轉職熱搜工作

*公司介紹: 外商公司已有165年歷史 於1971年進入台灣,為第一家在台灣設立LCD玻璃基板工廠並製造的供應商，在台中中部科學園區和台南科學園區建立了最現代、最高效率的生產工廠,提供市場領先技術製造高品質LCD玻璃基板. 工作內容 1. 機械背景,冷凍空調科系,希望有半導體廠/無塵室經驗 2. 廠內因切割玻璃產生的粉塵,進行空氣汙染的優化 3. 和不同的工程段合作,進行環境優化 4. 需要進入無塵室工作, 約占20％ 5. 帶領廠商做工程, 要有控廠/跟催工程進度的能力 6. 三年以上晶圓廠建廠或運轉經驗 7. 疫情穩定後,可能需要出差, 海外出差比列約15％, 但若需要隔離,就會以台灣為主, 屆時會依疫情狀況調整 8. 英文中等程度 9. 有AutoCAD or SolidWorks經驗,可以reviewing drawings and models加分 Scope of position: • Work with BOD (Bottom of drawing), Finishing, Inspection, and Packaging process areas for environmental optimization. • Work with expansion, rebuild, construction teams for new HVAC design and better enclosure capability. • Lead process change for quality improvement in Division-wide. • Define/refine base case of finishing attributes for process optimization improvement. • Review and analyze process data, performance, product data and respond to the result. • Plan, execute, tracking and document experimental design. • On site supervisor with external vendor and watch out the safety rule. Education and Experience: • BS Engineering degree. • HVAC or Semiconductor cleanroom operation equivalent experiences. • 3 years work experiences. • Construction experiences of HVAC or Semiconductor cleanroom. Required skills: • Cleanroom operation experience, skill and knowledge • Experiment design and data analysis skill • Project management skill. • Teamwork and communication skill. • Ability to work in different regions. • Mange external vendor. • English communication in written and verbal Desired skills: • HVAC design for class 10 Cleanroom system including MEP system. • Experience with cleanness control in multi-process production Fab. • Experience with AutoCAD or SolidWorks - capable of reviewing drawings and models • Experience in DMAIC methodology and 6-sigma project. • Use simple statistical tools and Designed Experiments (DOE) in process problem solving. • Thermal and fluid dynamics knowledge background - capable of reviewing the design calculation. • High level Excel using. • Chemistry-related knowledge. Soft skills: • Logical thinking for problem solving • Cross-cultural sensitivity. • Report and presentation skill. • Excellent communication and interpersonal skills, planning and organizing, building cross functional relationship. • Patience and perseverance. • Adapt to changing and fast-paced work. • Agile resilience. • Handle and arrange multiple tasks at the same time

*公司介紹: 外商公司已有165年歷史 於1971年進入台灣,為第一家在台灣設立LCD玻璃基板工廠並製造的供應商，在台南科學園區和台中中部科學園區建立了最現代、最高效率的生產工廠,提供市場領先技術製造高品質LCD玻璃基板. *我們正在尋找一個高度稱職的Modeling Simulation Development Engineer,未來您所會參與的工作內容如下 : Scope of Position and Day to Day Responsibilities: • Use knowledge of physics to build deep understanding of the materials and processes at CDT • Use existing tools and develop new analytical and numerical models to resolve process problems • Correlate simulation with experimental results • Support development and validation testing • Communicate results both orally and in written form of English • Protect Corning’s intellectual property by filing invention disclosures for patent application in timely fashion • Document all project findings in internal technical reports Required Skills: • Experience of using or programming in any one of the commercial software like ABAQUS, NASTRAN, ANSYS or DYNA3D • Strong foundation in physics and engineering science with programming skills • Sold Mechanics fundamental • Capability to design and plan the verification experiment for modeling • Creative/innovative problem solving via scientific or engineering methods • Results oriented and high commitment /energy • Sold Mechanics fundamental or computational fluid dynamics 參與實驗設計、計畫、執行 負責模擬分析 使用電腦及專業軟體進行模擬，校正設定條件，讓模擬接近真實情境 擅長使用工具:ABAQUS、C++、Java、Python、Pro/E 面試流程：一次面試，以視訊方式進行，一周內會得知結果

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 工作內容： 1. 協助實驗室的日常運作，測試樣品/夾具準備、測試、報告生成以及跟進，並支援先進封裝技術 2. 將負責熱機械材料測試（如：熱分析儀、萬能試驗機、剪切測試儀等）、工具/加工以及驗證電路封裝材料和加工方法 3. 熟悉ASTM、JEDEC、IPC或相關行業規範為佳 4. 了解熱機械測試方法，如：熱分析儀、萬能試驗機、剪切測試儀和工具顯微鏡等為佳。 5. 具有測試方法學或材料開發經驗尤佳。 Job Description： The position is focused on laboratory daily operation, test samples/fixture preparation, testing, report generation, and follow-up in support of advanced packaging technologies. This technician will be responsible for thermal and mechanical materials tests (ex: thermal analyzers, universal testing machines, shearing testers, etc.), tool/machining, and methodologies to validate the materials and processing of the IC package. 此職缺為派遣職，一年一簽