轉職熱搜工作

主要負責 1. 產品線路設計 2. 產品 PCB佈局設計 3. 生產 BOM發行 4. 零件評估選用 5. 產品 bring up onsite support 6. 產品功能性驗證, 製作測試報告 7. 產品 issue 分析 debug 8. 與 SI/ME/SW/Compliance/Thermal team 合作產品設計 9. Design study and Design proposal

1.Own end-to-end RF module/SIP development to bring products from concept to mass production 2.Responsible for module/SIP technology selection, part selection, vendor evaluation, and perform cost/technology/performance analysis 3.Develop module architecture, schematic, layout and work with vendors for DFM and manufacturing 4.Perform simulation analysis (RF circuit simulation, 3D EM Simulation and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, validation RF modules/SIPs 5.Collaborate closely with cross-functional teams and vendors to ensure RF performance are met at component, board and system level 6.Evaluate new advanced packaging technology, including design and validate prototypes

1. 使用3D繪圖軟體，研發(NB/Sever)設計散熱模組產品 2. 產品之設計方案，並與廠商及客戶討論修正 3. 產品之設計方案，進行樣品製作及驗證，並導入工廠試量產 4. 撰寫散熱模組產品之相關報告 5. 主管交辦事項 6.NB風扇問題點分析及解決

1. 網通產品機構設計 2. 機構圖檔設計審查(包含干涉檢查、公差分析) 3.設計提案改善與設計驗證 4.生產問題解決和對策導入 5.各階段試產不良分析與改善

1.設備控制系統軟體需求分析工作 2.運動控制方案硬體框架搭建 3.運動控制方案軟體框架搭建開發 5.專案前期參與軟體需求分析 6.流水綫調度演算法、運動控制演算法研發及功能測試計畫制定 7.洞悉業界軟件應用技術動向及發展趨勢，制定軟件應用改進完善計劃 8.設備控制系統軟件功能測試、現場設備重大問題調試等各種技術支持工作 9.制定軟件功能測試方案 *須配合職務需求出差派駐

1.設備控制系統軟件需求分析工作 2.運動控制方案硬體框架搭建 3.運動控制方案軟件框架搭建開發 5.專案前期參與軟件需求分析 6.流水綫調度演算法、運動控制演算法研發及功能測試計畫制定 7.洞悉業界軟件應用技術動向及發展趨勢，制定軟件應用改進完善計劃 8.設備控制系統軟件功能測試、現場設備重大問題調試等各種技術支持工作 9.制定軟件功能測試方案 *須配合職務需求出差派駐

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs. Responsibilities include: • Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. • Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. • Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. • Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes • Contribute to validation team on improving test plan/method to validate features and verify fixes • Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool • Define and drive the system debug process implementation and ingredient owner engagement and alignment Qualifications: The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following: • Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform • Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels • Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred • Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. • Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. • Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; • Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1.熟悉金屬材料之熱流、流體力學、熱傳導相關技術 2.熟悉金屬材料熱力學系統原理與設計 3.進行CFD、高溫熱流場、熱應力模擬(會使用Ansys、COMSOL尤佳) 4.規劃實驗、數據收集與統計分析

1. 負責各類型空水冷散熱產品設計與優化 2. 藉由熱流分析及實驗驗證確保性能符合客戶需求 3. 與客戶及廠商即時溝通, 提供完整散熱方案 ※年底辦公室會遷至新北市五股