轉職熱搜工作

我們是一家專注於半導體製造領域的專業技術公司，為客戶提供先進的設備解決方案、技術支持及相關服務。主要客群涵蓋晶圓製造商與積體電路設計公司，致力於推動科技創新與產業升級。 工作內容： 1. 於無塵室環境作業，需熟悉無塵衣穿著流程及規範。 2. 進行半導體製程設備的安裝、組裝及調試，確保設備正常運行。 3. 負責設備日常維護及故障偵測與排除，以提升生產效率及降低停機風險。 4. 協助製程測試與優化工作，確保產品品質達到客戶需求。 5. 定期執行設備保養計劃，延長設備使用壽命並改善其性能。 6. 分析設備運行數據，提供優化建議，持續改善生產製程。 7. 與相關部門進行技術協作，解決生產過程中的技術問題。 8. 提供現場人員設備操作與維護培訓，提升生產團隊的技術能力。 歡迎對半導體產業充滿熱忱且願意積極學習的您加入我們，不論您是否有相關經驗，我們重視您的潛力及成長機會，期待您成為我們團隊的一份子！立即投遞履歷，與我們一同推動科技創新！

1. 無塵室作業環境需穿著無塵衣。 2. 半導體設備組裝、維修、保養、調機。 3. 可配合平日和假日加班。 4. 享三節禮金。 5. 歡迎社會新鮮人，肯學習，無經驗可。

1. 先進半導體電漿薄膜與電漿蝕刻製程技術開發。 2. 先進半導體元件整合、製程驗證與材料/電性分析。 3. 半導體技術專案計畫執行。 4. 其它主管交辦事項。

1. 執行請購業務、工程估驗及驗收作業。 2. 半導體廠建廠各系統原理規劃、協助基本設計、細部設計、五大管線審查業務業務。 3. 參與建廠審查計畫(BIM、結構系統設計、自動控制、系統管線、節能)等相關會議。 4. 協助廠務系統運轉及維護保養。 5. 其他臨時交辦事項。

協助執行 IC 設計驗證、先進封裝測試與製程數據分析。參與功率半導體研發專案的實驗採集；配合追蹤良率數據，學習車用電子零件之設計與整合規範。 Assist in IC design verification, advanced packaging testing, and process data analysis. Participate in power semiconductor R&D data collection. Support yield tracking and learn automotive component design specs.

1. 營造土建品質查核及管理。 2. 營造工程進度管理。 3. 依任務需求協助土建、機電AutoCAD套圖審查及修改。 4. 依任務需求協助建立建物及內裝3D透視圖。 5. 依任務需求協助建築BIM衝突偵測與檢討。 6. 其他臨時交辦事項。

1. 於客戶端執行設備的安裝、保養、維修及機台異常排除等。 2. 協助設備操作、參數設定，並進行試樣製程與樣品測試等。 3. 依公司安排至客戶端進行短期出差。（依公司差旅制度辦理） 4. 配合任務性質，支援國內外客戶端之服務需求。

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Principal-Process-Integration-Engineer_R-10063266 Job Description 【Why This Role?】 Drive Core Technology: Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness. Lead Mass Production Breakthroughs: Take ownership of the critical path from New Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM). Cross-Domain Collaboration: Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below). 【Key Responsibilities】 Process Integration Leadership: Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks. Deep Characterization & Analysis: Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions. Yield Enhancement & Stability: Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency. Foundry Management: Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer. 【Required Qualifications】 Education: Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field. Experience: 10+ years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (eFlash, RRAM, MRAM). Data Insight: Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics. 【Preferred Skills】 Process Transfer Expertise: Successful track record in 〝Copy-Smart〝 process migration, ensuring process consistency and rapid yield ramp-up during technology transfer. BCD Process Expertise: Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization. Advanced Node Experience: Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond. Design Collaboration: Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design. 【Soft Qualities】 Analytical Thinking: Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies. Proactive Ownership: Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks. Effective Communication: Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams.

Job Description -　Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. -　Take lead of new product introduction (NPI) for IC test -　To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer -　To improve new product introduction procedure to enable smooth product transfer -　To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation -　To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy -　To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. -　Process of Test Engineering Notice and Enovia ECO Requirement -　Bachelor degree (or above), Engineering background is preferred. -　Excellent communication skills (English/Mandarin, TOEIC＞600) -　Good logic thinking -　Be familiar with MS Office tool -　1 yrs experience in IC testing or related working experience is preferred