轉職熱搜工作

【職務說明】 你將加入旺矽科技 AST（Advanced Semiconductor Test）事業群，參與高頻、高功率、矽光子與先進封裝測試平台的設計開發。團隊橫跨自動化探針台、晶圓測試載具、溫度控制模組與光機整合系統，是推動 AI、車用、5G/6G、CPO 測試解決方案的核心團隊。 【工作內容】 1.新產品規劃及新技術開發 2.機構模組設計 3.機台機電整合 4.機台客製化變更 【需求條件】 • 機械/機電/光機背景，熟 3D繪圖如SolidWorks • 具模組設計經驗，了解加工與裝配配合 • 對先進半導體測試應用有高度熱情者佳 【你將接觸】 • 尖端晶片測試需求（AI、車用、SiPh、mmW） • 多元技術領域：光機熱整合、精密載具、自動化模組 • 國際客戶合作與跨部門產品開發流程 https://www.youtube.com/channel/UCzy4pCa_OqlTMJz333PojIQ 工作地點：新竹縣竹北市中和街155號 【Job Title】 AST Mechanical Engineer | Precision Module Design × Advanced Wafer Test Platform Development ________________________________________ 【Job Description】 Join the Advanced Semiconductor Test (AST) division at MPI Corporation, where you’ll be part of a core team developing cutting-edge test platforms for high-frequency, high-power, silicon photonics, and advanced packaging applications. Our team specializes in automated probe stations, wafer test fixtures, thermal control modules, and opto-mechanical integration systems, enabling next-generation testing solutions for AI, automotive, 5G/6G, and CPO technologies. ________________________________________ 【Responsibilities】 1. New product planning and technology development 2. Mechanical module design 3. Mechatronic integration of test platforms 4. Customization and modification of equipment based on customer requirements ________________________________________ 【Requirements】 • Background in mechanical, mechatronics, or opto-mechanical engineering; proficiency in 3D CAD tools such as SolidWorks • Experience in module design with a strong understanding of machining and assembly fit • Passion for advanced semiconductor test applications is a strong plus ________________________________________ 【You Will Be Exposed To】 • Leading-edge IC testing applications (AI, automotive, SiPh, mmWave) • Multidisciplinary technologies: opto-mechanical-thermal integration, precision fixtures, automation modules • Cross-functional product development with international clients and internal teams Work Location: No. 155, Zhonghe Street, Zhubei City, Hsinchu County, Taiwan

1. 領導Team member工作方向，提升小組士氣與維護和諧氣氛 2. 完成部級主管交代工作事項，與傳達訊息宣導事項 3. 新人訓練，建立共享資源，提升小組技術能力 4. 定期會議Review專案狀況，並適時提供建議引導小組解決問題 5. 與客戶端溝主要通窗口，有能力決定關鍵性參數，解決專案問題

3DVC相關新產品開發技術主管、 3DVC工程師團隊建立並帶領團隊開發3DVC技術參數、 建立3DVC產品開發參數資料庫、 3DVC製程優化

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for HPC and AI server architectures. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. • Familiarity with L10~L12 internal/external cable form factors and applications, as well as cable routing management, space planning, and related infrastructure assessment. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1.Develop and maintain BMC firmware for AI servers, including OpenBMC platform bring-up and feature development (embedded Linux experience acceptable if no prior OpenBMC exposure). 2.Implement and integrate low-level drivers (U-Boot, Device Tree, Kernel), covering I2C, SPI, PMBus, GPIO, and other interfaces. 3.Build and maintain BMC sensor monitoring, FRU/SDR tables, fan/power control, and event log systems. 4.Implement management protocols and firmware update mechanisms (IPMI, Redfish, PLDM, MCTP). 5.Integrate Secure Boot / TPM / SPDM security frameworks. 6.If experienced with NVIDIA HGX/DGX/NVSwitch projects, support GPU power/thermal control, firmware updates, and OOB management integration. 7.Prepare design documents, test plans, mass production support materials, and debug reports.

1. 負責 AI Server / Storage 產品之 ODM 開發與系統架構規劃，具伺服器產品開發經驗者尤佳。 2. 規劃 AI 伺服器整體系統架構，包含 GPU Baseboard、CPU、Memory、Storage、高速網路、電源與冷卻系統等核心模組。 3. 負責 AI Server / Storage 產品之模組化設計，確保系統具備高效能、高擴充性、高可用性與可維護性。 4. 針對 AI 訓練與推論應用需求，規劃高速儲存架構，優化資料吞吐量、延遲與大量隨機讀寫效能。 5. 規劃高速快取、NVMe / SSD、儲存控制器與長期資料儲存系統之整合架構，提升資料存取效率與系統可靠度。 6. 參與新專案前期技術評估，協助分析客戶需求、產品規格與技術可行性，提出硬體架構方案與 PoC 規劃。 7. 擔任跨部門技術整合窗口，協調機構、熱傳、SI/PI、電源、韌體、軟體、驗證與製造團隊，確保各模組符合系統設計需求。 8. 主導系統設計審查、風險評估、問題分析與改善追蹤，確保產品開發進度、品質與技術規格符合客戶要求。 9. 定義系統驗證測試項目，包含效能、穩定性、極限負載、散熱、電源、訊號完整性與可靠度測試。

1.低碳煉鋼製程開發 2.碳捕捉與再利用製程模擬、製程能源優化與與應用技術開發 3.物質流及環境分析技術開發、水處理開發 4.精密熱流製程研究 5.非破壞檢測技術開發、馬達設計 6.AIoT韌體開發、智慧電網與電力分析 7.鋁合金產品之製程開發與應用 歡迎材料、冶金、化工、化學、機械、電機、機電、電子、航太、能源、控制、資工、資管、統計、工業工程、數學、物理等相關領域之役男應徵。 ※未具研發替代役男身分者，請勿報名。

1. 負責 AI Server / GPU Server 平台整體系統架構規劃與設計。 2. 規劃 AI Rack (or AI Cluster) 架構，包含 compute、network、power 與 cooling integration。 3. 協助高功耗 AI Server thermal 與 power architecture 設計，包含 liquid cooling、rack power density、PSU/BBU 等。 4. 協助 CSP/Hyperscaler 等客戶進行技術討論、需求分析與 solution customization。 5. 評估新世代 AI Infrastructure 技術與 roadmap，包含 CXL、UEC、Optical Interconnect、Rack-scale Architecture 等。 6. 須與外國客戶直接溝通, 具備英文聽說讀寫能力。

1. 負責使用 ANSYS Fluent 軟體進行不同產品之散熱元件/模組、及整體系統之散熱特性的數值模擬與分析。 2. 根據產品設計及工藝需求，建立仿真模型，優化散熱元件，提高產品性能與質量。 3. 分析模擬結果，撰寫仿真報告，並提出改進建議以支持工程設計與生產決策。 4. 與研發、生產等部門合作，解決實際生產中的技術問題，驗證仿真結果的準確性。 5. 調查研究產業新技術發展。 *須長期出差