轉職熱搜工作

1.負責產品機構設計與結構評估。 2.負責產品外型與包裝設計。 3.負責機構材料的測試與選用。 4.繪製機構設計圖面。 5.負責模具設計、開模、試模，並檢討、修改模具。 6.風扇散熱產品機構設計（資訊產品.汽車.伺服器.消費性電子.工業用等風扇散熱機構設計） 7.熱傳模擬設計與測試 8.熟塑膠件佳

We are looking for a Hardware Engineering Manager to lead and grow a high-calibre team responsible for the design, validation, and production introduction of Peplink’s next-generation routers, access points, and connectivity appliances. You will own the full hardware lifecycle from concept through mass production, drive cross-functional execution with firmware, mechanical, and manufacturing teams, and directly influence product roadmap decisions. This is a hands-on leadership role: we need someone who can review schematics, debug board bring-up issues, and also build a world-class engineering culture. Key Responsibilities 1) Lead, mentor, and grow a team of hardware engineers across board design, RF, power, and signal integrity disciplines. 2) Own the end-to-end hardware development process: architecture definition, schematic and layout review, prototype build, DVT/PVT, and manufacturing handoff. 3) Drive aggressive development cycle targets (12-month concept-to-production) by removing blockers, improving tooling, and optimising team workflows. 4) Collaborate closely with firmware, product management, and industrial design teams to define product requirements and resolve cross-domain trade-offs. 5) Manage relationships with contract manufacturers, component suppliers, and test houses; lead design-for-manufacturing (DFM) and design-for-test (DFT) reviews. 6) Establish and enforce design standards for high-speed digital interfaces (PCIe Gen 3/4, USB 3.x, Ethernet up to 10 GbE), cellular modem integration (4G/5G), and Wi-Fi 6E/7 RF front-ends. 7) Evaluate and integrate emerging technologies including 60 GHz mmWave radios, FPGA-based packet processing, and satellite modem interfaces. 8) Champion quality and reliability through robust HALT/HASS programmes, thermal analysis, and field-return root-cause investigations. 9) Define team hiring plans, manage budgets, and report progress to senior leadership with clear, data-driven metrics.

1. 使用CAD軟體或SOLIDWORK，進行機械設備的設計、繪製、及配置規劃。 2. 管理與整理設計圖檔，建立系統化的圖檔分類與存檔流程。 3. 根據規格分析產品需求，確保設計符合法規、標準及客戶要求。 4. 進行產品設計檢討和修改，解決設計過程中的技術性問題。 5. 選型與分析熱交換器，執行性能評估與技術優化。 6. 與客戶溝通設計進程，提供技術建議以滿足客戶需求。 7. 協調各部門處理製造規格問題，確保生產計劃順利完成。 8. 撰寫技術報告，記錄設計進度與分析結果以便後續參考。 9.主管交辦事項。

1.負責液冷與氣冷設備安裝、基本設定與測試 2.協助設備日常維護與異常排除 3.配合產線進行設備調整與優化 4.協助新設備導入與測試作業 5.紀錄測試結果並回報狀況

1. 產品外觀與組裝設計 2. 繪製組裝治具設計圖 3. PFMEA工程規格/技術文件撰寫 4. 與其他單位溝通協調整合技術開發工作 5. 組裝工段RFQ 報價評估 6. 須配合出差，出差時長一年約90~180天

1. 與開發團隊, 針對客戶需求與供應商進行Server/Rack機櫃機構系統散熱設計 2. 産品開發過程與各Function team進行Server/Rack機櫃機構系統散熱噪音設計檢討與改善 3. 量產前後與工廠和供應商檢討量產問題分析與問題改善 4. 前後代産品散熱噪音細部設計優化與校能增進

〝1.Thermal design and measurement of server, storage and edge server projects 2.Cross functional collaboration and communication 3.Supplier management of thermal parts 4.Advanced thermal solution study〝

1. 針對客戶需求與供應商進行AI Server/Rack機櫃散熱設計(氣冷及液冷) 2. 主導或參與液冷技術的導入，包括 CDU、manifold、coldplate和QD整合 3. 積極與function team保持密切合作 ，確保系統能在高附載下穩定運作 4. 量產前後與工廠和供應商檢討量產問題分析與問題改善

1.AI PC系統散熱設計、風扇控制與噪音管理。 2.系統模擬分析、系統熱區分析、氣流場分析與流道設計。 3.系統散熱模組單體設計規格制訂、性能及可靠度驗證方法設置、issue debug等。 4.系統Thermal & Acoustic測試規劃

產品：筆電 1. 主要負責風扇機構,流場和扇葉設計, 並需組裝Mockup樣品及測試. 2. 需與客戶、廠商及廠內各部門人員有效率溝通, 獨當一面作業能力. 3. 產品應用及分析能力.