轉職熱搜工作

1. 與 ODM/OEM/Brand 客戶溝通，掌握需求並推進專案。 2. 協調內部工程、工廠及供應鏈資源，確保產品設計、打樣、量產符合客戶要求。 3. 負責伺服器或散熱模組相關機構件專案的 Sales / PM / Mechanical PM 角色。 4. 追蹤專案進度，管理專案排程、風險控管及成本分析。 5. 支援新客戶和產品線開發。 6. 定期彙整並回報專案進度與市場資訊。 • Work closely with ODM/OEM/Brand customers to define requirements and drive projects. • Coordinate with internal engineering teams, factories, and supply chain to ensure design, prototyping, and mass production meet customer requirements. • Take ownership of Sales, PM, or Mechanical PM role for server and thermal module mechanical components. • Manage project timeline, risk control, and cost analysis. • Support new customer and product development • Provide regular updates on project status and market insights.

1.支援客戶端使用車用IC 於座艙系統, ADAS 系統的硬體應用開發事項，協助客戶review PCB schematic and layout design的問題, 解決客戶相關的硬體開發及生產面臨的問題。 2. 需要出差到韓國, 日本, 美國或是歐洲等海外客戶。 3. 需要用英文與客戶溝通。

- This position is for an SoC Architect, responsible for evaluating the technical feasibility and architectural direction of new products prior to project kickoff. - The role requires close collaboration with business teams to clarify market needs and product requirements, as well as cooperation with engineering teams to explore the competitiveness and feasibility of various SoC architecture options. - The architect will integrate cross-functional inputs to define the optimal system-on-chip design architecture, serving as the foundation for subsequent product development. - 此職缺為 SoC Architect，負責於專案啟動前進行產品的技術可行性與架構方向評估。 - 需與商務單位合作，釐清市場需求與產品規格；並與各工程團隊協作，探索不同 SoC 架構方案的優劣與競爭力，評估技術風險與可行性。 - 最終需整合跨部門意見，制定最佳化的系統晶片設計架構，作為後續產品開發的基礎。

先進封裝技術開發 1. 先進新產品導入技術開發 (新產片試產規劃, DRC/DRM檢驗, DOE及良率改善規劃, 量產區間及良率分析) 2. 熟悉先進chiplet及3DIC封裝技術開發 3. 晶圓級與面板級先進封裝結構設計

1. 熟悉 2.5D 或是 3D 封裝技術, 開發和量產經驗 2. 從系統架構優劣比較, SIPI 或是測試或是 thermal 角度來提供適合的封裝技術

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

1. Develop 3.5D methodology from RTL to GDS and Package 2. Coordinate Thermal and PI/SI team to deal with high power design 3. Execute the project at different phases

在手機SoC平台上分析及優化遊戲性能，具備以下相關工作經驗尤佳： 1. 嵌入式系統的效能、功耗或Thermal溫控分析優化 2. 手機遊戲性能功耗優化或遊戲引擎技術開發優化 主要工作內容： • 從遊戲行為分析遊戲性能瓶頸及功耗組成，並透過優化平台軟體調控技術，達到提升Mediatek平台的遊戲體驗的目標 • 與遊戲工作室合作，透過遊戲行為分析，建議工作室遊戲體驗優化方法 • 透過軟體調教，協助Mediatek及客戶達成遊戲性能功耗的產品目標

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation