轉職熱搜工作

1. 鋁陽極製程生產 2. 製程優化, 藥水配方控制, 參數調整 3. 產品異常分析與品質改善對策 4. 陽極製程問題確認並排除與回報 5. 陽極製程問題分析與解決驗證 6. 其他主管交辦事項

We are looking for a Hardware Engineering Manager to lead and grow a high-calibre team responsible for the design, validation, and production introduction of Peplink’s next-generation routers, access points, and connectivity appliances. You will own the full hardware lifecycle from concept through mass production, drive cross-functional execution with firmware, mechanical, and manufacturing teams, and directly influence product roadmap decisions. This is a hands-on leadership role: we need someone who can review schematics, debug board bring-up issues, and also build a world-class engineering culture. Key Responsibilities 1) Lead, mentor, and grow a team of hardware engineers across board design, RF, power, and signal integrity disciplines. 2) Own the end-to-end hardware development process: architecture definition, schematic and layout review, prototype build, DVT/PVT, and manufacturing handoff. 3) Drive aggressive development cycle targets (12-month concept-to-production) by removing blockers, improving tooling, and optimising team workflows. 4) Collaborate closely with firmware, product management, and industrial design teams to define product requirements and resolve cross-domain trade-offs. 5) Manage relationships with contract manufacturers, component suppliers, and test houses; lead design-for-manufacturing (DFM) and design-for-test (DFT) reviews. 6) Establish and enforce design standards for high-speed digital interfaces (PCIe Gen 3/4, USB 3.x, Ethernet up to 10 GbE), cellular modem integration (4G/5G), and Wi-Fi 6E/7 RF front-ends. 7) Evaluate and integrate emerging technologies including 60 GHz mmWave radios, FPGA-based packet processing, and satellite modem interfaces. 8) Champion quality and reliability through robust HALT/HASS programmes, thermal analysis, and field-return root-cause investigations. 9) Define team hiring plans, manage budgets, and report progress to senior leadership with clear, data-driven metrics.

職責要求 1. 技術專業貢獻 • 高階設計與研發：負責設計和開發高難度或關鍵技術解決方案。 • 問題解決：處理技術上複雜或緊急的問題，提供指導性解決方案。 • 技術創新：推動新技術的採用和創新產品的開發。 2. 指導與培訓 • 技術指導：為初級或中級工程師提供技術建議，解答疑問。 • 知識分享：舉辦技術培訓，促進團隊的專業能力提升。 • 項目帶領：在項目中起到技術帶頭作用，指導團隊完成目標。 3. 項目參與與管理 • 技術規劃：參與技術方案的制定，確保其可行性和效率。 • 質量控制：審核設計和測試結果，確保技術成果符合質量標準。 • 交付管理：協調技術資源，確保按時完成項目交付。 4. 跨部門合作 • 需求分析：與客戶或產品經理溝通，準確理解需求。 • 資源協調：與其他部門協作，確保技術需求與業務目標一致。 • 問題溝通：在項目或技術過程中，解決各部門間的問題。 任職資格 1. 教育程度: 大學, 碩士 2. 科系: 機械工程相關, 航太工程相關, 物理學相關 3. 工作經驗: (1) 機械/熱流相關領域畢業,曾經在相關領域執行專案達3~5年以上 (2) 模組散熱設計經驗,專案執行排程掌握,客戶溝通與協調,廠商進度追蹤與優化 4. 語言條件(外語): [英文] 聽: 中等, 說: 中等, 讀: 中等, 寫: 中等

職責要求 1. Familiar in design for active cooling and passive cooling. 2. RFP/ RFQ thermal solution design and performance evaluation including the cost estimation. 3. According to projects to generate the document related to the thermal portion, like PTS, test plan for the thermal portion, design guide of the thermal portion. 4. Strong capability of thermal model building and running the thermal simulation by flotherm and icepak. 5. New technology research and study in thermal fields. 任職資格 1. Be well-managed the multi-task. 2. Familiar in problem solving for cross functions. 3. Good domain knowledge in electrical component parts. 4. Experienced in using test facilities to do the thermal test, like data logger, thermometer, thermocouple attached and thermal chambers. 5. Excellent presentation skill in English and Mandarin. 6. Farmilar in icepak and flotherm.

