轉職熱搜工作

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Role Introduction: • We are looking for talented mechanical engineer who has experience in mechanical system design of process machine. • You will become team member of DSC product engineering team, your responsibility is to demonstrate your design skill to fulfill any requirements of product development. • You will be working in an international working environment. We expect the candidate is fluent in English, with mature communication and teamwork skill for better efficiency. Your mission: • Demonstrate your design skill for designing and optimizing the mechanical module of the DSC lithography process machine. • Possess strong DOE ability for system error analysis and execute test plan. • Involved in NPI project to MFG team for new system, feature and technology. Perform trouble shooting, technical support and process improvements to fulfill the goal of production output. • Involved in CIP and maintenance project for mature product. • Initiate and validate engineering changes and familiar with ERP system for document management. • Strong mindset and experience of risk assessment, cost evaluation and cross function cooperation. Business travel requirement: • Less than 2 month a year.

1. 結構強度模擬分析(Server/AI Server等) 2. 支援結構性測試(衝擊/震動/落摔)送測-台灣 3. 支援熱傳溫度/噪音測試-台灣 4. 偕同不同function team合作進行驗證、分析與解決問題 5. 模擬新技術導入與研究 6. 模擬工具二次開發

1. 大型連線自動化設備機構方案規劃和技術指導； 2. 點膠雷射&貼膜組立等自動化設備機構方案評估及結構設計； 3.點膠雷射及貼膜組立等設備的核心工藝實驗，驗證，及可行性報告產出； 4. 現場設備的調試優化改善及異常處理 5.機構標準化文件的制定與發行 *須配合職務需求出差派駐

1.系統散熱與噪音設計(System Thermal and Acoustic Design) 2.專案在散熱部分的執行(Project execution on thermal related portion) 3.散熱驗證(Thermal validation) 4.開發新技術(Develop new thermal technology) ※依學經歷、工作年資敘薪

You will be at the forefront of our business expansion. This role focuses exclusively on the Pre-award Phase of ODM projects. As the technical brain and driving force behind new project development, you will lead cross-functional R&D teams under highly challenging timelines to transform ambiguous customer requirements into commercially competitive technical proposals. You must possess both the logical mindset of an engineer and the sharp acumen of a business professional, delicately balancing specifications, costs, and schedules to help the company secure flagship projects from global brands. Key Responsibilities: 1. Lead the RFI/RFQ Evaluation Process: Upon receiving initial customer requirements, rapidly establish evaluation baselines and assumptions. Initiate and lead cross-functional R&D teams (EE, ME, Thermal, RF, etc.) to conduct technical Feasibility Studies. 2. Technical Pitching & Communication: Transform complex hardware architectures into highly persuasive commercial technical presentations (R&D Proposals). Partner with the Sales team to pitch to customers, handle technical Q&A, and showcase the company‘s R&D capabilities. 3. Cross-Functional Coordination & Negotiation: In resource-constrained environments, leverage your influence to coordinate evaluation progress across various R&D departments to meet aggressive deadlines. 4. Cost & NRE Assessment: Collaborate closely with Sales and Engineering teams to accurately estimate the system BOM cost and Non-Recurring Engineering (NRE) expenses. Proactively guide the team through specification trade-offs or design optimizations when costs exceed targets. Minimum Qualifications: 1. Education: Bachelor’s or Master’s degree, preferably in Electrical, Electronic, Mechanical Engineering, Computer Science, or Engineering Management. 2. Industry Experience: 3+ years of experience in the system manufacturing industry (PC, Laptops, or Networking products), with at least 3 years as a TPM, PM, or R&D Engineer. Deep understanding of hardware system architectures and the NPI development process. 3. Language Skills: Fluent in English (capable of directly conducting meetings, presentations, and technical negotiations with international brand customers). Core Traits: 1. Tolerance for Ambiguity: Courageous enough to make reasonable assumptions and drive projects forward even with incomplete information. 2. Extreme Resilience & Time Management: Capable of multitasking under tight timeframes, remaining organized and focused when facing high-pressure deadlines. 3. Business Acumen: Highly sensitive to numbers, able to find the optimal balance between technical integrity and commercial profitability.

協助高密度伺服器機櫃與電子產品的結構強度分析與散熱方案設計；參與熱源模型建立與 CFD 流體力學模擬分析驗證。配合團隊規劃溫升、風洞與噪音實測計畫，協助執行新材料的選用評估與 Mockup 樣品之組裝性能解析，學習極致散熱解決方案。 Assist in structural strength analysis and thermal design for high-density server racks and electronic products. Participate in thermal model building and CFD simulation validation. Support temperature rise, wind tunnel, and noise testing. Assist in evaluating new materials and analyzing mockup assembly performance.

1.負責 EC（Embedded Controller）韌體設計、開發與維護 2.依據系統需求（BIOS / OS / HW）開發 EC firmware 功能模組 （Power Sequence、Thermal、Fan、Keyboard、Battery、PD、LED、GPIO 等） 3.與硬體、BIOS、PD、Platform、製造端協作，進行系統整合與除錯 4.負責 EC 與 BIOS / OS 之間通訊機制 （ACPI / SCI / SMI / HID / SMBus / I2C / UART） 5.處理 EC 相關 Bring-up、Debug、Issue 分析與量產支援 6.撰寫與維護韌體設計文件、規格說明與驗證報告 7.依專案需求支援 EVT / DVT / PVT / MP 各階段

1.具備2D，3D CAD 繪圖能力(使用Autodesk Inventor 軟體者尤佳。) 2.機械結構設計 3.確認圖規畫作業 4.設計變更作業 5.現場異常處理

崗位職責 1.市場開拓與客戶開發 在銷售業務開發經理的指導下開發工業客戶（如資料中心營運商、晶片半導體製造商、汽車核心零部件製造商、醫療設備企業等），推動散熱系統（Heat Sink、Liquid Cooling、Thermal Interface Materials）的銷售增長。 透過精準行銷（LinkedIn 主動觸達、行業展會、技術研討會）識別高潛力目標客戶，並在銷售業務開發經理的指導下制定客製化解決方案。 2.銷售業績達成 進入美國網際網路／半導體科技行業大客戶的供應商名錄。 執行個人銷售目標，透過 CRM 系統管理商機漏斗，確保季度／年度營收達標。 在開發新客戶的同時維護既有客戶關係，推動回購及交叉銷售（如配套耗材、升級服務）。 3.跨部門協作 與技術團隊合作優化產品方案，參與客戶客製化需求評審會議。 聯動供應鏈部門解決客戶交付週期、庫存週轉等問題，提升客戶滿意度。 任職要求 教育背景 1.本科及以上學歷，市場行銷、機械工程、材料科學或相關專業優先。 2.工作經驗 三年工業設備／B 端產品銷售經驗，具半導體、電子製造或新能源領域背景者優先。 具備新客戶開發能力者優先。 3.核心技能 技術理解力：能解讀散熱解決方案的關鍵資訊，並轉化為客戶能理解的語言。 跨文化溝通：英文流利（商務談判級），熟悉商業文化與談判習慣。 CRM 與工具：具備 Salesforce、HubSpot 等系統使用經驗，擅長以數據驅動銷售策略制定。 4.行業知識 了解散熱行業的關鍵應用場景（如資料中心冷卻、電動車電池熱管理、5G 基站散熱）。 我們期待的候選人特質 結果導向：過往業績優異，能快速適應快節奏的市場變化。 抗壓能力：能在複雜的銷售週期（如長週期技術驗證項目）中保持韌性，持續推動進展。 資源整合：具備本地客戶網路或行業專家資源者優先。