轉職熱搜工作

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for HPC and AI server architectures. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. • Familiarity with L10~L12 internal/external cable form factors and applications, as well as cable routing management, space planning, and related infrastructure assessment. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1.執行NB特案機種的系統熱傳與噪音工程設計 2.建構TPE & VN團隊與人員培訓 3.建構TPE & VN熱傳與噪音設計實驗室

1.執行NB特案機種的系統熱傳與噪音工程設計 2.建構TPE & VN團隊與人員培訓 3.建構TPE & VN熱傳與噪音設計實驗室

1.有效安排混合、粉碎、熱傳導、蒸餾和乾燥等操作程序。 2.在生產作業過程中進行相關變項的檢測（如：反應槽溫度、密度、比重和鍋爐蒸氣壓力）， 以維持一定效率、品質之生產。 3.負責生產線機器、設備之操作，並維持機台正常運作。 4.與其他作業員進行協調，以符合生產及程序標準。 5.製程管制，掌握品質變異狀況，解決問題，負責產品品質水準之穩定 6.完成主管交辦有關生產產品、程序事宜。

1. 負責 AI Server / Storage 產品之 ODM 開發與系統架構規劃，具伺服器產品開發經驗者尤佳。 2. 規劃 AI 伺服器整體系統架構，包含 GPU Baseboard、CPU、Memory、Storage、高速網路、電源與冷卻系統等核心模組。 3. 負責 AI Server / Storage 產品之模組化設計，確保系統具備高效能、高擴充性、高可用性與可維護性。 4. 針對 AI 訓練與推論應用需求，規劃高速儲存架構，優化資料吞吐量、延遲與大量隨機讀寫效能。 5. 規劃高速快取、NVMe / SSD、儲存控制器與長期資料儲存系統之整合架構，提升資料存取效率與系統可靠度。 6. 參與新專案前期技術評估，協助分析客戶需求、產品規格與技術可行性，提出硬體架構方案與 PoC 規劃。 7. 擔任跨部門技術整合窗口，協調機構、熱傳、SI/PI、電源、韌體、軟體、驗證與製造團隊，確保各模組符合系統設計需求。 8. 主導系統設計審查、風險評估、問題分析與改善追蹤，確保產品開發進度、品質與技術規格符合客戶要求。 9. 定義系統驗證測試項目，包含效能、穩定性、極限負載、散熱、電源、訊號完整性與可靠度測試。

1. 規劃電子仿真團隊技術方向、年度目標與人力配置。 2. 建立 SI / PI / EMI / ESD / Power simulation 標準流程與驗證規範。 3. 審核重大專案仿真結果，判斷設計風險並提出改善策略。 4. 協調 EE、PCB Layout、Power、Thermal、Mechanical 與客戶端技術需求。 5. 推動仿真自動化、資料庫建置、專利佈局與團隊技術能力提升。

1. 擔任產品設計使用者 (其他部門RD) 與AI 研發（R&D）團隊之間的主要窗口，對齊需求與交付期望。 2. 評估技術可行性與資料齊全度，並定義專案交付範疇與排定專案執行優先順序。 3. 協調 AI 研究員團隊與軟體工程師團隊之間的交接（handoff），推動專案從 PoC（概念驗證）進入正式產品化部署。 4. 訂定里程碑並推動執行、風險管理與分階段上線計畫，確保專案能如期且高品質交付。 5. 將產品設計需求轉化為可執行的 PRD（產品需求文件）、技術規格與實施計畫。 1. Serve as the primary contact between product design users and the R&D team, aligning requirements and delivery expectations. 2. Assess technical feasibility and data readiness, and define project scope and priorities. 3. Coordinate handoffs between AI Research and Software Engineering to move projects from PoC to production deployment. 4. Drive milestones, risk management, and phased rollout plans to ensure quality delivery on schedule. 5. Translate product design needs into actionable PRDs, technical specifications, and execution plans.

1. 負責 AI Server / GPU Server 平台整體系統架構規劃與設計。 2. 規劃 AI Rack (or AI Cluster) 架構，包含 compute、network、power 與 cooling integration。 3. 協助高功耗 AI Server thermal 與 power architecture 設計，包含 liquid cooling、rack power density、PSU/BBU 等。 4. 協助 CSP/Hyperscaler 等客戶進行技術討論、需求分析與 solution customization。 5. 評估新世代 AI Infrastructure 技術與 roadmap，包含 CXL、UEC、Optical Interconnect、Rack-scale Architecture 等。 6. 須與外國客戶直接溝通, 具備英文聽說讀寫能力。

You will be at the forefront of our business expansion. This role focuses exclusively on the Pre-award Phase of ODM projects. As the technical brain and driving force behind new project development, you will lead cross-functional R&D teams under highly challenging timelines to transform ambiguous customer requirements into commercially competitive technical proposals. You must possess both the logical mindset of an engineer and the sharp acumen of a business professional, delicately balancing specifications, costs, and schedules to help the company secure flagship projects from global brands. Key Responsibilities: 1. Lead the RFI/RFQ Evaluation Process: Upon receiving initial customer requirements, rapidly establish evaluation baselines and assumptions. Initiate and lead cross-functional R&D teams (EE, ME, Thermal, RF, etc.) to conduct technical Feasibility Studies. 2. Technical Pitching & Communication: Transform complex hardware architectures into highly persuasive commercial technical presentations (R&D Proposals). Partner with the Sales team to pitch to customers, handle technical Q&A, and showcase the company‘s R&D capabilities. 3. Cross-Functional Coordination & Negotiation: In resource-constrained environments, leverage your influence to coordinate evaluation progress across various R&D departments to meet aggressive deadlines. 4. Cost & NRE Assessment: Collaborate closely with Sales and Engineering teams to accurately estimate the system BOM cost and Non-Recurring Engineering (NRE) expenses. Proactively guide the team through specification trade-offs or design optimizations when costs exceed targets. Minimum Qualifications: 1. Education: Bachelor’s or Master’s degree, preferably in Electrical, Electronic, Mechanical Engineering, Computer Science, or Engineering Management. 2. Industry Experience: 3+ years of experience in the system manufacturing industry (PC, Laptops, or Networking products), with at least 3 years as a TPM, PM, or R&D Engineer. Deep understanding of hardware system architectures and the NPI development process. 3. Language Skills: Fluent in English (capable of directly conducting meetings, presentations, and technical negotiations with international brand customers). Core Traits: 1. Tolerance for Ambiguity: Courageous enough to make reasonable assumptions and drive projects forward even with incomplete information. 2. Extreme Resilience & Time Management: Capable of multitasking under tight timeframes, remaining organized and focused when facing high-pressure deadlines. 3. Business Acumen: Highly sensitive to numbers, able to find the optimal balance between technical integrity and commercial profitability.

1. 負責產品機構設計與結構評估。 2. 繪製機構設計圖面。 3. 負責模具設計、開模、試模，並檢討、修改模具。 4. 負責機構模型製作、測試分析與改善。 5. 負責試產檢討及設計修正。 6. 協助解決量產製造及製程中的機構相關問題。