轉職熱搜工作

1. 新產品開發設計與結構評估。 2. 桌上型小型裝置動力機構設計 3. 產品量產導入與設計檢討。 4. 協助量產製造及製程問題排解。 5. 建立設計規則文件與修訂

Hi~您將成為我們產品品質的第一線守護者！我們尋找一位對產品驗證和數據分析具有熱情的專家，加入我們高效能的光電元件研發團隊，共同推動產品從設計到量產的卓越品質 一、封裝製程開發與優化 (Package Process Development) 1.製程設計與導入： 負責 Die Bonding (晶粒黏著)、Wire Bonding (打線接合) 等核心封裝製程的設計、優化與導入。 2.評估與實驗： 執行新設備評估，規劃 DoE (實驗設計) 計畫，協助樣品製作，以驗證製程可行性與最佳參數。 3.文件標準化： 制定標準操作程序 (SOP)、製程參數規範及 QC Flow chart，確保量產品質一致性。 4.經驗加分： 具備光電元件（如雷射、感測器等）相關封裝實務經驗者尤佳。 二、測試驗證與數據分析 (Test Validation & Data Analysis) 1.關鍵測試執行： 規劃並執行 LIV (光電特性測試)、Burn-in (老化測試) 等可靠性驗證流程。 2.自動化與量測： 導入、操作與監控 AOI (自動光學檢測) 自動化測試系統，並執行光電元件的精密量測與整合驗證。 3. 數據分析與追蹤： 進行深入的資料分析與失效分析 (Failure Analysis)，精準識別、記錄並追蹤產品缺陷，提供研發團隊明確的改善建議。 三、設備維護與異常排除 (Equipment & Process Maintenance) 1.異常處理： 負責封裝與測試相關設備的異常問題排除、維護與定期保養。 2.資產管理： 負責設備零件的有效管理與備品庫存控制。 3.處理主管交辦的臨時或重點支援事項。

1. 樣品分析前製作準備(上膠，裂片，Marking)。 2. 協助實驗室機台操作，並學習相關技術。 3. 遵循現場主管指示進行作業

國內業務 開發潛在客戶，推廣業務，詳細工作內容面談 熟悉印刷電路板(PCB),電解銅箔,半導體封裝,平面顯示器(FPD),太陽能,軟性電子,觸控面板(Touch Panel),光電,光學塗佈薄膜,IMD產業背景等相關產業經驗尤佳.(以上產業有其中之一的相關經驗即可) 要求條件： 1、注重人格特質。 2、個性主動積極、認真、責任心重。 3、有極佳的工作態度及高度服務熱忱。 4、願追求自我成長、接受工作挑戰。 5、具有日文語言方面技能尤佳。 6、具有印刷電路板(PCB)、光學薄膜、化學工程等相關產業經驗尤佳。 7、有相關經驗者尤佳，無經驗者可培訓

1. 半導體廠製程管線規劃、設計和施工之監工管理。 2. 機電系統規劃、設計、施工之監工管理。 3. 須具備與公司內部及協力廠商溝通協調、團隊合作之能力。 3. 能配合工地視勘作業。 4. 製作、整理、保存施工紀錄與相關文件資料。 5. 願接受培訓。 6. 須具備基礎文書能力。 7. 須有自小客車駕照。 8. 需配合公司需求外派(國內)

