轉職熱搜工作

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

1. 企業/家用WIFI AP路由器 開發經驗者尤佳 2. 高速介面應用, 驗證及除錯 e.g. USB, PCIe, xGMII, Ethernet, DDR 3. 802.11 a/b/g/n/ac/ax/be WiFi SoC及Ethernet SoC驗證, 公板設計及驗證 4. Power/Thermal/EMI 防治對策 5. 支持客戶應用及量產導入 6. 熟悉HW設計的TOOL 如OrCAD, PADS, Allegro

• Develop power and thermal management software and firmware for Windows on ARM system. • Optimize, benchmark and profile power and thermal for Windows on ARM platforms. • Analyze power and thermal related issues for Windows on ARM system.

在手機SoC平台上分析及優化遊戲性能，類似的工作經驗為以下兩者其中之一為佳 1. 嵌入式系統的效能、功耗或Thermal溫控分析優化 2. 手機遊戲Graphic/引擎技術開發優化 主要工作內容： • 從遊戲行為分析遊戲性能瓶頸及功耗組成，並透過優化平台軟體調控技術，達到提升Mediatek平台的遊戲體驗的目標 • 與遊戲工作室合作，透過遊戲行為分析，建議工作室遊戲體驗優化方法 • 透過軟體調教，協助Mediatek及客戶達成遊戲性能功耗的產品目標

1. Familiar to 2.5D or 3D PKG integration & development & mass production experience 2. From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration

10+ years experiences in IC Advance Package Design such as 3DIC Development, ASIC (APR) design, flow development, and EDA enablement KEY RESPONSIBILITIES: 1. Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design. 2. Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance. 3. Support package design teams in defining a tool roadmap for advanced package design. 4. Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility. 5. Represent the Package design team in customer engagements for advanced package designs.

Develop advanced package technologies for MediaTek‘s HPC business

1) 建立車用cockpit/ADAS等ECU系統級熱模型，並設計具市場競爭力的散熱解決方案。 2) 參與制定、分析、評測SOC TDP(Thermal Design Power) 3) 設計、設置、執行並交付各種thermal和TDP實驗的結果，驗證SOC 和系統硬體性能。 4) 針對下一代車用晶片，規劃熱管理方案，並參與制定晶片及系統的thermal/power設計需求 5) 管理技術專案，並與其他內部組織和客戶合作，支援開發週期中的執行過程。 6) 執行熱模擬和驗證，並與合作單位展示和溝通成果

1.產品結構設計。 2.產品結構驗證與檢討。 3.產品機種製成串接。 4.工程料件制定與相關圖面發行。 5.工程料號/BOM表/產品SOP建立與管理 6.工程文件維護與管理 7.專案跟進與回饋 8.專案供應商評估 9.量產品良率改善與提升 10.專利申請及專利文件效期管理與延期處理 11.承認樣簽核及管理、模具保管合約書簽訂與管理 12.其他主管交辦事項

Thermal Department Leader [工作內容] Ø 5-years+ experience on thermal system optimization, and manager experience on thermal team. Familiar with highly goal oriented simulation tools. (E.g. Ansys Icepak) Ø Developing, verifying and validation for smart device thermal systems, and co-work with HW, ME, for physical thermal solution design. As well as working with software team for thermal mitigation plan for products. Ø Integrating with multi-objective optimization, analysis and visualization of the entire product design space. Establishing ling-term collaboration with customers, so that we can thoroughly understand their research and needs and can be most productive in minimizing the time to market for new design. Ø Leading thermal team to fulfill customer/products thermal optimization, requirements, and research needs. Ø Analyzing heats transfer and energy conversion components and systems including, but not limited to, thermal optimization on portable devices, e.g. mobile phone, tablet; smart watch, and smart speaker; IOT devices and related applications. Ø Utilize in-house, commercial, and custom developed software to provide customer thermal optimization solutions. Ø Develop, review and edit project reports, and report to customers. Ø Assist with developing proposals and new business leads. Ø Maintain and grow existing customer contact and relations. Ø Extensive knowledge about heat transfer and energy conversion system is a must. Ø Ability to independently learn new engineering analysis tools and apply them into projects. Ø Previous research and development experience is preferred. Ø Software developing experience is requested, but not required.