轉職熱搜工作
您正在找半導體製程工程師的工作,共計650筆職缺在等你,馬上去應徵吧!
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【中科大雅】IM工程師(CIM & AI application)
月薪 48000~69000元 台中市大雅區 工作經歷不拘1.執行單元測試與使用者允收測試 2.建立操作規範 3.蒐集系統需求&回饋 -
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【Q-L】品保DQE工程師(林口廠)
面議(經常性薪資達4萬元或以上) 44000元 桃園市龜山區 5~6年工作經驗1. 產品量產前與相關單位的互動,確保開發過程中需要的文件有產生;紀錄有包持,方法有定義。製造單位有充分點收並產生對應的生產文件與紀錄表單。 2 . 負責新產品的前期品質控制與策劃,在整個開發階段,DQE必須對新產品的樣品製作、試模、試生產負責,把製造過程中存在的所有問題挖掘出來並解決。(DFMEA/PFEMA) 3 . 根據客戶提供的資訊和特殊特性要求,協助TD做驗證性試驗,驗證生產出來的產品是否滿足客戶的要求及應用上是否滿足。 4 . 積極參與可行性分析與設計審查,驗證產品的功能、安全性和可靠性要求。展開 -
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SCM成本分析工程師-台南(D7-6542)
月薪 30000~40000元 台南市善化區 3~4年工作經驗1.與廠商談判協調價格、交期、關鍵事項。 2.專案BOM Cost分析。 3.原物料成本差異分析、成交條件優化及議價 。 4.蒐集市場情報能力及供需趨勢即時掌握。 5.依專案成本目標執行成本管控計劃。展開 -
IP BU/Process Automation Engineer (India)
面議(經常性薪資達4萬元或以上) 亞洲其它印度 3~4年工作經驗【自動化製程工程師】 ■ 生產線參數CPK數據彙整、追蹤 ■ 生產線SOP、PFMEA、CP文件撰寫、維護 & 培訓 ■ 生產線進行動作優化、提高生產效率及良率改善 ■ 產線產品不良分析、短/長期對策施做、跟進 ■ 客戶不良品分析、8D報告撰寫 & 改善對策跟進與落實 ■ 輔助設備工程師與設備商討論動作原理、驗證、測試…等項目 ■ 派駐印度廠 【Process Automation Engineer】 ■ Set process parameters, compile and review CPK data ■ Write production line SOP, PFMEA, control plan document ■ Deal with process abnormities ■ Analyze product defect loss, develop short/long term solutions ■ Write 8D reports & implement improvements ■ Support discussions between equipment engineers and vendors ■ Willing to work in India factory (Gurugram)展開 -
Product Engineering_Penang, Malaysia
面議(經常性薪資達4萬元或以上) 40000元 東南亞馬來西亞 工作經歷不拘1. Product Engineer 【Day Shift】 • Proficient in operating and debugging inspection equipment in QC area • Understanding of basic Bumping/Backend processes; ability to identify defect types • ADC team must have precise defect classification capability • Handle abnormal lots and write SOPs; documentation owners must understand FMEA and Control Plan • Strong communication skills for cross-functional coordination; lead optimization/automation (CIM) projects 【Shift Work】 • Operate inspection equipment and maintain program functionality; learn setup processes • Confirm, investigate, and process defective materials • Support data collection and issue investigation for customer and engineering projects • Execute supervisor-assigned tasks and achieve department KPIs 2. BE Engineer • Coordinate with production control for pilot lots, returns, and engineering wafers final out • Confirm customer work orders • Prepare special process checklists for BE1 and BE2 • Maintain process station flows • Create and modify MES process parameters • Final out test area products • Drive improvement projects and system enhancements • On-call during holidays (for issue resolution and urgent final outs) 3. Bump Engineer • Support pilot lots, returns, and engineering wafer final outs with production control • Confirm customer work orders • Maintain product specifications, forms, and create EDC entries • Modify and maintain process station/machine group settings • Update process parameters and product specs • Configure backup masks and stencils • Manage mask hold/scrap and product data • Support manager-assigned tasks • On-call during holidays (for urgent issues or final outs) • Configure system Q-time and rework control cards • Set up mass production configurations for new products 4. FA Engineer • Analyze customer complaint issues • Analyze process improvement results • Analyze experimental data for new process introduction • Manage FA case scheduling • Operate FA lab equipment and perform basic troubleshooting • Arrange outsourced FA services and coordinate billing • Purchase and manage lab consumables (e.g., polishing materials, liquid nitrogen, sputter targets) • Maintain lab equipment and environment • Maintain related WI documents and forms • Assist with customer audits • Support manager-assigned tasks 5. Photomask Layout Engineer • Perform photomask design and outsourcing • Design and outsource backup/revised masks • Maintain system settings for masks and stencils • Create photomask process cards • Create and route process cards for stencils • Manage mask/stencil PR and procurement • Generate 2D map layouts • Process mask/stencil hold/scrap and initiate approval workflows • Draw POD diagrams 6. Packaging Design Engineer • Evaluate customer specifications (CRN/CDR), conduct discussions and compile data for customer confirmation • Communicate and resolve packaging-related issues • Handle system anomalies (contact and data confirmation) • Maintain packaging BOM and material info • Create and revise packaging WI documents and review related files • Maintain FMEA and Control Plan • Evaluate and test new packaging materials/second sources • Create VQA records for new packaging materials • Maintain packaging system and consolidate PK Verify results for various customers • Optimize packaging system workflows • Support customer audits related to packaging issues • Manage shipments without ERP records or with special labeling requirements • On-call during holidays for anomaly resolution展開 -
