轉職熱搜工作

1. NB/AIO/Thin Client/Mini-DT 系統之散熱模擬 2. 設計整體系統之散熱規劃與模組設計 (CPU/VGA…) 3. 系統量測及資料分析/散熱系統控制/問題解決

先進封裝技術開發 1. 先進新產品導入技術開發 (新產片試產規劃, DRC/DRM檢驗, DOE及良率改善規劃, 量產區間及良率分析) 2. 熟悉先進chiplet及3DIC封裝技術開發 3. 晶圓級與面板級先進封裝結構設計

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃，提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 ※依學經歷、工作年資敘薪

1. Familiar in design for active cooling and passive cooling. 2. RFP/ RFQ thermal solution design and performance evaluation including the cost estimation. 3. According to projects to generate the document related to the thermal portion, like PTS, test plan for the thermal portion, design guide of the thermal portion. 4. Strong capability of thermal model building and running the thermal simulation by flotherm and icepak. 5. New technology research and study in thermal fields.

1.系統散熱與噪音設計(System Thermal and Acoustic Design) 2.專案在散熱部分的執行(Project execution on thermal related portion) 3.散熱驗證(Thermal validation) 4.開發新技術(Develop new thermal technology) ※依學經歷、工作年資敘薪

1. CDU與機櫃解熱方案設計 (CDU and rack thermal solution design) 2. 專案在熱對策部分的執行與驗證 (Project execution and validation of thermal related portion) 3. 帶領小組成員專案執行與管理彙報 (Team member leading, project execution and manegement) 4. 開發新技術 (New technology research and study in thermal fields.) 5. 專案週期管理 (Project Mileston control)

integration and management. Candidates must demonstrate deep familiarity with L11/ L12 data center infrastructure design standards and deployment best practices. 2. Architect and optimize thermal solutions at the L11 rack level, encompassing both air-cooled and liquid-cooled configurations. Proven experience in balancing performance, reliability, and manufacturability is essential. 3. Drive the design and development of CDU systems supporting both air and liquid cooling technologies. Candidates should have hands-on experience in component selection, system validation, and supplier collaboration. 4. Next gen innovation in thermal and mechanical technologies. 5. Well team leading and lab management skill.

1. Develop and execute ATE and FCT testing plans for LAN switch products 2. Simulate network protocols such as LLDP, PoE, STP for test coverage 3. Lead pre-compliance testing for RF/EMC 4. Perform thermal, conducted/radiated EMI, and reliability testing

1. Familiar to 2.5D or 3D PKG integration & development & mass production experience 2. From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration

1) 建立車用cockpit/ADAS等ECU系統級熱模型，並設計具市場競爭力的散熱解決方案。 2) 參與制定、分析、評測SOC TDP(Thermal Design Power) 3) 設計、設置、執行並交付各種thermal和TDP實驗的結果，驗證SOC 和系統硬體性能。 4) 針對下一代車用晶片，規劃熱管理方案，並參與制定晶片及系統的thermal/power設計需求 5) 管理技術專案，並與其他內部組織和客戶合作，支援開發週期中的執行過程。 6) 執行熱模擬和驗證，並與合作單位展示和溝通成果