職責要求 1.系統散熱與噪音設計(System Thermal and Acoustic Design) 2.專案在散熱部分的執行(Project execution on thermal related portion) 3.散熱驗證(Thermal validation) 4.開發新技術(Develop new thermal technology) 任職資格 1.伺服器散熱研發經驗：設計主任需具備5年以上 ；設計經理需具備8年以上 2.需具備實際測試驗證系統散熱經驗 3.熟悉散熱元件,如HS,風扇的製程與設計 4.需具備專案文件撰寫及英文簡報製作能力

1.智慧型手機系統開發,生產及驗證 2.FPGA 系統開發,生產及驗證 3.產出平台使用手冊 4.處理內外客戶的技術問題，視情形需要現場支持

1. 企業/家用WIFI AP路由器 開發經驗者尤佳 2. 高速介面應用, 驗證及除錯 e.g. USB, PCIe, xGMII, Ethernet, DDR 3. 802.11 a/b/g/n/ac/ax/be WiFi SoC及Ethernet SoC驗證, 公板設計及驗證 4. Power/Thermal/EMI 防治對策 5. 支持客戶應用及量產導入 6. 熟悉HW設計的TOOL 如OrCAD, PADS, Allegro

Develop advanced package technologies for MediaTek‘s HPC business

職責要求 量產測試策略與規格制定 • 建立並維運 EML / EEL 雷射量產測試流程與規格（含 bar level 與 die level） • 定義產品量測條件（bias、溫度、功率、耦合方式、測試順序）與允收判定 • 建立量產測試資料規範（traceability、sampling plan、SPC/CPK）與異常處理機制 Bar Tester 量產測試系統與導入 • 主導 bar tester 之量產導入、機台規格評估、UPH 提升與測試時間最佳化 • 確保 bar-level 測試可支援高產能需求，並兼顧測試一致性與可靠性 • 規劃與改善 probe / chuck / thermal control / alignment 等關鍵測試模組 電學與光學量測（核心必備） • 熟悉基本電學量測並可判讀結果： 測試程式與自動化能力 • 具備 C 語言能力，可用於測試控制、資料處理、演算法或儀器通訊整合 • 熟悉 LabVIEW，可支援自動化測試系統開發、維護與debug • 熟悉測試儀器控制與資料整合（例如 SMU、OSA、power meter、thermal controller 等） 良率 / 成本 / 產能改善（Yield & Cost & UPH） • 透過測試資料分析推動良率改善與成本下降（降低 retest、減少 false reject/escape） • 建立量產測試的 DOE、GR&R、MSA 與校驗制度 • 推動 station balance、瓶頸改善與 24hr line stability（含夜班品質一致性） 量產工廠與團隊管理 • 管理測試工程與產線團隊，建立 24 小時運作所需的班別制度與管理流程 • 與製程、設備、品質、製造、NPI、客戶工程團隊合作，快速收斂問題 • 定期對內部與客戶提供量產狀態報告（yield、capacity、quality metrics） 任職資格 • 5 年以上光電半導體或光通訊產業經驗，具 雷射元件量產測試經驗者優先 • 熟悉 InP-based EML / EEL 或高速光通訊雷射相關產品 • 具備 bar level / wafer level / die level 測試觀念與實務經驗 • 具備基本電學與光學測試能力，必須能執行並判讀：IV Curve（I-V）、Near field / Far field、Optical Spectrum Analyzer / Optical Spectrum Meter • 具備測試自動化與程式能力：C 語言（必要）、LabVIEW（必要） • 具跨部門溝通能力，可帶領團隊解決量產問題並推動改善 • 能以英文進行基本技術溝通、測試報告與客戶對談

職責要求 1. Plan and configure energy storage systems for various application scenarios, including: A. High-voltage battery packs and related components B. PCS, DC/DC converters, and high-voltage distribution equipment C. High-voltage safety and protection devices, such as contactors, fuses, and circuit breakers D. Thermal management solutions for optimal system performance. 2. Select and validate key components (e.g., PCS, DC/DC converters, switchgear, protection devices, and cable specifications) based on project requirements and grid codes. 3. Create and review wiring diagrams and single-line diagrams to ensure compliance with power system standards and safety regulations. 4. Collaborate with hardware and software teams to ensure compatibility and communication between EMS, BMS, PCS, and DCDC using protocols such as Modbus, CAN, and Ethernet. 5. Ensure compliance with regulatory standards for power grid integration, including grid codes and EMI/EMC regulations. 6. Provide on-site technical support and troubleshooting, including system commissioning, grid-connection testing, and functional verification. 7. Prepare technical documentation, including wiring diagrams, planning reports, and installation manuals, and assist with project acceptance testing. 任職資格 1. Master’s degree in Electrical Engineering, Electronics Engineering, or a related field. 2. Experience in integrating ESS components (BESS, PCS, EMS) into grid-connected or microgrid systems. 3. Proficiency in reading and creating single-line diagrams, wiring diagrams, and electrical schematics; experience with design tools (e.g., AutoCAD, EPLAN) is a plus. 4. Knowledge of power system integration concepts, including grid synchronization, reactive power