轉職熱搜工作

1.機械相關背景或具CNC經驗者佳 2.熟SolidWorks與AutoCAD 3.對產品設計和估價有興趣者 4.具大廠伺服器機構設計經驗者佳 5. 對真空硬焊, 雷射焊接有經驗及對技術突破有興趣挑展者

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for high-performance computing. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1.Develop and maintain BMC firmware for AI servers, including OpenBMC platform bring-up and feature development (embedded Linux experience acceptable if no prior OpenBMC exposure). 2.Implement and integrate low-level drivers (U-Boot, Device Tree, Kernel), covering I2C, SPI, PMBus, GPIO, and other interfaces. 3.Build and maintain BMC sensor monitoring, FRU/SDR tables, fan/power control, and event log systems. 4.Implement management protocols and firmware update mechanisms (IPMI, Redfish, PLDM, MCTP). 5.Integrate Secure Boot / TPM / SPDM security frameworks. 6.If experienced with NVIDIA HGX/DGX/NVSwitch projects, support GPU power/thermal control, firmware updates, and OOB management integration. 7.Prepare design documents, test plans, mass production support materials, and debug reports.

1.執行NB特案機種的系統熱傳與噪音工程設計 2.建構TPE & VN團隊與人員培訓 3.建構TPE & VN熱傳與噪音設計實驗室

1.執行NB特案機種的系統熱傳與噪音工程設計 2.建構TPE & VN團隊與人員培訓 3.建構TPE & VN熱傳與噪音設計實驗室

1. 材料檢測及破損分析、雷射焊接及加工。 2. 機械設計、熱傳分析及散熱系統設計。 3. 軍 商 用一次、二次電池設計開發與測試分析。 4. 電池材料配方設計、成分分析與電化學檢測。 5. 電池生產製程優化與品管作業。 6. 能源 系統設計開發。

工業技術研究院綠能所產業節能服務室招聘『工業節能診斷及應用技術研究員』，成為國內最完整具節電與節熱技術整合與實務經驗之團隊！，主要負責以下四項工作： 1. 節能技術研析：蒐集國內外節能技術最新發展資訊，研析國際先進工業節能技術與典範案例，以支援政府制定能源政策和產業節能方案規劃。 2. 工廠節能診斷服務：提供提供國內工業用戶節能技術輔導與評估提升設備效率服務，協助企業節能診斷，並提出具體可行的節能改善方案。 3. 能源法規之符合性稽查：執行工業能源用戶應遵守能源法規之稽核與管理。 4. ISO 50001輔導：協助企業建立ISO 50001能源管理系統，透過監測和評估節能行動的成效，以持續提升整體能源績效。

In this position, we take aim at more 3 years working experience in your background, at least with one or more R&D projects which includes: 1. UV-and/or thermal-formulations in adhesive, encapsulation, optical film, R2R coating, and dipping/casting processes. 2. Skills in fields of acrylate, epoxy, allyl, copolymer, silicone, siloxane, or silane material knowledge and experience, more is better. 3. Organic synthesis experience in polymerization or cross-linkable monomers. 4. Inorganic nanomaterial (hydrothermal, sol-gel, or quantum dot material) in multiple dimensions synthesis experience and ligand exchange process. 5. Massive production experience based on previous mentioned is preferred.

1. 主動式溫控系統產品開發 2. 散熱鰭片之開發、分析與導入 3. 熱流分析相關技術工作 4. 新型散熱技術之研究

1. 具備工業設備或機櫃式產品設計經驗 (強度, 振動, 可靠度相關要點) 2. 熟悉板金, 焊接, 加工件之結構應用 3. 具備與電控/自動化單位合作經驗(感測器,氣壓,水路,馬達配置) 4. 了解冷凍循環系統基本原理, 具銅管配管與固定設計經驗 5. 能考量冷卻效率, 兼顧組裝性, 維修性, 與量產可行性之設計