Responsible for overseeing on-site construction activities, schedule control, quality assurance, and coordination among subcontractors for semiconductor fab projects. Ensures compliance with client, quality, and schedule requirements. 負責半導體晶圓廠建設現場之施工管理、進度控管、品質監督及跨單位協調，確保施工活動符合客戶、品質與時程要求。 【Qualifications｜任職資格】 •Bachelor’s degree in Engineering or related field. •工程相關科系大學以上。 •5+ years of construction site experience. •五年以上工地經驗。 •Semiconductor or cleanroom experience preferred. 半導體或無塵室經驗者佳。 •Familiar with construction drawings and coordination. 熟悉施工圖與現場協調。 •English/Chinese bilingual preferred. 具中英文能力者佳。 【Required Certifications｜必要證照】 •OSHA 30 (Construction) •Scissor Lift / Boom Lift（視需求） 【Working Conditions｜工作環境】 •Work Location: Arizona, USA. 上班地點：美國亞利桑那州 •Semiconductor fab construction site. 半導體晶圓廠建設工地 •PPE required. (EX：respirator, cleanroom garments, fall protection) 需穿戴個人防護用具。（如：安全帽、無塵衣、防墜器等） •Possible overtime / weekend work. 可能需要加班或假日工作 【Salary Range｜薪資範圍】 •Annual Salary: USD $72,000 – $85,000最終薪資依經驗、證照與專案範圍調整。 【Job Responsibilities｜工作職責】 1. Supervise construction activities / 現場施工管理 2. Coordinate subcontractors / 承包商協調 3. Monitor schedule and progress / 進度管理 4. Ensure quality control / 品質管理 5. Enforce safety compliance / 安全管理落實 6. Review documents / 文件審查 7. Manage permits and work conditions / 作業條件管理 8. Report and documentation / 回報與文件管理險作業 9. Client coordination / 客戶協調 10. Problem solving / 現場問題處理 【Preferred Skills｜技能要求】 Technical Skills｜技術能力 •Strong knowledge of semiconductor process piping systems including UPW, PV, and Drain systems. 熟悉半導體製程管路系統（超純水、製程真空、排水系統）。 •Hands-on experience in plastic piping installation (PVC, CPVC, PP, PVDF) and related joining methods. 具備塑膠管路（PVC、CPVC、PP、PVDF）施工與接合經驗（如膠合、熱熔）。 •Familiar with UPW system requirements, including cleanliness, flushing, and contamination control. 熟悉超純水系統要求（潔淨度、沖洗、污染控制）。 •Experience in Drain Pan installation, slope control, and leak prevention practices. 具備排水盤施工、坡度控制與防漏管理經驗。 •Ability to read and interpret P&ID, isometric drawings, spool drawings, and shop drawings. 能視能讀 P&ID、等角圖、預製圖與施工圖。 •Experience in prefabrication (spooling) and field installation coordination. 具備預製（spool）與現場安裝協調經驗。 •Familiar with cleanroom construction protocols, including material handling and protection. 熟悉無塵室施工規範（材料保護與搬運）。 •Knowledge of pipe support installation, alignment, and tolerance control. 熟悉管架安裝、對位與公差控制。 •Experience with hydro test, leak test, flushing, and system turnover procedures 具備水壓測試、洩漏測試、沖洗與系統移交流程經驗。 •Familiar with TSMC specifications and semiconductor construction standards. 熟悉台積電規範與半導體建廠標準。 •Understanding of PTW system and high-risk activities (LOTO, confined space, hot work). 了解作業許可制度與高風險作業（上鎖掛牌、密閉空間、動火）。 •Basic knowledge of OSHA safety standards and site compliance requirements. 具備 OSHA 安全規範基本認知。 •Proficient in daily reporting, progress tracking, and coordination documentation. 熟悉日報、進度追蹤與協調文件管理。

1.自動化設備、專用機、機構設計開發、須具獨立執行開發作業能力。 2.提昇設備產能稼動率與生產效率 3.市購件評估與選用、加工廠商之評估、精通材質選用與各加工系統。 4.治工具設計 , 組裝治具製程改善 , 有設計製圖能力 , 製程改善

This position manages the day-to-day operations of the site technology team, including people management. The position will lead the team to provide technology expertise to support penetration and defense strategies. Manage technical resources to secure, explore and win application market share. **This position will be assigned to work in Arizona, USA, after one year training in Taiwan. ** Job Duties and Responsibilities (70％) • Manage day-to-day operations of the Field Process team to ensure smooth execution and alignment with business objectives. • Understand key customers’ technology roadmaps, process flows, inflection points, requirements, and business challenges; identify opportunities where the company can add value. • Represent the company professionally to customers, develop and maintain strong relationships, and ensure continued customer satisfaction with process solutions and initiatives within the assigned territory or function. • Collaborate with customers to identify business opportunities by: o Understanding customer needs. o Positioning the company’s product and technical value. o Working with the Account team to develop penetration and defense strategies. o Coordinating with the Global Product Group on product demonstrations. • Manage penetration and defense projects by: o Supporting the Account team in project strategy development. o Driving local and corporate teams to execute projects within committed timelines and resources. o Managing competency and manpower resources. o Engaging and managing customer relationships throughout the project lifecycle. • Serve as a trusted subject matter expert and partner to customers (internal and external), delivering technical solutions that enhance customer perception of the company. • Provide regional technical leadership for processes, including resolving customer issues, improving productivity, and supporting installation activities. • Work closely with Product Groups and Account Teams to drive technical solutions and ensure compliance with escalation policies. • Ensure safety compliance by identifying hazardous environments and providing ongoing safety training to the engineering team. • Perform other duties as assigned by the immediate supervisor. People Management (30％) • Direct and supervise day-to-day work and projects of direct reports. • Manage competency and manpower resources within the team to meet customer needs. • Oversee annual performance management and development exercises for direct reports. • Drive training and development initiatives for team members. • Mentor high-potential personnel to build a stronger team and create growth opportunities for qualified internal candidates.

1.設備維修保養及巡檢 2.設備清洗、更換護板 3.異常排除 4.主管交辦事務 5. 職稱核定將視個人學經歷背景略作調整 ※依個人經歷予以敘薪

1. 監控與維護自動化生產設備（搬運機器人、自動測試設備等）。 2. 收集與分析設備運行數據，支援製程改善與自動化專案。 3. 協助新設備導入、測試與自動化流程優化。 4. 與製程工程師、設備工程師及 IT 團隊合作解決設備及系統問題。 5. 遵守晶圓廠 Cleanroom 規範及設備操作安全規範。 條件要求 • 專科或以上機電、自動化、電機或相關科系畢業。 • 具備自動化設備排除故障經驗。 • 能接受輪班。 加分條件 • 半導體晶圓廠工作經驗者優先。 • 英文讀寫能力佳，可閱讀技術文件。