轉職熱搜工作

1. 使用3D繪圖軟體，研發(NB/Sever)設計散熱模組產品 2. 產品之設計方案，並與廠商及客戶討論修正 3. 產品之設計方案，進行樣品製作及驗證，並導入工廠試量產 4. 撰寫散熱模組產品之相關報告 5. 主管交辦事項 6.NB風扇問題點分析及解決

1. 網通產品機構設計 2. 機構圖檔設計審查(包含干涉檢查、公差分析) 3.設計提案改善與設計驗證 4.生產問題解決和對策導入 5.各階段試產不良分析與改善

1.設備控制系統軟體需求分析工作 2.運動控制方案硬體框架搭建 3.運動控制方案軟體框架搭建開發 5.專案前期參與軟體需求分析 6.流水綫調度演算法、運動控制演算法研發及功能測試計畫制定 7.洞悉業界軟件應用技術動向及發展趨勢，制定軟件應用改進完善計劃 8.設備控制系統軟件功能測試、現場設備重大問題調試等各種技術支持工作 9.制定軟件功能測試方案 *須配合職務需求出差派駐

1.設備控制系統軟件需求分析工作 2.運動控制方案硬體框架搭建 3.運動控制方案軟件框架搭建開發 5.專案前期參與軟件需求分析 6.流水綫調度演算法、運動控制演算法研發及功能測試計畫制定 7.洞悉業界軟件應用技術動向及發展趨勢，制定軟件應用改進完善計劃 8.設備控制系統軟件功能測試、現場設備重大問題調試等各種技術支持工作 9.制定軟件功能測試方案 *須配合職務需求出差派駐

1.現場及控制入料操作 2.能配合加班、輪班 三個月內月薪(28,700~30,200)，不含加班費、輪班津貼變動性薪資。 三個月後月薪(30,200~32,700)，不含加班費、輪班津貼變動性薪資。

【TEAM INTRO】 The Consumer Industrial Design team continues to grow in support of the expanding needs of all consumer market segments. We are looking for talented designers/engineers to help us take on the additional projects and support the company growth. We need designers with the courage to explore new ideas and forms, combined with the ability to collaborate respectfully in a team. 【Job Description】 1. Develop textile-based design concepts using CAD and prototyping, tailored for integration into next-generation wearable devices. 2. Design visually appealing and technically feasible textile solutions that address ergonomic and structural challenges in through-body applications. 3. Define key material targets and performance requirements specific to smart or sensing-enabled textile products. 4. Collaborate closely with suppliers to develop advanced textile materials and fabrication techniques—including embossing and precision printing—to realize functional and aesthetic design intent. 【Qualifications】 1. Bachelor‘s degree in Materials Science, Chemistry, Mechanical Engineering, Industrial Design, or a related discipline. 2. 4–6 years of experience in CMF textile development, ideally with exposure to wearable or skin-contact device applications. 3. Solid understanding of textile structures (knit, woven, non-woven) and manufacturing constraints, especially for integration with electronics components. 4. Familiarity with advanced textile functions such as electrical conductivity, thermal regulation (cooling/heating), elasticity, and antimicrobial properties. 5. Skilled in analyzing trends, user needs, and technical research to derive actionable material and design insights. 6. Proactive and quality-driven, with strong problem-solving capabilities and the ability to contribute effectively to cross-functional development teams.

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs. Responsibilities include: • Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. • Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. • Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. • Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes • Contribute to validation team on improving test plan/method to validate features and verify fixes • Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool • Define and drive the system debug process implementation and ingredient owner engagement and alignment Qualifications: The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following: • Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform • Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels • Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred • Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. • Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. • Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; • Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

工作內容 1.使用繪圖工具或電腦輔助設計（CAD）或草擬設備和軟體，協助製圖員設計新研發產品的架構。 2.研究、設計、評估、安裝、操作及維護機械產品、設備、系統與程序，以符合要求。 3.執行機械相關研發工作（如：應力分析、機構、振動、熱傳、冷凍、噪音、流力、固力、動力學等）。 4.測試、檢測與分析設備、組件和系統之可行性、設計、操作和性能表現。 5.研究和分析客戶設計規劃、產品規格、說明書等資料，以評估可行性、費用及維修需求。

1.設計和優化水冷散熱系統，確保高效熱能管理效能 2.進行散熱模擬與測試，驗證水冷散熱方案性能 3.研究熱傳導、對流等熱學理論應用於散熱設計 4.開發創新散熱結構，提升產品散熱效果與效率 5.評估新型材料與技術於水冷散熱領域中的可行性 6.撰寫水冷散熱相關設計規範和技術文件 7.使用熱模擬軟體進行數據分析與解決設計問題 8.有三年以上相關經驗

本職務為開發全球市占率最高的快速冷熱循環測試機，產品應用涵括半導體製造-IC設計、封裝測試及航太、網通、車用等領域 產品相關資訊可以下網址 https://mpi-thermal.com/ Youtube (https://www.youtube.com/channel/UCT455PWQicA5nKCgGYi5qmA) △工作內容： (1)全新系列冷熱衝擊機開發及轉產 (2)冷熱衝擊機開發搭配治具開發 一、專業發展： 1. 參與全新系列快速冷熱循環測試機開發、試量產及轉產 2. 與製造部產品工程師合作，進行模組轉量產 3. 跟部門合作進行工變，以持續提升產品性能及品質 4. 有機會與美籍專業人員進行合作，提升專業及英語能力 5. 提升自我，可上公司內部及外部之專業學習課程 二、日常實務： 廠內有個人辦公空間且無須進無塵室穿脫無塵衣，並提供廠內專員廚房烹調之三餐+宵夜(特選外食)。 該產品應用層面廣泛，你將進入半導體產業相關領域。 部門管理風氣銜接美式管理，可自由發言與構思討論，以扁平化組織架構為主。 ※部門提供免費小點心、下午茶