轉職熱搜工作

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for high-performance computing. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1.航太熱處理製程相關改善與優化 2.配合新材料測試並協助進行製程改善與開發 3.構想實驗計畫並驗證 4.與產線溝通和協調製程相關事項 5.航太規範審查/研讀 (AMS、ASTM國際規範；客戶規範) 6.主管交辦事項

職責要求 1. 技術專業貢獻 • 高階設計與研發：負責設計和開發高難度或關鍵技術解決方案。 • 問題解決：處理技術上複雜或緊急的問題，提供指導性解決方案。 • 技術創新：推動新技術的採用和創新產品的開發。 2. 指導與培訓 • 技術指導：為初級或中級工程師提供技術建議，解答疑問。 • 知識分享：舉辦技術培訓，促進團隊的專業能力提升。 • 項目帶領：在項目中起到技術帶頭作用，指導團隊完成目標。 3. 項目參與與管理 • 技術規劃：參與技術方案的制定，確保其可行性和效率。 • 質量控制：審核設計和測試結果，確保技術成果符合質量標準。 • 交付管理：協調技術資源，確保按時完成項目交付。 4. 跨部門合作 • 需求分析：與客戶或產品經理溝通，準確理解需求。 • 資源協調：與其他部門協作，確保技術需求與業務目標一致。 • 問題溝通：在項目或技術過程中，解決各部門間的問題。 任職資格 1. 教育程度: 大學, 碩士 2. 科系: 機械工程相關, 航太工程相關, 物理學相關 3. 工作經驗: (1) 機械/熱流相關領域畢業,曾經在相關領域執行專案達3~5年以上 (2) 模組散熱設計經驗,專案執行排程掌握,客戶溝通與協調,廠商進度追蹤與優化 4. 語言條件(外語): [英文] 聽: 中等, 說: 中等, 讀: 中等, 寫: 中等

職責要求 1. Familiar in design for active cooling and passive cooling. 2. RFP/ RFQ thermal solution design and performance evaluation including the cost estimation. 3. According to projects to generate the document related to the thermal portion, like PTS, test plan for the thermal portion, design guide of the thermal portion. 4. Strong capability of thermal model building and running the thermal simulation by flotherm and icepak. 5. New technology research and study in thermal fields. 任職資格 1. Be well-managed the multi-task. 2. Familiar in problem solving for cross functions. 3. Good domain knowledge in electrical component parts. 4. Experienced in using test facilities to do the thermal test, like data logger, thermometer, thermocouple attached and thermal chambers. 5. Excellent presentation skill in English and Mandarin. 6. Farmilar in icepak and flotherm.

職責要求 1.系統散熱與噪音設計(System Thermal and Acoustic Design) 2.專案在散熱部分的執行(Project execution on thermal related portion) 3.散熱驗證(Thermal validation) 4.開發新技術(Develop new thermal technology) 任職資格 1.伺服器散熱研發經驗：設計主任需具備5年以上 ；設計經理需具備8年以上 2.需具備實際測試驗證系統散熱經驗 3.熟悉散熱元件,如HS,風扇的製程與設計 4.需具備專案文件撰寫及英文簡報製作能力

在手機SoC平台上分析及優化遊戲性能，具備以下相關工作經驗尤佳： 1. 嵌入式系統的效能、功耗或Thermal溫控分析優化 2. 手機遊戲性能功耗優化或遊戲引擎技術開發優化 主要工作內容： • 從遊戲行為分析遊戲性能瓶頸及功耗組成，並透過優化平台軟體調控技術，達到提升Mediatek平台的遊戲體驗的目標 • 與遊戲工作室合作，透過遊戲行為分析，建議工作室遊戲體驗優化方法 • 透過軟體調教，協助Mediatek及客戶達成遊戲性能功耗的產品目標

聯發科提供涵蓋各式裝置的完整晶片組解決方案，包括智慧型手機、平板、電腦等。晶片的高功耗效率與高效能是其價值的關鍵因素。隨著製造技術持續增進、效能需求不斷提升，開發能同時最佳化功耗與效能的解決方案至關重要，團隊將承擔這項重要責任。 • 在多元平台上開發電源與熱管理相關的軟體與韌體。 • 在多元平台上進行電源與熱管理的最佳化,效能量測(benchmark)與剖析(profiling) • 在多元平台上分析與電源、熱相關的問題。

8+ years experiences in IC Advance Package Design such as 3DIC Development, ASIC (APR) design, flow development, and EDA enablement KEY RESPONSIBILITIES: 1. Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design. 2. Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance. 3. Support package design teams in defining a tool roadmap for advanced package design. 4. Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility. 5. Represent the Package design team in customer engagements for advanced package designs.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=550&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: Apply advanced computational models to predict performance, optimize structure and doping profile, and provide improvement directions in nano-scaled device technologies. Develop and apply finite element method (FEM) modelling, including but not limited to stress simulations, computational fluid-dynamics, thermal conductivity simulations and electromagnetic wave simulations, for both macroscopic (tool/wafer) and microscopic (discrete device) structures. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.