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轉職熱搜工作

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  • NB-散熱專員/課級主管(頂埔)-E事業群

    面議(經常性薪資達4萬元或以上) 40000元 新北市土城區 工作經歷不拘
    1.執行NB特案機種的系統熱傳與噪音工程設計 2.建構TPE & VN團隊與人員培訓 3.建構TPE & VN熱傳與噪音設計實驗室
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  • 【AI Server/Storage】系統架構師

    面議(經常性薪資達4萬元或以上) 40000元 新北市土城區 5~6年工作經驗
    1. 負責 AI Server / Storage 產品之 ODM 開發與系統架構規劃,具伺服器產品開發經驗者尤佳。 2. 規劃 AI 伺服器整體系統架構,包含 GPU Baseboard、CPU、Memory、Storage、高速網路、電源與冷卻系統等核心模組。 3. 負責 AI Server / Storage 產品之模組化設計,確保系統具備高效能、高擴充性、高可用性與可維護性。 4. 針對 AI 訓練與推論應用需求,規劃高速儲存架構,優化資料吞吐量、延遲與大量隨機讀寫效能。 5. 規劃高速快取、NVMe / SSD、儲存控制器與長期資料儲存系統之整合架構,提升資料存取效率與系統可靠度。 6. 參與新專案前期技術評估,協助分析客戶需求、產品規格與技術可行性,提出硬體架構方案與 PoC 規劃。 7. 擔任跨部門技術整合窗口,協調機構、熱傳、SI/PI、電源、韌體、軟體、驗證與製造團隊,確保各模組符合系統設計需求。 8. 主導系統設計審查、風險評估、問題分析與改善追蹤,確保產品開發進度、品質與技術規格符合客戶要求。 9. 定義系統驗證測試項目,包含效能、穩定性、極限負載、散熱、電源、訊號完整性與可靠度測試。
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  • 【AI Server / Rack】BMC Engineer_US-based_011

    面議(經常性薪資達4萬元或以上) 40000元 美國加利福尼亞州 3~4年工作經驗
    1. Out-of-Band Management Bring-Up & Telemetry Validation 2. Sensor Grid Calibration & Thermal/Power Safety Tuning 3. Redfish API Customization & Hyperscaler Profile Alignment 4. Hardware Failure Log Parsing & Diagnostic Triage 5. Automation Flashing Script Development & ECO Compliance
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  • 【AI Server】SI/PI 電子仿真主管 (土城)-E事業群

    面議(經常性薪資達4萬元或以上) 40000元 新北市土城區 5~6年工作經驗
    1. 規劃電子仿真團隊技術方向、年度目標與人力配置。 2. 建立 SI / PI / EMI / ESD / Power simulation 標準流程與驗證規範。 3. 審核重大專案仿真結果,判斷設計風險並提出改善策略。 4. 協調 EE、PCB Layout、Power、Thermal、Mechanical 與客戶端技術需求。 5. 推動仿真自動化、資料庫建置、專利佈局與團隊技術能力提升。
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  • AI伺服器系統架構師 AI Server System Architect

    面議(經常性薪資達4萬元或以上) 40000元 新北市土城區 工作經歷不拘
    1. 負責 AI Server / GPU Server 平台整體系統架構規劃與設計。 2. 規劃 AI Rack (or AI Cluster) 架構,包含 compute、network、power 與 cooling integration。 3. 協助高功耗 AI Server thermal 與 power architecture 設計,包含 liquid cooling、rack power density、PSU/BBU 等。 4. 協助 CSP/Hyperscaler 等客戶進行技術討論、需求分析與 solution customization。 5. 評估新世代 AI Infrastructure 技術與 roadmap,包含 CXL、UEC、Optical Interconnect、Rack-scale Architecture 等。 6. 須與外國客戶直接溝通, 具備英文聽說讀寫能力。
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  • 馬達熱傳工程師 Motor thermal engineer

    面議(經常性薪資達4萬元或以上) 新北市樹林區 1~2年工作經驗
    1. 支援高級熱傳工程師進行電動車系統(無人機、地面和水上交通工具)的熱傳研究、模擬和實驗;Support senior thermal engineer doing thermal research, simulation and experiment for electric mobility systems (drone, ground and aqua vehicles). 2. 熟悉熱問題FAE軟體,負責工程圖、修改等基礎機械工作。3D機械結構設計及最佳化。此項ME工作可由我們經驗豐富的機械工程師領導和指導,並會進一次培訓。Familiar with FEA software for thermal matters. In charge of basic mechanical tasks such as engineering drawing preparation, modification. 3D mechanical structure design and optimization. This ME works can be leaded and guided by our experienced mechanical engineer, further training can be applied.
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  • 電動馬達設計研發工程師 Electric motor design RD engineer

    面議(經常性薪資達4萬元或以上) 新北市樹林區 1~2年工作經驗
    1. 進行電動交通工具應用的高功率密度馬達的研發。 2. 具有實際馬達製造或通過輕質結構或熱分析經驗增強機械設計的經驗者優先。 3. 如無經驗,跟馬達和電動動力系統有興趣也行,您負責設計概念、供應商採購以及原型測試和驗證。 4. 根據客戶輸入處理電機電磁設計。 5. 通過與各種材料和製造供應商合作評估和減少電機損耗。 6. 必須具備馬達設計軟體經驗(MAXWELL、JMAG、FLUX…) 1. Conduct the research and development of high power density electric motor for electric mobility applications. 2. Experience with practical electric motor build or enhancing motor design with lightweight structure or thermal analysis experiences is a plus. 3. You are responsible from the design concept, supplier sourcing as well as prototype testing and verification. 4. Handle motor electromagnetic design from customer input. Motor losses evaluation and reduction by working with various material and manufacturing suppliers . 5. Have experiences in motor design software is a must (MAXWELL, JMAG, FLUX...)
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  • 3DIC flow engineer

    面議(經常性薪資達4萬元或以上) 40000元 新竹市 3~4年工作經驗
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • TCAD RD Engineer (Simulation)

    面議(經常性薪資達4萬元或以上) 40000元 新竹市 工作經歷不拘
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=550&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: Apply advanced computational models to predict performance, optimize structure and doping profile, and provide improvement directions in nano-scaled device technologies. Develop and apply finite element method (FEM) modelling, including but not limited to stress simulations, computational fluid-dynamics, thermal conductivity simulations and electromagnetic wave simulations, for both macroscopic (tool/wafer) and microscopic (discrete device) structures. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • Senior Robotics Mechanical / Mechatronics Design Engineer

    面議(經常性薪資達4萬元或以上) 40000元 新竹市 2~3年工作經驗
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=22739&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking a talented Mechanical R&D Engineer to drive the development of our next-generation robots. In this role, you will deliver design of advanced robotic arms from concept to prototype validation. Working in a highly collaborative, result-oriented environment, you will solve complex engineering challenges in complex design, structural simulation, and precision motion control. If you are a proactive problem-solver passionate about pushing the boundaries of automation, we invite you to join our team. Responsibilities: 1. Responsible for the mechanical design and structural analysis of robot bodies, manipulator arms, and End-of-Arm Tooling (EOAT). 2. Execute Design for Cleanliness strategies, including particle suppression, negative pressure/airflow management, low-outgassing material selection, and sealing & lubrication design. 3. Conduct simulation and physical validation for structural rigidity, modal analysis, thermal deformation, and positioning accuracy. 4. Collaborate with the control team to define servo motor selection, transmission architecture, and sensor deployment. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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