轉職熱搜工作

1. 先進封裝治具策略：Large BGA 與 CoWoS oS 產品治具研發，於 NPI 階段制定最符合製程需求之治具架構與方向。 2. 治具模擬：以扎實的理論背景與數據支持設計決策，確保治具在實際製程中的可靠度。 3. 製程節點優化：深入理解FCB與MR Reflow製程的關鍵節點，確保治具能完美匹配並提升製程良率。 4. 跨部門技術指導：作為治具開發的技術決策者，定義設計方向後，與相關執行單位進行細部設計、實體製作與測試驗證。

1. 應力結構設計與開發：針對 Large FCBGA 與 oS 產品，定義並開發最佳的應力封裝結構設計，掌握產品設計的關鍵節點 (Key nodes)。 2. NPI 階段應力預測與模擬：NPI 階段全面預測並防範所有潛在的應力相關風險與物理破壞。 3. 問題根因分析與設計優化：精準剖析並指出應力問題所在（如：材料匹配性、結構設計缺陷、製程變異等），進而提出有效的調整與改善方案。 4. 封裝材料特性研究：深入理解並評估各類封裝材料（如 Underfill 底部填充劑等）的物理特性與應力表現，確保材料與結構設計的完美匹配。

瑞昱半導體【科技專才創造力學程實習計劃】將提供本計劃實習生： 1. 科技專才培育：規劃實習同仁專屬五大面向課程，培養專業、開發思考與創造力。 2. 賦予研究專題與實質任務。 3. 科別專責輔導員：每位實習生設有專屬輔導者，協助專業學習及問題引導。 實習期間：於2026年7月至8月進行專案實習與活動安排。 實習時間：週一至週五8:30-17:30，週休二日。 實習地點：瑞昱新竹一廠、二/三廠及生醫廠。 招募對象： 大三(含)以上、碩士班或博士班之電子、電機、電信、電控、資工、資科等相關科系在學生，具下列任一條件者佳： a. 熟悉 C語言或VB. b. 熟悉 Office, OrCAD c. 對RF測試、測試程式開發及維護有興趣者。 d. 對Probe card, Load board電路設計、產品良率的改善有興趣者。

主要職責： 一、現場技術支援與故障分析 - 於客戶現場及委外半導體封裝測試廠（OSAT）進行產品維護與維修。 - 執行初步故障排除與故障分析，記錄並評估電性輸出數據。 - 解讀測試機數據紀錄，協助故障分析。 - 與公司內部工程團隊（設計、製造、品質工程）協作，進行深入分析並導入可持續的解決方案。 - 支援系統性根本原因調查，收集相關資料並撰寫詳盡且準確的服務報告。 - 主導對外客戶溝通：管理客戶期待、清楚呈現分析結果，並在必要時協助緩解問題升級。 二、內部跨部門協作 - 與同事、技術銷售工程師、專案經理、品質工程師及設計中心密切合作，傳達客戶需求與技術風險。 - 主動分享知識與經驗，支援團隊成員。 - 將客戶回饋轉化為具體可執行的任務，並確保各部門了解其工作背後的目的與意義。 - 作為公司內部團隊與客戶之間的緩衝角色，適當處理問題，維持穩定的合作關係。

We are seeking a highly skilled and motivated Field Application Engineer to provide advanced customer engineering support across our key semiconductor customers. This role will act as a critical technical interface between customers and our internal teams, focusing on problem solving, project execution, and proactive alignment with customer requirements and technology roadmaps. The successful candidate will play a hands-on role in delivering world-class technical support, ensuring rapid issue resolution, and strengthening long-term customer relationships. Key Responsibilities: 1. Advanced Technical Support · Provide expert-level advice on hardware requirements to enable successful loadboard/module design projects. · Conduct schematic capture, component placement, and routing support when needed to address complex technical challenges. · Act as a senior technical resource for diagnosing hardware-related feasibility and performance issues. 2. Customer Engagement & Relationship Building · Gather and validate customer requirements to ensure sufficient information for initiating design projects. · Serve as the primary technical contact, managing expectations and maintaining clear communication with customer engineering teams. · Manage customer interactions throughout the project lifecycle to ensure satisfaction and successful delivery. 3. Application Engineering & Solution Development · Assess and estimate project schedule, cost, and feasibility to define realistic plans. · Support design-in activities by translating customer requirements into technical hardware solutions. · Deliver technical updates, training, and presentations to customers and internal stakeholders. 4. Cross-Functional Collaboration · Collaborate with internal design and project management teams to align project execution with customer requirements. · Provide structured feedback from design projects to influence product development and continuous improvement. · Ensure alignment of project execution with both tactical problem solving and longer-term strategic direction. Preferred Traits: · Resilient and Professional Under Pressure – Remains calm and constructive when facing challenges, escalations, or changing requirements. · Proactive Problem Solver with Strong Ownership – Takes initiative, drives resolution, and ensures customer satisfaction while balancing immediate issue-solving with long-term improvements. · Collaborative and Organized Team Player – Demonstrates a positive “can-do” attitude, manages multiple priorities effectively, and works seamlessly with cross-functional and global teams. This job description serves as a general guide to the responsibilities and qualifications expected for the role and may be subject to modification based on the specific needs of the organization.

DIS Tech’s Project Management team designs custom hardware connecting DUTs to ATE testers (e.g., Teradyne, Advantest). We’re hiring a Project Manager to lead interface projects from concept to delivery. This customer-facing role involves translating requirements into test hardware while managing timelines, resources, and scope. Ideal candidates are engineers ready to grow into leadership, with strong communication, spatial reasoning, attention to detail, and urgency. Mentorship and hands-on training provided. Key Responsibilities: • As a Project Manager, you will be responsible for leading, executing and managing all the engineering activities of the new product design and development project with a high degree of independence and creativity. • Work closely with customers (both internal and external) to gather requirements and acceptance criteria. • Perform project sizing (scope, cost, schedule). • Create statement of work to align clearly with customer about scope, deliverables, schedule, acceptance criteria, risks and mitigation plan. • Create, track and manage detailed project plans and keep customers informed of project status. • Track, assess and communicate impact of changes (change management). • Drive PCB schematic and layout design, working with internal PCB design team. • Drive SI/PI performance optimization, working with internal simulation team. • Manage design reviews and milestone approvals. • Understand our supplier’s DFM rules/requirements/capabilities, and guide design accordingly. • Define PCB materials, stack-up, layout rules. • Work with operations team to ensure project manufacture/assembly/logistics are on-track, lead to resolve any schedule slipping by working out improvement plan • Provide continuous technical support for products already in the field. • Visit or travel to DIS Tech and customer sites as required. • Attend periodic night-time meetings with customers or teams in other regions (EU, US oversea customer when needed).

1. 產品測試應用程式開發 2. 測試治具設計&驗證 3. 硬體與測試載板的開發、設計、驗證與維護 4. 原理圖和電路設計 5. API&網頁介面程式開發

Responsible for building Sigurd‘s test solutions either through software approach or hardware design from basic DC, digital, to the advance mixed-signal and RF circuits

1.協同客戶產品開發支援 2.客戶端產品支援 3.半導體用複合材料市場應用、開發 有半導體領域或封裝、散熱產業工作經驗者尤佳