轉職熱搜工作

Ø Proficient at acoustic design. (Acoustic Electronics, and Mechanics) Ø Proficient at audio and voice tuning.(EQ, 3GPP, HD-Voice, DSP Audio) Ø Proficient at audio circuit. Ø Support factory on-site for production. Ø Knowledge or ability on acoustic simulation is plus. [工作能力需求] Ø Fluent English. Ø 5+ years experience in acoustic design of products.

DL : work experience over 7 years at least on ARM platform. DE : work experience over 3 years at least on ARM platform.

聲光學硬體理級主管 1.As a Hardware Manager in Compal of Nanjing, you’ll be engaged in active development of companies audio/optical cutting edge technology for products, involved in advanced and challenging embedded and consumer audio/optical products. 2.The role will also require working with company internal software engineering as well as company customers/partners. 3.In this position you will be responsible for leading the development, design and project management and also work “hands-on” 4Experience in Embedded processor based product. 5.Advantage for Qualcomm/MTK/Intel based product development experience. 6.Some level of knowledge of working with Android/Linux operating system. 7.Deep understanding of High Speed Board design concepts. 8.Deep understanding of EMC. 9.Experience in Acoustic Design/Requirements for mobile phone. 10.Experience in Camera Image Quality tuning. 11.Experience in Display/Touch Panel Design. 12.Experience with Product Mass Deployment. 13.Wide system level understanding. 14.Independent, strong self-learning and self-management skills. 15.Experience with customer engagement.

1.硬體部門研發管理 2.新嵌入式技術研究及導入 3.新產品研發及品質改良 1.具伺服器主機板或系統之硬體開發經驗12年以上, 並有實際績效 2.熟悉電腦主機板研發流程 3.具主管經歷8年以上, 以身作則, 有領導3人以上研發團隊的經驗 4.英文聽說讀寫具中等程度以上 5.具改善研發流程之熱忱, 主動積極, 勇於面對問題找出解決方案 6.具研究及提升部門技術能力及導入新技術之研究能力者

智慧型手機硬體設計及系統規劃開發 1. 具 Samrt Phone、手機、PDA 等產品硬體研發5年以上經驗 2. 具部級主管經驗 3. 熟 ARM SoC architecture, high speed HW design

機器人產品硬體設計主任/高級工程師 大學以上電子/電機系所畢, 具3年以上崁入式系統電路設計或機器人電子電路和機電整合經驗, 具感測器電路整合與馬達控制相關能力， 熟C語言程式設計、OrCad及Allegro View尤佳。

[工作內容] HW research and development experience in small cell products, familiar with communication system hardware architecture and circuit design, digital / wireless / analog / power circuit integrator is preferred. -Familiar with Samllcell RF transceiver architecture -RF circuit design and testing -RF link budget analysis -Familiar with communication system (3G, LTE, WiFi, GPS, ...) -Familiar with schematic design tool -Familiar with RF testing equipment -Familiar Smallcell 3GPP test specification -Familiar with mass production or NPI process -Circuit design concepts, PCB layout guidance concepts, and debugging capabilities [工作能力需求] Fluent English 具備6年相關工作經驗 [其他說明] 具網通廠相關工作經驗

Storage&Server硬體經副理 大學或研究所電子/電機系畢業 2.Intel x86 Server Mother board design , system architecture design, 或擔任system lead ..等經驗總和超過10年以上 3.具帶領20人以上團隊5年以上經驗 4.TOEIC ＞ 600

NoteBook硬體設計專案之管理 Resource管理 Issue Risk管理 領導硬體團隊/人員訓練/跨部門溝通協調 大學以上電子/電機科系畢 具8年以上Notebook PC硬體設計經驗(含3年以上主管經驗) 熟悉Orcad/LA/Scope/Check Layout.

伺服器 MB硬體設計 (副)課長 / 設計主任 / 高級工程師 --- 1員 - 熟悉Server產品架構, 俱有6年以上Server MB硬體設計及測試實務經驗,其中含3年以上主管經驗 {(副)課長 / 設計主任}w - 大專以上電子,電機或資工等相關科系畢業 - 俱備英文聽,說,讀,寫等溝通能力