理解效能、功耗與溫度之間的關聯 學習以數據與實驗結果進行問題分析與決策支援 3.在多專案環境中快速成長 參與 Funnel 與 Sustain 階段的多機種測試 在時程與專案節奏中培養優先順序與責任感 4.培養工程師必備的溝通能力 與 Thermal / Performance RD、專案與相關團隊協作 將測試結果轉化為清楚、有影響力的技術回饋 【Candidate Profile】 Typically 1-3 years experience. Bachelor‘s or Master‘s degree in EE/FW/SW/ME Engineering Department. Excellent analytical and problem solving skills. Excellent written and verbal communication skills; mastery in English and local language. Ability to effectively communicate project Thermal/Performance/EE/FW/SW RD

由歐洲技術輔導成立的維修中心， 專精於熱傳設備的維護保養。 我們重視每一位員工的自我成長， 同時學習團隊工作的重要性，我們提供良好的工作環境， 專業的技術團隊。 誠摯邀請優秀的朋友加入， 成為我們的工作夥伴！ 【工作內容】 1.進口熱傳設備維護保養 2.須配合外地出差 3.其他主管交付任務。 【需求條件】 1.無經驗可 2.具備汽車駕照(手排尤佳) 3.高中職以上(非相關科系可) 【工作時間】 周休六日，日班 【福利】 獎金類：年終獎金、三節獎金 保險類：員工團保 餐飲類：誤餐費 其它類：員工在職教育訓練 法定項目：勞保、健保、週休二日、特別休假、員工體檢

*此為長期派遣職缺，有意者請投遞* 【職務內容】 負責會展中心空調與機電設備之維護、管理與優化。 【主要工作】 空調系統及設備規劃、維護與管理 公文處理與採購相關作業 工程技術支援與跨部門溝通協調 【條件要求】 必備條件: 冷凍空調、電機、機械等相關科系畢業 3年以上空調或機電相關經驗 熟悉 Word、Excel、AutoCAD等 具備工程溝通與協調能力 加分條件: 具機電或空調相關證照 熟悉冰水系統或能源管理 具熱力學、流體力學基礎

產品：水冷 1. 物料管控：委外生產物料聯繫及廠內組裝物料管控，進出物料/庫存掌握。 2. 樣品排產：樣品排產時程規劃，優先度調整，出貨安排等。 3. 生產工具設備點檢/維護/校驗：熟悉各式工具/設備使用方式，並進行定期盤點/維護/校驗。 4. 相關請購/驗收/稅務文書：進出口/貨運/驗收/關稅等文書流程，需熟悉廠內運作模式。 5. 小量樣品製作：兼任小量生產組裝及產品檢測，大量樣品時可招募臨時工。 6. 環安/勞安/工安/消防：因應各式中央安全需求等規範或資料彙整，廢棄物處理等。 ※無經驗可，會有專業工程師主管手把手帶領。 ※新團隊建置，增聘一人，非離職補缺。 預計6月或7月入職