半導體製程工程師|1111轉職專區
Facebook分享縮圖

轉職熱搜工作

您正在找半導體製程工程師的工作,共計650筆職缺在等你,馬上去應徵吧!

  • 南科音叉製程設備工程師

    月薪 35000~40000元 台南市新市區 工作經歷不拘
    1.具備電腦操作能力 2.電機.電子.資訊科系畢業佳 3.有無塵室經驗佳 4.需配合做二休二,每二個月日夜調班、依工作需求加班
    展開
  • (JR-11505) Principle Engineer I, PE 製程主任工程師

    面議(經常性薪資達4萬元或以上) 50000~80000元 新北市新店區 3~4年工作經驗
    What you will be doing: • Process sustain and stability maintenance for Diffusion/Deposition processes負責擴散/沉積製程參數維持、建置與量產穩定度 • SPC monitoring and DOE execution for process optimization, productivity enhancement, and yield improvement監控 SPC 與量測數據,執行 DOE 以進行製程優化、產能提升及良率改善 • Post-PM process qualification and recipe matching支援設備維護後的製程恢復及參數驗證 • Process documentation management, including PI, SOP, Recipe, and OCAP updates撰寫、更新與維護製程相關文件,如 PI、SOP、Recipe、OCAP • Cross-functional troubleshooting with EE, PIE, and Production teams與 EE、PIE、Production 等跨部門合作,處理生產異常情形 • Projects involving NPI, process transfer, new equipment introduction, and cost-reduction initiatives參與新產品導入、製程轉移、新設備導入與成本降低等專案
    展開
    供餐福利年終獎金進修補助尾牙或春酒年薪14個月以上
  • 技術工程類 - 客戶工程整合工程師/經副理【高雄】

    面議(經常性薪資達4萬元或以上) 40000元 高雄市楠梓區 3~4年工作經驗
    1.日本客戶工程技術支援 2.新技術推廣 3.日本客戶工程發展規劃 4.日本客戶服務及關係維持
  • 南科音叉製程設備工程師(常日班)

    月薪 35000~40000元 台南市新市區 工作經歷不拘
    1.具備電腦操作能力 2.電機.電子.資訊科系畢業佳 3.有無塵室經驗佳 4.固定日班,依工作需求加班
  • 南科音叉製程設備工程師(常夜班)

    月薪 37000~45000元 台南市新市區 工作經歷不拘
    1.具備電腦操作能力 2.電機.電子.資訊科系畢業佳 3.有無塵室經驗佳 4.固定夜班,依工作需求加班
  • 〔114年研發替代役〕製程技術開發工程師

    面議(經常性薪資達4萬元或以上) 40000元 新北市泰山區 工作經歷不拘
    1.半導體製程整合相關工作。 2.開發、應用新的半導體相關技術。 3.新製程技術開發。
  • 【T-L】新製程技術開發助理工程師 (林口廠)

    月薪 35000~45000元 桃園市龜山區 3~4年工作經驗
    1. 協助技術開發:開發並導入新技術或是新設備以提升產品性能和生產效率,包括自動化技術、數位化流程等。 2. 協助新製程評估:評估新技術的可行性,進行實驗和測試以驗證其效果。 3. 協助轉移:將新技術應用於生產線,確保其順利整合並能夠有效運行。 4. 協助持續改進:不斷監控和改進技術流程,以應對市場變化和需求。 5. 其他主管交辦事項 薪資及職務會依學經歷略作調整
    展開
  • 南科音叉製程設備工程師※歡迎身障人士加入

    月薪 35000~40000元 台南市新市區 工作經歷不拘
    1.具備電腦操作能力 2.電機.電子.資訊科系畢業佳 3.有無塵室經驗佳 4.需配合做二休二,每二個月日夜調班、依工作需求加班
    展開
  • R&D設備及製程模擬工程師-身心障礙人才招募

    面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=264&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: 1. A highly motivated individual with a strong technical background and capabilities to conduct process analysis and computation to advance equipment/process technologies for memory and logic products. 2. Work with a team which may include diffusion, etch, and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as mathematical analysis and high performance computation and programming. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    展開
  • 封裝後段製程經理

    面議(經常性薪資達4萬元或以上) 40000元 新竹市 10~11年工作經驗
    負責LF package, WB BGA package, FC BGA package 以及第三代功率半導體封裝的後段製程 Mold, Trim, Form 和SMT 製程之以下事項 1.)NPI. 2.)製程開發. 3.)製程整合. 4.)製程良率改善. 5.)品質改善(SPC, FDC, FMEA, QCP, OCAP, SOP 等). 6.)Cost down. 7.)設備utilization 改善. 8.)PM System. 9.)量產製程及設備規範修訂. 10.)其他配合公司客戶要求改善事項
    展開