轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=391&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced module process development and baseline sustaining. 2. Process stability/manufacturability improvement for yield and reliability qualification. 3. Working with a team which may include device, integration, yield, module, manufacturing and external suppliers to drive leading-edge integrated module development, control and improvements. 4. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. 5. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 6. Hands-on participation and a strong sense of ownership. 7. Willingness to make frequent fab presence.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=389&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. To be responsible for helping to drive leading edge process/device development and optimization of Flash/CMOS/RF devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15470&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 1. 參與新廠廠務監控系統設計與發包 2. 提出創新、前瞻的技術及架構，創造更安全、穩定及有效率的監控架構 3. 導入國際法規接軌設計，如：UL (US)、CE (Europe)、JIS (Japan) 4. 參與海外設計專案，針對公司目前海外建廠區域（美國、歐洲、日本）

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16295&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 說明: 1. 負責建築設計規劃，包含新建廠房、既有廠房及室內設計。 2. 建置3D模型、CAD圖面、彩現圖及各式報告書製作。 3. 建築相關法規檢討 4. 施工規劃 5. 工程成本評估 6. 設計及專案進度管理

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=505&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 說明: 1. 負責廠務系統與半導體機台連接配管、佈線工程、現場施工、安全及品質管理。 2. 施工配管物料估算及領料、進料管理。 3. 焊接機具及施工工具操作、校正、維護與管理。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=421&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。decade. 說明: 1. 負責伺服器設備軟、硬體安裝及維護，故障處理及規範化運維管理；定期對系統進行監控、評估分析、並提出改進意見和評估報告。 2. 負責電腦及周邊硬體設備軟、硬體安裝及維護，作業系統及辦公、應用軟體的安裝、維護和故障解決。 3. 負責資訊設備資產管理及採購驗收、出入庫房(庫存)管理、設備維修與報廢；撰寫運維技術文檔SOP、工作手冊。 薪資範圍: $39,400 以上

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15389&source=1111&tags=domestic+campus+2025_1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 工作任務: 1. 你喜歡動手解決精密機械、設備問題嗎？ 2. 你想要突破半導體機台量產技術的極限，並持續挑戰未來科技的無限可能嗎？ 3. 〝模組副工程師〝就是最適合你的位置，你將運用最先進的操作系統及AI人工智慧界面來進行設備維修、保養，與公司一起成長，共同突破機台的生產極限，成為推動半導體領域解決問題的工程專業人才！ 工作內容: 1. 負責半導體產品線機台設備維修及保養 2. 管理及改善機台零件系統、包含廠商與下包商之零件備品管理 3. 設計機台保養制具及流程改善以增進機台穩定性 4. 需配合日、夜/假日班輪值(約每四週輪值一次大夜班，一次輪值六天) 5. 加入TSMC ,訓練成為模組副工程師後, 您將享有: A. 挑戰百萬年薪: (1) 高競爭力的薪資水準及獎酬機制 (2) 夜班獎金：每月輪值大夜班一次(六天)除夜班津貼外，另發放鼓勵獎金NT$8,000，每月輪值均能領取，等於每月加薪NT$8,000 (未滿六天按比率計算 ) (3) 分紅獎勵：每季依公司營運獲利分享業績獎金, 讓您1年、4季、12個月都能領取豐厚的薪資獎酬 B. 豐富寬廣的培訓發展，以及職涯升遷: (1) 專業訓練：全球最先進的中科訓練中心，十二吋廠儲備模組副工程師安排六周全職訓練課程 (2) 職涯升遷：垂直往上或水平轉換的職務機會，永不設限 C. 高規格的工作環境: (1) 美食饗宴：24小時提供多樣化異國美食 (2) 休假優給：給予優於勞基法之彈性休假及病假

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=393&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for flash memory and logic products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=388&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. To be responsible for helping to drive leading edge process/device development and optimization of Flash/CMOS/RF devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. 3. Exhibit good and open communication skills, be able to work within cross-functional teams. 4. Fluent in English.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=520&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Electrical RC and Electromagnetic tool related work: 1. Work with TCAD, device and model team to simulate electrical phenomenon by 3D Quasi-Static field solvers or 3D Full-Wave Electromagnetic (EM) field solvers to come out device parasitic RC, interconnect parasitic RCLK (R: resistance, C: capacitance, L: self-inductance, K: mutual-inductance) network or passive device S-parameter/sub-circuit models for digital transient and high speed/frequency circuit simulations. 2. Collaborate with EDA partners to enable required features and target accuracy for RC extraction tools. 3. Develop RC collaterals to meet customers’ tape-out requirements. 4. Analyze RC accuracy issues, perform process and performance impact analysis, and provide novel and effective solutions. RC software related work: 1. RC extraction utility development from LVS database handling, pattern matching to final RC netlist. 2. Define software architecture, specification, algorithms, and functions for future extensions on novel device structures. 3. Software pseudocode and final coding development and maintenance. 4. Interface definition and development among TSMC RC utility and EDA RC tools. 5. Build regression and QA system.