轉職熱搜工作

1.Switch 產品熱傳設計 2.與團隊(HW and ME)合作完成系統熱傳模擬及流場設計 3.風扇及導熱材料(heatsink and TIM)選用 4.與供應商合作完成散熱模組設計(氣冷及水冷架構) 5.Review 相關測試結果及優化 (thermal, air flow and acoustic test) 6.與客戶討論產品熱傳設計方向與solution

1. 與開發團隊, 針對客戶需求與供應商進行Server/Rack機櫃機構系統散熱設計 2. 産品開發過程與各Function team進行Server/Rack機櫃機構系統散熱噪音設計檢討與改善 3. 量產前後與工廠和供應商檢討量產問題分析與問題改善 4. 前後代産品散熱噪音細部設計優化與校能增進

協助高密度伺服器機櫃與電子產品的結構強度分析與散熱方案設計；參與熱源模型建立與 CFD 流體力學模擬分析驗證。配合團隊規劃溫升、風洞與噪音實測計畫，協助執行新材料的選用評估與 Mockup 樣品之組裝性能解析，學習極致散熱解決方案。 Assist in structural strength analysis and thermal design for high-density server racks and electronic products. Participate in thermal model building and CFD simulation validation. Support temperature rise, wind tunnel, and noise testing. Assist in evaluating new materials and analyzing mockup assembly performance.

1. CFD thermal simulation for server or IT related system design. Experience on liquid cooling / phase change simulation is plus. 2. Familiar with server system thermal solution optimum design and verification testing. 3. Experience on thermal module and thermal parts design is plus (heatsink, EVAC, and cold plate…) 4. Experience on advanced cooling solutions is plus 5. Experience on facility cooling system / thermo-fluid test equipment design is plus

1. 參與客戶會議，對應客戶指示與需求。 2. 參與客戶散熱設計開發過程。 3. 熱分析與模擬，使用CFD進行熱流模擬。 4. 測試與驗證，失效分析與報告產出。

1. RFQ thermal CFD 2. NPI system thermal design and validation

1. 使用繪圖工具或電腦輔助設計(CAD)設計新研發產品的架構。 2. 執行機械相關研發工作（如：應力分析、機構、振動、熱傳、冷凍、噪音、流力、固力、動力學等）。 3. 研究和分析客戶設計規劃、產品規格、說明書等資料，以評估可行性評估。 4.光學機構件設計及逆向分析。

1. Familiar with rack-level liquid cooling system configuration (L-to-L / L-to-A) 2. Experience on the cooling parts like Fan/pump/heatsink/cold plate 3. Experience on CFM simulation tool and is plus 4. Experience on facility cooling system / thermo-fluid test equipment design is plus

1. Familiar with IT industry thermal modules/products 2. Familiar with server/rack thermal engineering is plus 3. Experience on thermal/mechanical suppliers management is plus