轉職熱搜工作

本職位隸屬於先進電源中心，主要負責電力電子新技術之開發、評估與導入。團隊在公司內扮演前瞻技術推動的角色，不受特定產品線限制，透過市場研究、技術趨勢分析與客戶交流，持續探索具發展潛力之電力電子應用與關鍵技術。 在技術發展過程中，團隊不僅關注理論與概念驗證，更強調技術實際落地與產品導入，評估新技術與公司中長期發展方向的契合度，並逐步推動至實際產品開發流程中。 在此職位中，你將參與電力電子相關技術的開發與驗證，從電路設計、模擬分析到實際量測與問題解析，逐步累積完整的硬體開發能力。你將有機會參與從技術評估、設計實作到問題改善的完整開發流程，而非僅限於單一任務。 同時，你也會與熱流、Layout、機構等跨領域團隊合作，在實際專案中理解產品整體設計邏輯，培養系統整合能力與工程溝通能力。

誠摯招募熱流／電子散熱專家加入團隊！我們致力於打造國內最完整之熱流與電子散熱技術研發能量，研發領域涵蓋熱流與流體機械整合、高功率設備冷卻系統、高效 CFD 雲端運算架構，以及資料中心液冷系統應用推廣，歡迎對前瞻散熱技術與能源應用有熱忱的人才共同投入研發創新 工作內容： 1. 規劃散熱測試系統 2 .協助建置散熱測試實驗室 3 .執行散熱技術開發計畫

業技術研究院綠能所高速流機研究室誠徵資訊系統研發工程師，肩負重要使命。本職主要工作任務如下： 1.負責冷暖空調資訊系統之全生命週期管理，包含系統架構設計、開發、及持續維運 2.協助支援並維護既有冷暖空調資訊系統，支援運算系統模組、資料介面與部署設計等相關技術課題 3.主導多租戶管理架構、前後端混合模式等關鍵技術之研發，以期提升系統彈性與可擴充性 4.整合軟體與硬體資源，打造具備高度可靠性與前瞻性的冷暖空調服務系統

1.冷凍空調與熱流產品設計開發 2.CAD/CAE機構設計與產品圖面維護 3.冷凍空調產品安裝測試、零件採購工程、品質檢驗與產品組裝與測試

研發項目包括： 1.冷凍空調系統熱流分析及熱管理 2.熱交換器、冷凍空調系統設計與性能測試 3.伺服器或電子散熱 4.冷凍空調設備環境之氣流模擬分析

1.高效冷凍空調機電系統設計與開發 2.高效冷凍空調機電系統整合與效能驗證 3.低碳冷媒冷凍空調機電系統開發 4.熱管理模組開之設計、模擬、整合與驗證

CAE模擬、資料庫分析與預測模型生成 1.執行模擬如多體動力學、有限元素(結構或熱傳) 2.機器學習與預測模型建立 3.數據分析策略與框架建構 4.應用CAE模擬結果與量測數據生成預測模型 5.產出研究報告/期刊論文

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for HPC and AI server architectures. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. • Familiarity with L10~L12 internal/external cable form factors and applications, as well as cable routing management, space planning, and related infrastructure assessment. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

Founded in 2018, we‘re a Silicon-Valley based startup company aiming to revolutionize the touch user interface with our 3D Touch technology, and with this we could transform any surface into a “user interface” that dramatically change how human interact with technology. The company is funded by well-known company such as Sony, Bosch and Asahi Kasai, as well as several prestigious VCs in Silicon Valley. We‘re executing on a rigorously mapped vision, and we‘re looking for an enthusiastic contributor to take on an important role in organization. UltraSense Systems is looking for an experienced and skilled Automotive Qualification and Reliability Engineering leader. This candidate is responsible for defining, planning, and executing reliability validation activities for electronic modules used in automotive applications. This role ensures that product design and manufacturing processes meet the reliability requirements of automotive OEM and Tier-1 customers, in compliance with AECQ100, ISO16750, and customer-specific standards. Key Responsibilities: 1. Develop and execute module-level reliability validation plans (DVP&R) according to customer and industry standards (e.g., AEC-Q100/Q102/Q104, ISO 16750, IEC 60068) 2. Define reliability test matrix, sample size, stress levels, and acceptance criteria based on DFMEA and customer requirements 3. Coordinate design validation (DV) and production validation (PV) test activities with OEM or external testing partners 4. Perform failure analysis (FA) and root cause investigation on failed samples using techniques such as X-ray, SEM/EDX, cross-section, or thermal imaging 5. Collaborate with design, mechanical, and manufacturing teams to implement corrective and preventive actions (CAPA) for reliability issues 6. Ensure reliability documentation aligns with IATF 16949, APQP, and PPAP requirements. 7. Support customer reliability audits and respond to reliability-related technical questions or findings 8. Track and report reliability metrics, trends, and improvement actions across projects. Qualifications: Bachelor‘s or Master‘s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field. 3–7 years of experience in reliability, validation, or quality engineering within automotive, electronics, or semiconductor industries. Familiarity with automotive reliability standards such as: AEC-Q100 / Q102 / Q104 ISO 16750 (electrical and environmental stress) LV124, LV214 (for European OEMs) JESD22 series (JEDEC) Hands-on experience with environmental, mechanical, and electrical stress tests, e.g.: Thermal cycling, temperature/humidity bias (THB), vibration, mechanical shock, power cycling, ESD, etc. Knowledge of failure analysis tools and methods. Understanding of DFMEA, DVP&R, APQP, and PPAP processes. Strong analytical and communication skills; ability to work cross-functionally and interface with customers. Preferred Skills (Plus): Experience with automotive touch module, display, or camera systems. Knowledge of statistical tools (Minitab, JMP) for reliability data analysis (Weibull, lognormal). Familiar with supplier reliability management and component qualification. Certified Reliability Engineer (CRE) or equivalent certification is an advantage.

1.制訂製程與產品標準，評估最佳化的製造流程 2.負責新產品製程的導入，並進行產品夾治具設計開發評估 3.定期檢視製程的重點參數 4.調查並處理生產製程的異常狀況，改善現有生產製程 5.航太圖面審查及繪製 6.負責技術文件之撰寫與維護 7.負責每日產量及良率的分析、監控及改善 8.主管交辦事項