轉職熱搜工作

1.執行新產品開發機構設計構想,機構相關部件結構/功能設計。 2.產品問題分析與追蹤、工程樣品製作與新產品研發與測試驗證 3.執行產品設計input/output審查 4.產品生產規格制定, 協助工廠量產流程實現 5.執行零件材料選用及零件規格制訂 6.執行新產品開發可行性評估與客戶對應機構窗口

1.機構部組織架構設計、調整、管理 2.指導新產品開發機構設計構想與功能設計,系統散熱設計、開發與驗證熱解決方案 3.產品問題分析與追蹤、工程樣品製作與新產品研發與測試驗證 4.機構2D, 3D圖面設計、模具發包、開模、試模等流程監督 5.指導產品設計input/output審查

1.擬定自動化技術發展藍圖與策略，推動核心技術研發與產品化落地。 2.帶領團隊進行自動化設備相關技術開發。 3.整合軟體、硬體、電控、冷郤熱流分析等跨部門資源，負責設備從設計、開發、測試到導入驗證的全流程。 4.分析市場需求與公司策略，制定產品開發目標，確保具商業價值與技術領先性。 5.推動技術引進、資源整合，拓展學界、業界與供應鏈合作。 6主導研發專案與進度管控、規格訂定及審核、 7產品開發之規劃、擬定、執行、督導與協調 8產品成本處理、研發團隊管理與溝通協調、達成組織目標管理 目前於南投草屯訓練，年底前公司將搬遷至中科科雅路12號

1. 與 ODM/OEM/Brand 客戶溝通，掌握需求並推進專案。 2. 協調內部工程、工廠及供應鏈資源，確保產品設計、打樣、量產符合客戶要求。 3. 負責伺服器或散熱模組相關機構件專案的 Sales / PM / Mechanical PM 角色。 4. 追蹤專案進度，管理專案排程、風險控管及成本分析。 5. 支援新客戶和產品線開發。 6. 定期彙整並回報專案進度與市場資訊。 • Work closely with ODM/OEM/Brand customers to define requirements and drive projects. • Coordinate with internal engineering teams, factories, and supply chain to ensure design, prototyping, and mass production meet customer requirements. • Take ownership of Sales, PM, or Mechanical PM role for server and thermal module mechanical components. • Manage project timeline, risk control, and cost analysis. • Support new customer and product development • Provide regular updates on project status and market insights.

1. 連接器開發前的散熱模擬分析與提供改善對策 2. 開模後的實測與模擬數據比對分析 3. 熱流分析、模擬、實測的規格建立與標準化

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4672&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Define advanced testing hardware technology architecture. 2. Create world-class method and role model tech structured problem solving. 3. Conduct advanced electrical/mechanical/thermal analysis and PI/SI improvement. 4. Be a focal contact between customer and tsmc testing for test validation and release to production. 5. Exhibit good and open communication skills, be able to work within cross-functional teams. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

建準近年投入水冷技術研發，為的就是提供最佳散熱解方，挑戰自我、滿足客戶的目標，歡迎相關領域專業人才一起加入！ 1. IPC,AIO(OEM,IEM,ODM)用水冷cold plate 的產品設計、測試、驗證及導入量產。 2.專案進度追踨，並與客戶、製造團隊應對協調 3.水冷研發/設計3D/2D繪製圖面。 4.品質測試及規範，與工程問題分析與改善。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=550&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: Apply advanced computational models to predict performance, optimize structure and doping profile, and provide improvement directions in nano-scaled device technologies. Develop and apply finite element method (FEM) modelling, including but not limited to stress simulations, computational fluid-dynamics, thermal conductivity simulations and electromagnetic wave simulations, for both macroscopic (tool/wafer) and microscopic (discrete device) structures. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Responsibilities: Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency. 1. Develop and maintain baselines, including setting up recipes. (1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications. (2) Responsible for transferring metrology solutions to volume manufacturing. 2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel. (1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency. (2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.