轉職熱搜工作

1.負責生產線機器、設備之操作，並維持機台正常運作 2.進行製造現場熔煉、鑄造、檢驗、砂模等作業 3.與其他作業員進行協調，以符合生產及程序標準 4.填寫生產報表，以檢視與生產目標的距離 5.完成主管交辦有關生產產品、程序事宜

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs. Responsibilities include: • Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. • Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. • Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. • Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes • Contribute to validation team on improving test plan/method to validate features and verify fixes • Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool • Define and drive the system debug process implementation and ingredient owner engagement and alignment Qualifications: The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following: • Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform • Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels • Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred • Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. • Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. • Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; • Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1.Develop and maintain BMC firmware for AI servers, including OpenBMC platform bring-up and feature development (embedded Linux experience acceptable if no prior OpenBMC exposure). 2.Implement and integrate low-level drivers (U-Boot, Device Tree, Kernel), covering I2C, SPI, PMBus, GPIO, and other interfaces. 3.Build and maintain BMC sensor monitoring, FRU/SDR tables, fan/power control, and event log systems. 4.Implement management protocols and firmware update mechanisms (IPMI, Redfish, PLDM, MCTP). 5.Integrate Secure Boot / TPM / SPDM security frameworks. 6.If experienced with NVIDIA HGX/DGX/NVSwitch projects, support GPU power/thermal control, firmware updates, and OOB management integration. 7.Prepare design documents, test plans, mass production support materials, and debug reports.

1.AI HPC系統散熱設計及驗證 2.系統噪音評估/設計及驗證 3.系統散熱模擬 4.水冷系統、散熱模組及風扇規格定義及設計 5.創新設計及新技術導入

1.機械相關背景或具CNC經驗者佳 2.熟SolidWorks與AutoCAD 3.對產品設計和估價有興趣者 4.歡迎中高齡具相關經驗者來應徵

1.機械相關背景或具CNC經驗者佳 2.熟SolidWorks與AutoCAD 3.對產品設計和估價有興趣者 4.板金件機構設計經驗者佳 5.歡迎中高齡具相關經驗者來應徵

1.核心技術：精通金屬材料與結構之熱流、流體力學及高溫熱傳導技術。 2.系統設計：具備金屬材料與結構熱力學系統架構規劃與熱管理方案設計能力。 3.模擬分析：進行CFD、高溫熱流場、熱應力模擬(會使用Ansys、FloTHERM尤佳)。 4.實驗驗證：獨立規劃熱流驗證實驗、建置量測系統、統籌數據收集並透過統計工具進行分析，以校對模擬模型。

【工作內容】 1. 運用 Ansys Fluent／CFD／Mechanical 進行模擬分析。 2. 新產品開發模擬。 3. 現有設備/製程效能優化。 【工作條件】 必備條件 1. 大學以上流體力學、化工、機械、材料或相關理工科系。 2. 熟悉 Ansys Fluent／CFD／Mechanical 至少一項。 3. 具流體、熱傳或結構模擬分析能力。 加分條件 1. 曾任職 FCCL/CCL/FPC/PCB或相關產業經驗 2. 具壓合或塗佈製程模擬經驗。 3. 具電子材料、化學材料或薄膜製程相關經驗。 4. 具 Python、MATLAB 或數據分析能力。 【適合特質】 1. 喜歡從數據與模擬中找出製程問題。 2. 具邏輯分析能力，能將理論轉化為實際改善。 3. 對材料、製程與模擬技術具高度學習意願。 加入台虹科技 前瞻技術團隊，你將運用 Ansys 模擬技術，分析塗佈、流場及材料製程行為，協助解決塗佈均勻性、乾燥及製程變形等問題，將模擬結果轉化為實際製程改善方案。

1.配合新產品及既有衍生性產品開發設計需求，依設計及開發管理程序，協助工程師執行產品設計及開發，確保產品設計與規格符合產品規劃書 2.依開發時程計劃表進行機構設計及開發工作時程規劃及掌控，確保產品可依時程計劃如期完工 3.進行機構相關圖面(文件)製作與發行，並依圖面管理程序執行，確保文件(圖面)資料正確性、完整性及進行文件編碼、版次管制 4.配合客戶及業務部(製造部)需求，依設計及工程變更管理程序執行相關設計變更作業，以確保達成產品優化及符合客戶需求 5.夾、治具設計 6. 擅長工具 AutoCAD、PTC Creo、SOLIDWORKS 、Windows、Offices Dec 5,

1.網通產品與伺服器之風冷(L6 to L10)散熱模組設計開發 2.網通產品與伺服器之水冷(L6 to L11)散熱模組設計開發 3.執行系統級熱流模擬，並與HW、ME、PW、DVT、Safety等team進行整機散熱方案開發 4.導熱/散熱零組件選用(TIM、風扇、QD、leakage…etc) 5.與模組供應商合作開發，審查供應商設計與驗證資料 6.定義測試計畫，審查測試結果 7.與客戶進行報告，討論專案方向與進度