轉職熱搜工作

1. 能源相關領域之熱流分析模擬、結構分析、壽命分析，針對各項專案研擬簡報與報告資料，並協助研讀國內外規範與文獻，精進檢測技術。 2. 協助進行金屬材料/產品相關測試，協助進行實驗室環境與設備維運與管理。 3. 協助相關政府專案事務與研擬報告資料，協助各項行政事務及主管交辦相關事項。

1. NB/AIO/Thin Client/Mini-DT 系統之散熱模擬 2. 設計整體系統之散熱規劃與模組設計 (CPU/VGA…) 3. 系統量測及資料分析/散熱系統控制/問題解決

工作內容 1.使用繪圖工具或電腦輔助設計（CAD）或草擬設備和軟體，協助製圖員設計新研發產品的架構。 2.研究、設計、評估、安裝、操作及維護機械產品、設備、系統與程序，以符合要求。 3.執行機械相關研發工作（如：應力分析、機構、振動、熱傳、冷凍、噪音、流力、固力、動力學等）。 4.測試、檢測與分析設備、組件和系統之可行性、設計、操作和性能表現。 5.研究和分析客戶設計規劃、產品規格、說明書等資料，以評估可行性、費用及維修需求。

【工作內容】 1.在新產品製造階段中進行實驗室研究，並執行操作流程之試驗。 2.指導和研發新的、改良的化學製程。 3.進行建廠及新生產線之設計及設備佈置。 4.有效安排混合、粉碎、熱傳導、蒸餾和乾燥等操作程序。 5.在生產作業過程中進行相關變項的檢測，以維持一定效率、品質之生產。 （如：反應槽溫度、密度、比重和鍋爐蒸氣壓力） ––––––––––––––––––––––––––––––––––––––––––- 【其他條件】 1.熟悉office 2.基礎水質分析 3.有環工或化工背景 4.需可配合研究專案進行外派 5.計畫書撰寫能力 6.備有汽、機車駕照

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Role Introduction: • We are looking for talented mechanical engineer who has experience in mechanical system design of process machine. • You will become team member of DSC product engineering team, your responsibility is to demonstrate your design skill to fulfill any requirements of product development. • You will be working in an international working environment. We expect the candidate is fluent in English, with mature communication and teamwork skill for better efficiency. Your mission: • Demonstrate your design skill for designing and optimizing the mechanical module of the DSC lithography process machine. • Possess strong DOE ability for system error analysis and execute test plan. • Involved in NPI project to MFG team for new system, feature and technology. Perform trouble shooting, technical support and process improvements to fulfill the goal of production output. • Involved in CIP and maintenance project for mature product. • Initiate and validate engineering changes and familiar with ERP system for document management. • Strong mindset and experience of risk assessment, cost evaluation and cross function cooperation. Business travel requirement: • Less than 2 month a year.

1. 結構強度模擬分析(Server/AI Server等) 2. 支援結構性測試(衝擊/震動/落摔)送測-台灣 3. 支援熱傳溫度/噪音測試-台灣 4. 偕同不同function team合作進行驗證、分析與解決問題 5. 模擬新技術導入與研究 6. 模擬工具二次開發

1. 大型連線自動化設備機構方案規劃和技術指導； 2. 點膠雷射&貼膜組立等自動化設備機構方案評估及結構設計； 3.點膠雷射及貼膜組立等設備的核心工藝實驗，驗證，及可行性報告產出； 4. 現場設備的調試優化改善及異常處理 5.機構標準化文件的制定與發行 *須配合職務需求出差派駐

1.系統散熱與噪音設計(System Thermal and Acoustic Design) 2.專案在散熱部分的執行(Project execution on thermal related portion) 3.散熱驗證(Thermal validation) 4.開發新技術(Develop new thermal technology) ※依學經歷、工作年資敘薪

You will be at the forefront of our business expansion. This role focuses exclusively on the Pre-award Phase of ODM projects. As the technical brain and driving force behind new project development, you will lead cross-functional R&D teams under highly challenging timelines to transform ambiguous customer requirements into commercially competitive technical proposals. You must possess both the logical mindset of an engineer and the sharp acumen of a business professional, delicately balancing specifications, costs, and schedules to help the company secure flagship projects from global brands. Key Responsibilities: 1. Lead the RFI/RFQ Evaluation Process: Upon receiving initial customer requirements, rapidly establish evaluation baselines and assumptions. Initiate and lead cross-functional R&D teams (EE, ME, Thermal, RF, etc.) to conduct technical Feasibility Studies. 2. Technical Pitching & Communication: Transform complex hardware architectures into highly persuasive commercial technical presentations (R&D Proposals). Partner with the Sales team to pitch to customers, handle technical Q&A, and showcase the company‘s R&D capabilities. 3. Cross-Functional Coordination & Negotiation: In resource-constrained environments, leverage your influence to coordinate evaluation progress across various R&D departments to meet aggressive deadlines. 4. Cost & NRE Assessment: Collaborate closely with Sales and Engineering teams to accurately estimate the system BOM cost and Non-Recurring Engineering (NRE) expenses. Proactively guide the team through specification trade-offs or design optimizations when costs exceed targets. Minimum Qualifications: 1. Education: Bachelor’s or Master’s degree, preferably in Electrical, Electronic, Mechanical Engineering, Computer Science, or Engineering Management. 2. Industry Experience: 3+ years of experience in the system manufacturing industry (PC, Laptops, or Networking products), with at least 3 years as a TPM, PM, or R&D Engineer. Deep understanding of hardware system architectures and the NPI development process. 3. Language Skills: Fluent in English (capable of directly conducting meetings, presentations, and technical negotiations with international brand customers). Core Traits: 1. Tolerance for Ambiguity: Courageous enough to make reasonable assumptions and drive projects forward even with incomplete information. 2. Extreme Resilience & Time Management: Capable of multitasking under tight timeframes, remaining organized and focused when facing high-pressure deadlines. 3. Business Acumen: Highly sensitive to numbers, able to find the optimal balance between technical integrity and commercial profitability.

協助高密度伺服器機櫃與電子產品的結構強度分析與散熱方案設計；參與熱源模型建立與 CFD 流體力學模擬分析驗證。配合團隊規劃溫升、風洞與噪音實測計畫，協助執行新材料的選用評估與 Mockup 樣品之組裝性能解析，學習極致散熱解決方案。 Assist in structural strength analysis and thermal design for high-density server racks and electronic products. Participate in thermal model building and CFD simulation validation. Support temperature rise, wind tunnel, and noise testing. Assist in evaluating new materials and analyzing mockup assembly performance.