轉職熱搜工作

1.封裝後段製程良率提升 2.制訂製造程序與產品標準 3.評估製程專案計劃，訂出最適化的製造流程 4.負責新產品製程的導入、檢測，使新產品能夠穩定生產且符合相關標準 具封裝後段(Molding、Marking、植球、切割、AOI...)製程經驗者優先面試。 歡迎理工科系之應屆畢業生、半導體相關產業製程經驗一年以上人士加入。 ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

1. 化學品管理：環安衛風險評估、法規符合性、CCB分級、特定化學物質、製程安全等。 2. 化學品申報：優先管理化學品、公共/工廠危險物品、既有化學物質等。 3. 現場稽查：廠內化學品定期風險查核。 4. 緊急應變：化學品應變演練規劃及執行、應變器材評估。 5. 教育訓練：化學品操作人員安全意識及應變器材操作。 6. 其他專案及主管交辦事項。

1. 處理、分析及規範制定生產流程異常 2. 驗證產品導入量產與改善製程 3. 管理、執行與規畫專案 4. 客戶服務、技術支援 5. 無相關經驗可

崗位職責： 1.依照計畫完成設備廠內的調試與驗證作業； 2.依照計畫完成客戶端設備的架設與交付作業； 3.負責培訓客戶技術人員，處理設備保固期內發生的各類問題。 崗位需求： 1.精通機械組裝、電氣組裝與調試等相關專業技能，能夠看懂機械及電氣圖紙； 2.具備兩年以上非標自動化設備調試或裝配經驗，熟悉機械結構、機械裝配工藝、電氣裝配工藝； 3.具備基礎 PLC 程式設計知識，且熟習至少一款工業機器人的操作與調試； 4.能夠依照部門設備調試計畫，按質按量完成調試與交付任務； 5.可獨立出差至客戶現場處理設備異常，並針對問題分析故障原因； 6.具備良好的溝通能力及組織協調能力。

1. 負責矽晶圓製程設備機台的維護及效能精進。 2. 計畫和執行分析及缺陷等改善專案。 3. 建立新設備所需規範作為採購及系統需求之依據。

※ 年度獎金原則為2個月，九成同仁2個月以上。 ※ 月薪依學、經歷與能力調加。 1.產品開發與進度控管。 2.回應客戶技術服務需求。 3.供應鏈技術溝通與元件選用。 4.參與半導體製程設備或機器人關鍵零組件開發。

1.案件設計執行：依客戶或內部設計需求，完成案件的電路板/載板佈線（Layout）設計。 2.除錯與優化 (Debug)：協助設計案件的除錯與問題分析，確保設計符合規範。 3.新技術開發支援：協助新型機台測試載板的研發與規格開發。 4.案件討論：參與內部案件技術討論，與設計、測試團隊密切溝通，優化整體設計流程。 ★歡迎電子電機相關科系之應屆畢業生，或曾有Layout相關經驗之求職者投遞 ★若您非相關科系畢業，但具備基礎電路學之概念，也歡迎投遞 【薪資說明】 1.本職缺薪資範圍係以大學學歷(相關科系)初估，含設計獎金月薪平均可達4萬以上，且有資格領取超額獎金之人員保證年年調薪。 2.本公司鼓勵多產多得，除每半年依產出計算點數並發放獎金外，每年再依點數達成狀況進行調薪。

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Job Description - Manage and reduce configuration risks Configure monitoring logic, thresholds, and rules to effectively distinguish true signals from noise, reducing false alarms and missed detections that may impact production. - Collaborate across cross-functional teams Work closely with Process, Equipment, Manufacturing, and IT teams to align objectives, communicate technical insights, and drive decisions efficiently. - Support yield improvement and operational performance Leverage monitoring systems to enable actionable insights that contribute to quality improvement, yield enhancement, and manufacturing efficiency. - Ensure project continuity and long-term ownership Demonstrate strong role clarity and accountability, supporting stable system operation, continuous improvement, and sustained project ownership. Requirements - Master‘s degree in Engineering. Chemical, Materials, Electrical and Electronics are preferable. - Within 2 years of working experience in relative field. - Strong ability to analyze process abnormalities, perform root cause analysis, and implement improvements - English proficiency for reading technical documents, report writing, and communication - Proficient in Microsoft Office tools (Excel, PowerPoint, Word) - Familiarity with semiconductor manufacturing and data analysis is a plus