轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Responsibilities: Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency. 1. Develop and maintain baselines, including setting up recipes. (1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications. (2) Responsible for transferring metrology solutions to volume manufacturing. 2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel. (1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency. (2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16521&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking a highly motivated and talented R&D Engineer to join our team in developing advanced IC packaging technologies. This position offers an exciting opportunity to work on cutting-edge solutions, such as CoWoS (Chip-on-Wafer-on-Substrate), Fan-Out Wafer Level Packaging (FOWLP), and 3DIC (Three-Dimensional Integrated Circuits). The ideal candidate will have strong technical expertise and a passion for innovation in semiconductor packaging design and analysis. Join us in shaping the future of advanced IC packaging technologies and contributing to groundbreaking innovations in the semiconductor industry. This role provides a unique opportunity to work in a dynamic environment, solve challenging engineering problems, and make a meaningful impact on next-generation packaging solutions. Responsibilities: 1. Conduct risk assessments and provide mitigation plans for IC packages through simulation and experiment, interpreting experimental data and simulation to provide insights into material selection and design improvements. 2. Practice FEM and DOE in problem solving and path finding particularly on packaging. Conduct mechanical or thermal simulations using finite element analysis (FEA) techniques to evaluate and optimize packaging performance, and analyze stress, deformation, and heat dissipation characteristics to ensure reliability and efficiency of packaging designs. 3. Continuously improve simulation methodology, refine material modeling, and enhance script automation capabilities. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1.雷達車結構圖設計及規劃。 2.雷達系統機械設計。 3.結構熱傳分析模擬。 4.機械檢驗及系統工程。 5.自動化測試系統設計、測試、除錯及驗證。 6.自動化產線規劃、設計、測試及驗證。

大葉大學機械與自動化工程學系聘任專任教師乙名徵才公告（一） 人員類別 專任教師 職 稱 助理教授級（含）以上 學 系 機械與自動化工程學系 名 額 1名 性 別 不拘 待 遇 面議（依本校規定辦理） 聘任日期 115年8月1日起 收件截止日期 115年3月31日（週二）前（以郵戳為憑），請將應徵資料郵寄至「515 彰化縣大村鄉學府路168號 大葉大學人事室收」（信封請註明：「應徵機械與自動化工程學系教師）。 資格條件 1. 需有國內外機械相關理工科博士學位，或具助理教授（含）以上資格。 2. 具固力、熱流、控制、製造專長。 3. 具備研發能量、產學合作經驗、業界實務工作及國際交流經驗者尤佳。 4. 需具備全英文授課能力，外籍師資或具國外學位者尤佳。 檢附證件 1. 履歷自傳（含學經歷及各項服務）。 2. 近5年的著作目錄、重要著作影本（請務必加註SCI、EI、Impact Factor）。 3. 教師證書影本（已具教師資格者）。 4. 學位證書及成績單影本（國外學歷畢業證書除英文外需附譯本，學位證書、成績單均須駐外單位查驗）。 5. 可開授課程一覽表。 6. 其他足資證明資格或有助審查之資料，如計畫、獲獎等。 7. 應徵教師資料一覽表，格式如附件。 ※初審合格者將通知面試，請務必註明方便聯絡之電話及 E-mail （資格不符者恕不通知與退件）。 ※提交的申請資料將不予退還 聯絡方式 人事室：徐先生 04-8511888轉1705/ po2200@mail.dyu.edu.tw 機械系：林小姐 04-8511888轉2101/ me5010@mail.dyu.edu.tw 大葉大學機械與自動化工程學系聘任專任教師乙名徵才公告（二） 人員類別 專任教師 職 稱 講師（含）以上或講師級專業技術人員 學 系 機械與自動化工程學系 名 額 1名 性 別 不拘 待 遇 面議（依本校規定辦理） 聘任日期 115年8月1日起 收件截止日期 115年3月31日（週二）前（以郵戳為憑），請將應徵資料郵寄至「515 彰化縣大村鄉學府路168號 大葉大學人事室收」（信封請註明：「應徵機械與自動化工程學系教師）。 資格條件 應聘講師需有國內外機械相關理工科碩士學位以上資格及下述三項。 應聘講師級專業技術人員需具大學主修機械或相關科系，從事CNC機械相性質相關之專業性工作六年以上，具有特殊造詣或成就者及下述三項。 1. 具CNC或機械相關乙級證照專長。 2. 具備研發能量、產學合作經驗、業界實務工作及國際交流經驗者尤佳。 3. 具備全英文授課能力，外籍師資或具國外學位者尤佳。 檢附證件 1. 履歷自傳（含學經歷及各項服務）。 2. 近5年的著作目錄、重要著作影本（請務必加註SCI、EI、Impact Factor）。 3. 教師證書影本（已具教師資格者）。 4. 學位證書及成績單影本（國外學歷畢業證書除英文外需附譯本，學位證書、成績單均須駐外單位查驗） 。 5. 可開授課程一覽表。 6. 其他足資證明資格或有助審查之資料，如計畫、獲獎等。 7. 應徵教師資料一覽表，格式如附件 ※初審合格者將通知面試，請務必註明方便聯絡之電話及 E-mail （資格不符者恕不通知與退件） ※提交的申請資料將不予退還 聯絡方式 人事室：徐先生 04-8511888轉1705/ po2200@mail.dyu.edu.tw 機械系：林小姐 04-8511888轉2101/ me5010@mail.dyu.edu.tw

本職務為開發全球市占率最高的快速冷熱循環測試機，產品應用涵括半導體製造-IC設計、封裝測試及航太、網通、車用等領域 產品相關資訊可以下網址 https://mpi-thermal.com/ Youtube (https://www.youtube.com/channel/UCT455PWQicA5nKCgGYi5qmA) △工作內容： (1)全新系列冷熱衝擊機開發及轉產 (2)冷熱衝擊機開發搭配治具開發 一、專業發展： 1. 參與全新系列快速冷熱循環測試機開發、試量產及轉產 2. 與製造部產品工程師合作，進行模組轉量產 3. 跟部門合作進行工變，以持續提升產品性能及品質 4. 有機會與美籍專業人員進行合作，提升專業及英語能力 5. 提升自我，可上公司內部及外部之專業學習課程 二、日常實務： 廠內有個人辦公空間且無須進無塵室穿脫無塵衣，並提供廠內專員廚房烹調之三餐+宵夜(特選外食)。 該產品應用層面廣泛，你將進入半導體產業相關領域。 部門管理風氣銜接美式管理，可自由發言與構思討論，以扁平化組織架構為主。 ※部門提供免費小點心、下午茶

1.汽車與工業電子散熱產品專案設計與開發。 2.研究與發展汽車與工業電子產業BLDC馬達驅動與控制前瞻技術。 3.閱讀、分析客戶或市場需求技術規格或訊息，產出技術報告或設計方案。 4.主導電子與相關零部件試量產與承認作業。 5.依TS16949要求產出產品DFMEA、控制計畫等工程文件。

1. 汽車與工業電子散熱產品專案設計與開發。 2. 研究與發展汽車與工業電子散熱產品機構前瞻技術。 3. 閱讀、分析客戶或市場需求技術規格或訊息，產出技術報告或設計方案。 4. 主導產品、機構零部件試量產與承認作業。 5. 依TS16949要求產出產品DFMEA、控制計畫等工程文件。

1. 標準工時建立與維護 2. 線平衡改善 3. 工時、效率、成本分析 4. 專案評估、Layout規劃 5. 試產工時量測、作業手法評估、治工具規劃、問題對策 6. 製程相關文件維護 7. 具工業物聯網(IIoT)相關經驗尤佳