Process Engineering_Penang, Malaysia
面議(經常性薪資達4萬元或以上) 40000元 東南亞馬來西亞 工作經歷不拘1. Sputtering / Photo Process Engineer 【Day Shift】 • Develop and implement new products and processes into mass production • Monitor and maintain process stability • Troubleshoot and improve process abnormalities • Improve product yield • Evaluate new materials and equipment • Plan experiments and analyze data • Collaborate with cross-functional project teams 【Shift Work】 • Handle abnormal products from production line • Develop exposure and measurement programs • Maintain and calibrate equipment • Support engineering experiments 2. Test Assistant Engineer • Support testing of engineering samples and experiments • Assist in cross-platform testing operations • Required to work on shifts 3. Discrepancy Notification (DN) Engineer • Assist in handling online lot disposition • Troubleshoot online lot issues to ensure smooth processing • Submit discrepancy reports to customers for low-yield WIP lots • Required to work on shifts 4. Test Product Engineer • Acquire comprehensive knowledge of products, equipment, a展開 -
T-蝕刻設備技術員 Etching Equipment Fab Technical Assistant (桃園龍潭)
面議(經常性薪資達4萬元或以上) 40000元 桃園市龍潭區 2~3年工作經驗The Etching Equipment Fab Technical Assistant will support the daily operation and maintenance of etching equipment in the fab, ensuring smooth production and quality control. This role requires hands-on experience with various etching-related tools and inspection processes. 【Job Description】 Perform routine inspections and maintenance on etching equipment, including Dry, Wet, Stripper, Implanter, and RTP tools. Manage material dispatching and ensure smooth equipment operation. Conduct Machine Quality Control (MQC), including particle and etching rate monitoring. Perform In-Process Quality Control (IPQC), covering AOI, CD, and Mura inspection. Collaborate with engineers to troubleshoot and optimize process performance. 【Key Qualifications】 Minimum 2 years of fab operation experience. Hands-on experience with etching equipment and inspection processes. Strong teamwork and problem-solving skills. Willingness to work in a fast-paced fab environment. 【Education & Experience】 High school diploma or vocational school education and above.展開 -
【馬來西亞廠】人才儲備專區 / Malaysia Talents Recruiting
面議(經常性薪資達4萬元或以上) 40000元 東南亞馬來西亞 工作經歷不拘★馬來西亞‧檳城儲備 召集令★ 馬來西亞‧檳城,我們來了! 全球最大金凸塊封裝測試廠 -頎邦科技-即將在馬來西亞‧檳城設廠! 廣召願意於馬來西亞發展的夥伴們一起迎向未來,共創幸福感與成就感的生命共同體! ● 如果您是擁有滿腔熱誠or具備深厚產業技術&積極尋求海外發展機會的技術人才 ● 如果您是長年客居台灣&累積札實產業技能&期望赴馬(返馬)發展的海外人才 ● 如果您是(即將)完成在台學業&對科技業有興趣&希望回國發揮 不用遲疑,快速投遞履歷,掌握發展舞台,就是現在! 【職缺類別】生產製造、設備、製程、產品、整合、品保、生管、IE、IT、自動化工程、廠務、財務、會計、人資(招募尤佳) 【工作班制】常日班(08:30-17:30)、輪班(07:20-19:20/19:20-07:20) 【台灣地點】新竹工業園區/新竹科學園區 【馬來西亞】檳城,須配合工作需求先於台灣受訓後,依時程派駐馬來西亞。 –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ★Malaysia Talents Recruiting★ Chipbond Technology is coming to Malaysia ‧ Penang! As the world‘s largest gold bump packaging and testing corporation, we are looking for talented partners to be part of our exciting journey! WE WANT YOU IF ● Taiwanese Professionals: You are a skilled technical professional with solid industry knowledge and experience, eager for new opportunities abroad. ● International Talents: You lived in Taiwan for several years, accumulated solid industry knowledge and experience, seeking career growth in Malaysia. ● Malaysian Students: You are a Malaysian student about to complete your studies in Taiwan, passionate about technology, and want to return to Malaysia. Submit Your Resume Now and Join Chipbond! 【Job Category】 Manufacture, Equipment, Process, Product, Quality Assurance, Production Management, Industrial Engineering, Information Technology, Automation Engineering, Facility, Financial Accounting, HR Recruiter 【Work Schedule】Day-time (08:30-17:30), Shift (07:20-19:20 / 19:20-07:20) 【Taiwan Work Location】 Hsinchu Industrial Park / Hsinchu Science Park 【Malaysia Work Location】Penang. Training in Taiwan is required before expatriation to Malaysia based on work schedule.展開
