轉職熱搜工作

1.Develop and maintain BMC firmware for AI servers, including OpenBMC platform bring-up and feature development (embedded Linux experience acceptable if no prior OpenBMC exposure). 2.Implement and integrate low-level drivers (U-Boot, Device Tree, Kernel), covering I2C, SPI, PMBus, GPIO, and other interfaces. 3.Build and maintain BMC sensor monitoring, FRU/SDR tables, fan/power control, and event log systems. 4.Implement management protocols and firmware update mechanisms (IPMI, Redfish, PLDM, MCTP). 5.Integrate Secure Boot / TPM / SPDM security frameworks. 6.If experienced with NVIDIA HGX/DGX/NVSwitch projects, support GPU power/thermal control, firmware updates, and OOB management integration. 7.Prepare design documents, test plans, mass production support materials, and debug reports.

1.有效安排混合、粉碎、熱傳導、蒸餾和乾燥等操作程序。 2.在生產作業過程中進行相關變項的檢測（如：反應槽溫度、密度、比重和鍋爐蒸氣壓力）， 以維持一定效率、品質之生產。 3.負責生產線機器、設備之操作，並維持機台正常運作。 4.與其他作業員進行協調，以符合生產及程序標準。 5.製程管制，掌握品質變異狀況，解決問題，負責產品品質水準之穩定 6.完成主管交辦有關生產產品、程序事宜。

We are looking for a Hardware Engineering Manager to lead and grow a high-calibre team responsible for the design, validation, and production introduction of Peplink’s next-generation routers, access points, and connectivity appliances. You will own the full hardware lifecycle from concept through mass production, drive cross-functional execution with firmware, mechanical, and manufacturing teams, and directly influence product roadmap decisions. This is a hands-on leadership role: we need someone who can review schematics, debug board bring-up issues, and also build a world-class engineering culture. Key Responsibilities 1) Lead, mentor, and grow a team of hardware engineers across board design, RF, power, and signal integrity disciplines. 2) Own the end-to-end hardware development process: architecture definition, schematic and layout review, prototype build, DVT/PVT, and manufacturing handoff. 3) Drive aggressive development cycle targets (12-month concept-to-production) by removing blockers, improving tooling, and optimising team workflows. 4) Collaborate closely with firmware, product management, and industrial design teams to define product requirements and resolve cross-domain trade-offs. 5) Manage relationships with contract manufacturers, component suppliers, and test houses; lead design-for-manufacturing (DFM) and design-for-test (DFT) reviews. 6) Establish and enforce design standards for high-speed digital interfaces (PCIe Gen 3/4, USB 3.x, Ethernet up to 10 GbE), cellular modem integration (4G/5G), and Wi-Fi 6E/7 RF front-ends. 7) Evaluate and integrate emerging technologies including 60 GHz mmWave radios, FPGA-based packet processing, and satellite modem interfaces. 8) Champion quality and reliability through robust HALT/HASS programmes, thermal analysis, and field-return root-cause investigations. 9) Define team hiring plans, manage budgets, and report progress to senior leadership with clear, data-driven metrics.

〝1.Thermal design and measurement of server, storage and edge server projects 2.Cross functional collaboration and communication 3.Supplier management of thermal parts 4.Advanced thermal solution study〝

1. 主動式溫控系統產品開發 2. 散熱鰭片之開發、分析與導入 3. 熱流分析相關技術工作 4. 新型散熱技術之研究

飛宏科技深耕電源產品50多年，為全球十大頂尖的電源供應器供應商之一 我們正在尋找一位專業工程師加入我們的團隊！為公司產品提供散熱設計、分析和驗證熱解決方案，歡迎您的加入。 【職務說明】 1.電源供應器、EV充電樁等產品前期開發階段〝熱、溫度〝風險評估，熱管理設計優化 2.電源供應器、EV充電樁等產品之熱管理方案制定、驗證、導入工作 3.熟悉電子散熱模擬軟體工具使用 【幸福飛宏】 ◆ 我們提供具競爭力的獎酬制度以及完善的福利項目 ◆ 把員工視為最重要的資產，注重人才培訓，擁有完整教育訓練體系

1.AI PC系統散熱設計、風扇控制與噪音管理。 2.系統模擬分析、系統熱區分析、氣流場分析與流道設計。 3.系統散熱模組單體設計規格制訂、性能及可靠度驗證方法設置、issue debug等。 4.系統Thermal & Acoustic測試規劃

產品：筆電 1. 主要負責風扇機構,流場和扇葉設計, 並需組裝Mockup樣品及測試. 2. 需與客戶、廠商及廠內各部門人員有效率溝通, 獨當一面作業能力. 3. 產品應用及分析能力.

1.Switch 產品熱傳設計 2.與團隊(HW and ME)合作完成系統熱傳模擬及流場設計 3.風扇及導熱材料(heatsink and TIM)選用 4.與供應商合作完成散熱模組設計(氣冷及水冷架構) 5.Review 相關測試結果及優化 (thermal, air flow and acoustic test) 6.與客戶討論產品熱傳設計方向與solution

協助高密度伺服器機櫃與電子產品的結構強度分析與散熱方案設計；參與熱源模型建立與 CFD 流體力學模擬分析驗證。配合團隊規劃溫升、風洞與噪音實測計畫，協助執行新材料的選用評估與 Mockup 樣品之組裝性能解析，學習極致散熱解決方案。 Assist in structural strength analysis and thermal design for high-density server racks and electronic products. Participate in thermal model building and CFD simulation validation. Support temperature rise, wind tunnel, and noise testing. Assist in evaluating new materials and analyzing mockup assembly performance.