轉職熱搜工作

1. 散熱模組結構測試與導熱測試及分析 2. 散熱模組應用及測試分析 3. 協助散熱模組設計製作與樣品組裝並負責測試分析與改善 *須長期出差

1、機器視覺方案製定及可行性分析 2、自動化機器視覺專案演算法及程式審查 3、機器視覺AI技術開發 4、通用性視覺平臺開發 5、常用標準視覺演算法的開發及應用 6、製定視覺開發設計標準、技術規範 *須配合職務需求出差派駐

3DVC相關新產品開發技術主管、 3DVC工程師團隊建立並帶領團隊開發3DVC技術參數、 建立3DVC產品開發參數資料庫、 3DVC製程優化

1.負責生產線機器、設備之操作，並維持機台正常運作 2.進行製造現場熔煉、鑄造、檢驗、砂模等作業 3.與其他作業員進行協調，以符合生產及程序標準 4.填寫生產報表，以檢視與生產目標的距離 5.完成主管交辦有關生產產品、程序事宜

• Define and drive PI/SI/Thermal signoff methodology for 3DIC, chiplet, and advanced packaging programs. • Lead end-to-end analysis for power delivery network, high-speed signal channels, and thermal/mechanical interaction across die-package-system. • Establish signoff criteria, design margins, modelling quality standards, and correlation flow for simulation versus silicon or lab measurements. • Work closely with package design, bump/TSV planning, PHY/IO, floorplan, architecture, and product engineering teams to resolve integration issues early. • Identify and mitigate risks related to IR drop, SSN, jitter, crosstalk, insertion loss, return loss, EMI/EMC, hotspot formation, and thermal coupling. • Drive EDA vendor and tool engagement for modelling, extraction, co-simulation, and signoff automation.

1.Develop and maintain BMC firmware for AI servers, including OpenBMC platform bring-up and feature development (embedded Linux experience acceptable if no prior OpenBMC exposure). 2.Implement and integrate low-level drivers (U-Boot, Device Tree, Kernel), covering I2C, SPI, PMBus, GPIO, and other interfaces. 3.Build and maintain BMC sensor monitoring, FRU/SDR tables, fan/power control, and event log systems. 4.Implement management protocols and firmware update mechanisms (IPMI, Redfish, PLDM, MCTP). 5.Integrate Secure Boot / TPM / SPDM security frameworks. 6.If experienced with NVIDIA HGX/DGX/NVSwitch projects, support GPU power/thermal control, firmware updates, and OOB management integration. 7.Prepare design documents, test plans, mass production support materials, and debug reports.

1.執行NB特案機種的系統熱傳與噪音工程設計 2.建構TPE & VN團隊與人員培訓 3.建構TPE & VN熱傳與噪音設計實驗室

1.執行NB特案機種的系統熱傳與噪音工程設計 2.建構TPE & VN團隊與人員培訓 3.建構TPE & VN熱傳與噪音設計實驗室

1. 使用繪圖工具或電腦輔助設計和軟體，協助製圖員設計新研發產品的架構。 2. 研究、設計、評估、安裝、操作及維護機械產品、設備、系統與程序，以符合要求。 3. 執行機械相關研發工作（如：應力分析、機構、振動、熱傳、冷凍、噪音、流力、固力、動力學等）。 4. 測試、檢測與分析設備、組件和系統之可行性、設計、操作和性能表現。 5. 研究和分析客戶設計規劃、產品規格、說明書等資料，以評估可行性、及維修需求。 6. 監督機器設備的安裝、操作與維修，以確保其符合使用說明書的操作流程。 7. 建立工作日誌與設備管理檔案。 8. 解決系統故障問題，並提供技術訊息。 9. 診斷設備故障原因，並提供維修小組改善建議。

In this position, we take aim at more 3 years working experience in your background, at least with one or more R&D projects which includes: 1. UV-and/or thermal-formulations in adhesive, encapsulation, optical film, R2R coating, and dipping/casting processes. 2. Skills in fields of acrylate, epoxy, allyl, copolymer, silicone, siloxane, or silane material knowledge and experience, more is better. 3. Organic synthesis experience in polymerization or cross-linkable monomers. 4. Inorganic nanomaterial (hydrothermal, sol-gel, or quantum dot material) in multiple dimensions synthesis experience and ligand exchange process. 5. Massive production experience based on previous mentioned is preferred.