轉職熱搜工作

【職務說明】 你將加入旺矽科技 AST（Advanced Semiconductor Test）事業群，參與高頻、高功率、矽光子與先進封裝測試平台的設計開發。團隊橫跨自動化探針台、晶圓測試載具、溫度控制模組與光機整合系統，是推動 AI、車用、5G/6G、CPO 測試解決方案的核心團隊。 【工作內容】 1.新產品規劃及新技術開發 2.機構模組設計 3.機台機電整合 4.機台客製化變更 【需求條件】 • 機械/機電/光機背景，熟 3D繪圖如SolidWorks • 具模組設計經驗，了解加工與裝配配合 • 對先進半導體測試應用有高度熱情者佳 【你將接觸】 • 尖端晶片測試需求（AI、車用、SiPh、mmW） • 多元技術領域：光機熱整合、精密載具、自動化模組 • 國際客戶合作與跨部門產品開發流程 https://www.youtube.com/channel/UCzy4pCa_OqlTMJz333PojIQ 工作地點：新竹縣竹北市中和街155號 【Job Title】 AST Mechanical Engineer | Precision Module Design × Advanced Wafer Test Platform Development ________________________________________ 【Job Description】 Join the Advanced Semiconductor Test (AST) division at MPI Corporation, where you’ll be part of a core team developing cutting-edge test platforms for high-frequency, high-power, silicon photonics, and advanced packaging applications. Our team specializes in automated probe stations, wafer test fixtures, thermal control modules, and opto-mechanical integration systems, enabling next-generation testing solutions for AI, automotive, 5G/6G, and CPO technologies. ________________________________________ 【Responsibilities】 1. New product planning and technology development 2. Mechanical module design 3. Mechatronic integration of test platforms 4. Customization and modification of equipment based on customer requirements ________________________________________ 【Requirements】 • Background in mechanical, mechatronics, or opto-mechanical engineering; proficiency in 3D CAD tools such as SolidWorks • Experience in module design with a strong understanding of machining and assembly fit • Passion for advanced semiconductor test applications is a strong plus ________________________________________ 【You Will Be Exposed To】 • Leading-edge IC testing applications (AI, automotive, SiPh, mmWave) • Multidisciplinary technologies: opto-mechanical-thermal integration, precision fixtures, automation modules • Cross-functional product development with international clients and internal teams Work Location: No. 155, Zhonghe Street, Zhubei City, Hsinchu County, Taiwan

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

1. Design and test for related thermal function and create fan curve to fit acoustic spec. 2. Communicate all thermal-related information with suppliers, internal teams and customers. 3. Provide thermal report.

負責散熱系統與風扇性能設計，運用熱流模擬工具進行產品分析與優化，配合客戶專案完成散熱方案開發、樣品驗證及量產導入，並與研發、製造、測試團隊密切合作。 1.執行電子產品熱流模擬分析（CFD），包含溫度場、流場、壓力分布、流阻及風量評估，使用 Flotherm、FlowEFD 等 CAE 軟體建模與設計最佳化。 2.負責風扇選型、性能匹配、系統阻抗分析，執行散熱器／模組／風道整合設計及機構零件製圖、打樣驗證。 3.規劃執行熱流／風扇性能實驗，分析測試數據，比對模擬與實測差異並建立修正方法。 4.追蹤專案時程，與客戶及跨部門（機構、電子、韌體、馬達、製造、供應商）團隊協調，推動方案設計與量產導入。 5.運用 Python 撰寫最佳化方法或整合開源工具，投入新型散熱技術研發，並維護模擬分析流程與技術文件。 ※此職務工作地點可在高雄或新北

1 Develop the Timing/EM signoff criterion for leading process node and 3DIC. 2 Maintain the Timing/EM Signoff criterion ,provide issue solving and consultant for projects on abnormal/unfixable timing/EM violation 3 Develop new Timing/EM signoff methodology to be applied during chip synthesis/APR/STA/EM . 4 SPICE correlation for new timing/EM signoff criterion 5 Regression test for every signoff methodology by STA violation/slack analysis, EM results 6 Post-silicon data analysis for silicon-proven timing/EM signoff criterion

1. 機殼機構設計，產品熱傳與散熱評估 2. 3D繪圖與熱流模擬分析 3. 制訂材料選用，驗證及測試 4. 客戶產品開發評估及設計變更 熟悉Solidwork / Ansys Mechanical尤佳 溫馨提醒：只有經過台郡授權的人員才能處理您的個人簡歷，台郡亦將遵守相關法規與政策，保護您的個人資料。投遞簡歷視同您同意台郡收集您的個人資訊。

1. Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design. 2. Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance. 3. Support package design teams in defining a tool roadmap for advanced package design. 4. Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility. 5. Represent the Package design team in customer engagements for advanced package designs.

1.散熱模組設計(Server NB )、製圖、打樣、測試 2.專案進度追踨，並與客戶、製造團隊應對協調 3.實驗設計，分析數據與改善對策，並執行新技術開發 4.模擬軟體的分析使用(Ansys Workbench, FLUENT…等)

【工作內容】 1.負責風扇機構設計 2.專案與客委案開發與管理 3.協助產品性能測試及提出設計改善與優化對策 4.客訴問題分析改善處理 5.參與產品試作試產作業 6.協助其他工程師研發設計工作 7.其他主管交辦事項 ※熟CAE Design 模擬軟體佳.(如 ANSYS_Fluent. Structural Analysis . Injection Molding Analysis.)