轉職熱搜工作

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs. Responsibilities include: • Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. • Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. • Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. • Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes • Contribute to validation team on improving test plan/method to validate features and verify fixes • Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool • Define and drive the system debug process implementation and ingredient owner engagement and alignment Qualifications: The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following: • Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform • Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels • Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred • Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. • Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. • Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; • Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1.熟悉金屬材料之熱流、流體力學、熱傳導相關技術 2.熟悉金屬材料熱力學系統原理與設計 3.進行CFD、高溫熱流場、熱應力模擬(會使用Ansys、COMSOL尤佳) 4.規劃實驗、數據收集與統計分析

1. 負責各類型空水冷散熱產品設計與優化 2. 藉由熱流分析及實驗驗證確保性能符合客戶需求 3. 與客戶及廠商即時溝通, 提供完整散熱方案 ※年底辦公室會遷至新北市五股

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃，提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 ※依學經歷、工作年資敘薪

1.審視管理信賴度相關測試品質 2.妥善出貨報告信賴性設備管理 3.耐熱性管理，定期信賴性測試(一般/高階) IST/Thermal shock 品質監測 4.結合力管理 (低咬蝕棕化、HDI /Skip via 產品信賴性驗證 5.完成並滿足客戶認證板、新樣品的信賴性測試要求 6.配合客服客訴、阻抗、訊號等問題分析

1. 技術專業貢獻 • 高階設計與研發：負責設計和開發高難度或關鍵技術解決方案。 • 問題解決：處理技術上複雜或緊急的問題，提供指導性解決方案。 • 技術創新：推動新技術的採用和創新產品的開發。 ________________________________________ 2. 指導與培訓 • 技術指導：為初級或中級工程師提供技術建議，解答疑問。 • 知識分享：舉辦技術培訓，促進團隊的專業能力提升。 • 項目帶領：在項目中起到技術帶頭作用，指導團隊完成目標。 ________________________________________ 3. 項目參與與管理 • 技術規劃：參與技術方案的制定，確保其可行性和效率。 • 質量控制：審核設計和測試結果，確保技術成果符合質量標準。 • 交付管理：協調技術資源，確保按時完成項目交付。 ________________________________________ 4. 跨部門合作 • 需求分析：與客戶或產品經理溝通，準確理解需求。 • 資源協調：與其他部門協作，確保技術需求與業務目標一致。 • 問題溝通：在項目或技術過程中，解決各部門間的問題。

1.智慧機械演算法開發(健康評估、缺陷分析、異常診斷、時間序列處理等) 2.機台及感測器訊號擷取及時頻分析 3.需具備機械學習、深度學習相關開發經驗或碩論研究 4.熟悉振動及溫度等一維訊號處理尤佳 5.具備機械領域知識尤佳 (自動控制、振動分析、熱流、結構分析及加工等) 6.熟悉Linux作業系統尤佳 7.熟悉SQL尤佳 8.熟悉DOCKER / VMARE尤佳

1. 使用繪圖工具或電腦輔助設計和軟體，協助製圖員設計新研發產品的架構。 2. 研究、設計、評估、安裝、操作及維護機械產品、設備、系統與程序，以符合要求。 3. 執行機械相關研發工作（如：應力分析、機構、振動、熱傳、冷凍、噪音、流力、固力、動力學等）。 4. 測試、檢測與分析設備、組件和系統之可行性、設計、操作和性能表現。 5. 研究和分析客戶設計規劃、產品規格、說明書等資料，以評估可行性、及維修需求。 6. 監督機器設備的安裝、操作與維修，以確保其符合使用說明書的操作流程。 7. 建立工作日誌與設備管理檔案。 8. 解決系統故障問題，並提供技術訊息。 9. 診斷設備故障原因，並提供維修小組改善建議。