轉職熱搜工作

1. NB/AIO/Thin Client/Mini-DT等產品的散熱設計 2. 規畫散熱對策與系統佈局,並引導工程師完成圖面設計 3. 問題分析並提供改善對策,引導工程師解決散熱相關問題 4. 督導推動追蹤各階段工作任務的進度,提供個階段的散熱驗證報告 5. 跨部門及供應商的溝通

參與新世代 液冷式 AI 伺服器機架（Liquid Cooling Rack） 之規劃、設計與導入，主要工作包含： •液冷管路佈局設計：負責 Rack 或 Server Node 內液冷管路（Tubing）配置與路徑規劃。 •機構設計整合：將管路、Manifold、Quick Disconnect（QD）、CDU、Pump 等液冷元件整合至 Node／Rack 結構中。 •液冷模組組裝與成本分析：BOM 編製、組裝流程設計、維修性與可製造性評估。 •跨團隊協作：與 Thermal、Power、AE 及供應鏈廠商協作，完成整櫃液冷方案導入與量產。

1. 領導Team member工作方向，提升小組士氣與維護和諧氣氛 2. 完成部級主管交代工作事項，與傳達訊息宣導事項 3. 新人訓練，建立共享資源，提升小組技術能力 4. 定期會議Review專案狀況，並適時提供建議引導小組解決問題 5. 與客戶端溝主要通窗口，有能力決定關鍵性參數，解決專案問題

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for HPC and AI server architectures. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. • Familiarity with L10~L12 internal/external cable form factors and applications, as well as cable routing management, space planning, and related infrastructure assessment. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=550&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: Apply advanced computational models to predict performance, optimize structure and doping profile, and provide improvement directions in nano-scaled device technologies. Develop and apply finite element method (FEM) modelling, including but not limited to stress simulations, computational fluid-dynamics, thermal conductivity simulations and electromagnetic wave simulations, for both macroscopic (tool/wafer) and microscopic (discrete device) structures. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1. 機殼機構設計，產品熱傳與散熱評估 2. 3D繪圖與熱流模擬分析 3. 制訂材料選用，驗證及測試 4. 客戶產品開發評估及設計變更 熟悉Solidwork / Ansys Mechanical尤佳 溫馨提醒：只有經過台郡授權的人員才能處理您的個人簡歷，台郡亦將遵守相關法規與政策，保護您的個人資料。投遞簡歷視同您同意台郡收集您的個人資訊。