轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=22739&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking a talented Mechanical R&D Engineer to drive the development of our next-generation robots. In this role, you will deliver design of advanced robotic arms from concept to prototype validation. Working in a highly collaborative, result-oriented environment, you will solve complex engineering challenges in complex design, structural simulation, and precision motion control. If you are a proactive problem-solver passionate about pushing the boundaries of automation, we invite you to join our team. Responsibilities: 1. Responsible for the mechanical design and structural analysis of robot bodies, manipulator arms, and End-of-Arm Tooling (EOAT). 2. Execute Design for Cleanliness strategies, including particle suppression, negative pressure/airflow management, low-outgassing material selection, and sealing & lubrication design. 3. Conduct simulation and physical validation for structural rigidity, modal analysis, thermal deformation, and positioning accuracy. 4. Collaborate with the control team to define servo motor selection, transmission architecture, and sensor deployment. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1. Develop and maintain on-vehicle multi-sensor integration (e.g., Thermal/RGB Cameras, LiDAR, Radar, CAN-bus, etc.). 2. Develop and maintain high-performance data recording and synchronization systems on edge platforms (e.g., NVIDIA Orin). 3. Integrate and maintain cross-hardware time synchronization mechanisms. 4. Assist in on-vehicle testing, debugging, and optimizing recording system stability across various operational scenarios. 5. Collaborate with data labeling and algorithm teams to ensure recorded data formats align with downstream development requirements.

1. 負責 EC（Embedded Controller）韌體設計、開發與維護 2. 依據系統需求（BIOS / OS / HW）開發 EC firmware 功能模組 （Power Sequence、Thermal、Fan、Keyboard、Battery、PD、LED、GPIO 等） 3. 與 硬體、BIOS、PD、Platform、製造端 協作，進行系統整合與除錯 4. 負責 EC 與 BIOS / OS 之間通訊機制 （ACPI / SCI / SMI / HID / SMBus / I2C / UART） 5. 處理 EC 相關 Bring-up、Debug、Issue 分析與量產支援 6. 撰寫與維護韌體設計文件、規格說明與驗證報告 7. 依專案需求支援 EVT / DVT / PVT / MP 各階段 8. 協助技術規劃、Code Review、開發流程改善與新人指導

架構設計 (System Architecture): 伺服器產品之機械結構設計與系統整合，涵蓋機構設計、材料與製程選擇、組裝與可製造性（DFM/DFA）、可靠度驗證與量產導入。 客戶技術窗口 (Client Interface): 作為全球大廠客戶的主要技術對接，定義產品規格並解決設計爭議。 跨部門協作 (Cross-functional Coordination): 與 Electrical、Thermal、SI、Manufacturing、Quality 與供應商密切合作，確保產品在結構強度、散熱配合、安規、維修性與量產一致性上符合規範與客戶需求。 模具與成本管理 (Tooling & NRE): 管控 NRE 預算與模具時程，落實 DFM/DFA 設計準則。 技術問題解決 (Problem Solving): 執行公差分析、結構模擬及研發階段之失效根本原因分析。 團隊指導 (Team Mentorship): 指導初階工程師並確保專案設計標準之落實。

飛宏科技深耕電源產品50多年，為全球十大頂尖的電源供應器供應商之一 我們正在尋找一位專業工程師加入我們的團隊！為公司產品提供散熱設計、分析和驗證熱解決方案，歡迎您的加入。 【職務說明】 1.電源供應器、EV充電樁等產品前期開發階段〝熱、溫度〝風險評估，熱管理設計優化 2.電源供應器、EV充電樁等產品之熱管理方案制定、驗證、導入工作 3.熟悉電子散熱模擬軟體工具使用 【幸福飛宏】 ◆ 我們提供具競爭力的獎酬制度以及完善的福利項目 ◆ 把員工視為最重要的資產，注重人才培訓，擁有完整教育訓練體系

1. 具備工業設備或機櫃式產品設計經驗 (強度, 振動, 可靠度相關要點) 2. 熟悉板金, 焊接, 加工件之結構應用 3. 具備與電控/自動化單位合作經驗(感測器,氣壓,水路,馬達配置) 4. 了解冷凍循環系統基本原理, 具銅管配管與固定設計經驗 5. 能考量冷卻效率, 兼顧組裝性, 維修性, 與量產可行性之設計

新產品開發、製造改善、測試、量測並可分析解決加工問題 新產品設計繪圖；熟習繪圖軟體Pro/e BOM表、料件規格建立 具跨部門合作與溝通能力。 具金屬加工經驗者尤佳。 【錄用之職稱/薪資依面談後之學經歷核敘】

1. 負責產品機構設計與結構評估。 2. 繪製機構設計圖面。 3. 負責模具設計、開模、試模，並檢討、修改模具。 4. 負責機構模型製作、測試分析與改善。 5. 負責試產檢討及設計修正。 6. 協助解決量產製造及製程中的機構相關問題。

1. 參與客戶會議，對應客戶指示與需求。 2. 參與客戶散熱設計開發過程。 3. 熱分析與模擬，使用CFD進行熱流模擬。 4. 測試與驗證，失效分析與報告產出。