轉職熱搜工作

1. 新產品及專案散熱RFP、RFQ及可行性評估 2. 產品散熱模擬/設計/測試/驗證/承認等散熱設計與處理 3. 產品散熱設計相關之新技術研究評估及分析 4. 熟悉網通產品系統散熱設計與散熱元件為佳

1. Package model behavior exploration for warpage and crack by using Ansys mechanical simulation. 2. amelioration by using Ansys optimization algorithm. 3. Thermal dissipation for CFD and coupling-dimensional domains simulation for Joule heat or electromigration / electrophoresis pathfinding. 4. PCB / Substrate / Package physical modeling and simulation optimization for reliability quality.

1. 負責高壓子系統選型、設計與整車整合 2. 負責動力電池管理系統（BMS）與充電系統功能驗證 3. 建立高壓系統驗證計畫，執行電氣安全測試 4. 動力電池散熱能力估算 5. 協調供應商進行硬體開發與軟體整合 6. 整車充電測試（慢充、快充）及相容性驗證 7. 分析及優化高壓系統性能、效率及可靠性 8. 分析營運中車輛異常問題。 9. APQP/PPAP/資料整合作業程序 10. 專案支援，如客戶教育訓練、技術文件撰寫、售服問題點排查 具備條件： 1. 電力電子、電機工程、機械工程、車輛工程相關科系 2. 熟悉高壓系統設計規範（ISO 26262、LV123、GB/T） 3. 熟悉 PDU（Power Distribution Unit）、EVCC（Electric Vehicle Communication Controller）工作原理 4. 熟悉電池充電協定（CCS、CHAdeMO、GB/T） 5. 具備高壓安全設計知識及測試經驗 6. 具備相關整合開發經驗 3 年以上 #薪資待遇為無經歷者起薪，有經歷者於面談時議之。

1. 負責整車剎車系統架構設計、選型及整車整合 2. 設計氣壓系統路徑與元件選型（閥件、管路） 3. 整合 ABS、EBS 系統，完成系統驗證 4. 協助進行整車剎車性能測試（法規測試、性能測試） 5. 撰寫剎車系統技術文件、維修手冊規劃與撰寫 6. 工程BOM建立與維護(系統BOM表管理及圖面發行作業) 7. 車用開發文件準備 (DFMEA/PPAP...) 8. 系統layout與細部設計(負責零部件圖面3D繪製、2D出圖與完成系統組立圖) 9. 參與異常問題分析及改善 10. APQP/PPAP/資料整合作業程序 11. 專案支援，如客戶教育訓練、技術文件撰寫、售服問題點排查 具備條件： 1. 車輛工程、機械工程相關科系本科以上學歷 2. 熟悉氣壓剎車系統架構及 EBS/ABS 功能與規範 3. 具備氣路設計、剎車性能驗證經驗 4. 熟悉相關法規（ECE R131、R151、GB/T 等） 5. 具備使用診斷工具及剎車測試經驗 #薪資待遇為無經歷者起薪，有經歷者於面談時議之。

1. 大型連線自動化設備機構方案規劃和技術指導； 2. 點膠雷射&貼膜組立等自動化設備機構方案評估及結構設計； 3.點膠雷射及貼膜組立等設備的核心工藝實驗，驗證，及可行性報告產出； 4. 現場設備的調試優化改善及異常處理 5.機構標準化文件的制定與發行 *須配合職務需求出差派駐

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=550&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: Apply advanced computational models to predict performance, optimize structure and doping profile, and provide improvement directions in nano-scaled device technologies. Develop and apply finite element method (FEM) modelling, including but not limited to stress simulations, computational fluid-dynamics, thermal conductivity simulations and electromagnetic wave simulations, for both macroscopic (tool/wafer) and microscopic (discrete device) structures. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=22739&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking a talented Mechanical R&D Engineer to drive the development of our next-generation robots. In this role, you will deliver design of advanced robotic arms from concept to prototype validation. Working in a highly collaborative, result-oriented environment, you will solve complex engineering challenges in complex design, structural simulation, and precision motion control. If you are a proactive problem-solver passionate about pushing the boundaries of automation, we invite you to join our team. Responsibilities: 1. Responsible for the mechanical design and structural analysis of robot bodies, manipulator arms, and End-of-Arm Tooling (EOAT). 2. Execute Design for Cleanliness strategies, including particle suppression, negative pressure/airflow management, low-outgassing material selection, and sealing & lubrication design. 3. Conduct simulation and physical validation for structural rigidity, modal analysis, thermal deformation, and positioning accuracy. 4. Collaborate with the control team to define servo motor selection, transmission architecture, and sensor deployment. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1.低碳煉鋼製程開發 2.碳捕捉與再利用製程模擬、製程能源優化與與應用技術開發 3.物質流及環境分析技術開發、水處理開發 4.精密熱流製程研究 5.非破壞檢測技術開發、馬達設計 6.AIoT韌體開發、智慧電網與電力分析 7.鋁合金產品之製程開發與應用 歡迎材料、冶金、化工、化學、機械、電機、機電、電子、航太、能源、控制、資工、資管、統計、工業工程、數學、物理等相關領域之役男應徵。 ※未具研發替代役男身分者，請勿報名。