轉職熱搜工作

業技術研究院綠能所高速流機研究室誠徵資訊系統研發工程師，肩負重要使命。本職主要工作任務如下： 1.負責冷暖空調資訊系統之全生命週期管理，包含系統架構設計、開發、及持續維運 2.協助支援並維護既有冷暖空調資訊系統，支援運算系統模組、資料介面與部署設計等相關技術課題 3.主導多租戶管理架構、前後端混合模式等關鍵技術之研發，以期提升系統彈性與可擴充性 4.整合軟體與硬體資源，打造具備高度可靠性與前瞻性的冷暖空調服務系統

研發項目包括： 1.冷凍空調系統熱流分析及熱管理 2.熱交換器、冷凍空調系統設計與性能測試 3.伺服器或電子散熱 4.冷凍空調設備環境之氣流模擬分析

1.高效冷凍空調機電系統設計與開發 2.高效冷凍空調機電系統整合與效能驗證 3.低碳冷媒冷凍空調機電系統開發 4.熱管理模組開之設計、模擬、整合與驗證

1. 協助使用繪圖工具或電腦輔助設計（CAD）或草擬設備和軟體，協助製圖員設計新研發產品的架構。 2. 協助操作及維護機械產品、設備、系統與程序，以符合要求。 3. 協助執行機械相關研發工作（如：應力分析、機構、振動、熱傳、冷凍、噪音、流力、固力、動力學等）。 4. 協助測試、檢測與分析設備、組件和系統之可行性、設計、操作和性能表現。 5. 協助研究和分析客戶設計規劃、產品規格、說明書等資料，以評估可行性、費用及維修需求。 6. 協助工程產品測試及驗證，並紀錄測試結果，彙整且提出測試報告。

1. Design and test for related thermal function and create fan curve to fit acoustic spec. 2. Communicate all thermal-related information with suppliers, internal teams and customers. 3. Provide thermal report.

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

1. 負責CDU水冷機構設計，負責板金零件/管路零件/電線走線規劃等 3D繪製與2D出圖，材料選用，BOM表整理 2 與供應商溝通合作，確認零件可量產性以及成本最佳化 3 樣品組裝與測試，參與試產並分析與解決試產問題點並提出改善計劃。 4. 完成主管交辦事項

1.散熱模組設計(Server NB )、製圖、打樣、測試 2.專案進度追踨，並與客戶、製造團隊應對協調 3.實驗設計，分析數據與改善對策，並執行新技術開發 4.模擬軟體的分析使用(Ansys Workbench, FLUENT…等)

歡迎想要踏入水冷領域的人一起加入! 只要有心學，我們有專業的團隊可以手把手帶領～ 1. 負責水泵產品的機構設計，參與新產品研發與開發驗證 2. 負責樣品製作，並執行性能實測，針對結果以及問題點進行分析並改善 3. 與客戶以及業務進行溝通，瞭解系統所需水泵性能條件 4. 負責解決試產製造及製程中的相關問題，並提出改善計畫 5. 完成主管交辦事項

【工作內容】 1.負責風扇機構設計 2.專案與客委案開發與管理 3.協助產品性能測試及提出設計改善與優化對策 4.客訴問題分析改善處理 5.參與產品試作試產作業 6.協助其他工程師研發設計工作 7.其他主管交辦事項 ※熟CAE Design 模擬軟體佳.(如 ANSYS_Fluent. Structural Analysis . Injection Molding Analysis.)