轉職熱搜工作

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs. Responsibilities include: • Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. • Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. • Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. • Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes • Contribute to validation team on improving test plan/method to validate features and verify fixes • Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool • Define and drive the system debug process implementation and ingredient owner engagement and alignment Qualifications: The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following: • Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform • Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels • Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred • Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. • Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. • Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; • Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1. 數位孿生技術研究建構高精度熱流數位孿生系統。 2. 物理AI研究導入物理感知神經網絡，優化熱場預測效率。 3. 開發與應用ROM降階模型，實現複雜熱流系統即時模擬。 4. 跨團隊協作傳統CFD模擬與AI算法，提升產品開發週期與模擬精度。

1. 使用繪圖工具或電腦輔助設計（CAD）繪製系統圖、組立圖、裝配圖、順序圖，以描述組件、裝配、系統和機器的功能關係。 2. 設計及評估整廠設備、系統，以符合客戶要求。

本職位隸屬於先進電源中心，主要負責電力電子新技術之開發、評估與導入。團隊在公司內扮演前瞻技術推動的角色，不受特定產品線限制，透過市場研究、技術趨勢分析與客戶交流，持續探索具發展潛力之電力電子應用與關鍵技術。 在技術發展過程中，團隊不僅關注理論與概念驗證，更強調技術實際落地與產品導入，評估新技術與公司中長期發展方向的契合度，並逐步推動至實際產品開發流程中。 在此職位中，你將參與電力電子相關技術的開發與驗證，從電路設計、模擬分析到實際量測與問題解析，逐步累積完整的硬體開發能力。你將有機會參與從技術評估、設計實作到問題改善的完整開發流程，而非僅限於單一任務。 同時，你也會與熱流、Layout、機構等跨領域團隊合作，在實際專案中理解產品整體設計邏輯，培養系統整合能力與工程溝通能力。

1. 負責高效能散熱模組及致冷晶片系統等高可靠度電子產品的結構設計。 2. 熟練運用 3D CAD 軟體進行精密建模、公差分析、2D 工程圖面繪製及 GD&T 標註，確保設計具備高製造性（DFM）。 3. 運用CFD模擬（如ANSYS Icepak、FloTHERM）進行熱流分析與優化散熱架構並評估潛在熱風險。 4. 主導符合車用規範（如 IATF 16949，APQP等）的機構設計，規劃並執行嚴格的環境試驗、機械應力與可靠度驗證（如冷熱衝擊、震動、高溫高濕測試）。 5. 主導產品設計流程（EVT / DVT / PVT），與製程、模具及品保團隊緊密配合，解決試產階段的技術瓶頸，順利導入跨國或在地規模量產。 6. 與材料、模具及零件供應商進行技術規格對接，評估關鍵零組件（如 TEC、均溫板、散/導熱元件 等）之可行性。 7. 完成其他主管交辦事項。

1. 使用繪圖工具或電腦輔助設計和軟體，協助製圖員設計新研發產品的架構。 2. 研究、設計、評估、安裝、操作及維護機械產品、設備、系統與程序，以符合要求。 3. 執行機械相關研發工作（如：應力分析、機構、振動、熱傳、冷凍、噪音、流力、固力、動力學等）。 4. 測試、檢測與分析設備、組件和系統之可行性、設計、操作和性能表現。 5. 研究和分析客戶設計規劃、產品規格、說明書等資料，以評估可行性、及維修需求。 6. 監督機器設備的安裝、操作與維修，以確保其符合使用說明書的操作流程。 7. 建立工作日誌與設備管理檔案。 8. 解決系統故障問題，並提供技術訊息。 9. 診斷設備故障原因，並提供維修小組改善建議。

1.機構部組織架構設計、調整、管理 2.指導新產品開發機構設計構想與功能設計,系統散熱設計、開發與驗證熱解決方案 3.產品問題分析與追蹤、工程樣品製作與新產品研發與測試驗證 4.機構2D, 3D圖面設計、模具發包、開模、試模等流程監督 5.指導產品設計input/output審查

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