轉職熱搜工作

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JR63524 TCP Equipment Engineer The equipment engineer needs to deal with online problems, solve them immediately, and respond to superiors in real time. They work in (day/night) shifts to accelerate their understanding of the machines, deploy probe cards and establish the wafer measurement plant that can realize high quality and high-volume output. *Ensures Product Quality · Performs routine particle quals and 6S and TPM · Develop strong relationships with your counterparts in other Micron Fabs as well as the BAT team and/or the central teams. Strive to implement Best Known Methods into your operation. *Operates and Maintains Equipment · Completes and follows checklists completely and accurately where they are required · Performs Tool operation (i.e. can perform manual wafer movements, quals, leak rates tool set up) · Can use specific software screens to perform maintenance procedures · Performs scheduled PM’s on AREA tool sets following appropriate procedures (checklist) with limited direction · Performs minor trouble shooting on specific AREA toolsets (as defined by lead) which results in fixing it the issue *Environmental Health, Safety and Security · Follow all safety and environmental procedures to ensure compliance with applicable regulations (1)TCP在組織中的定位為何? TCP主要是整個晶圓出貨跟品質把關最重要的一段, TCP接收前段製程完畢的晶圓，並把良率測試出來,再反饋給前段製程做良率的改善.以避免不良品送到後段封測，造成不必要的成本浪費，而測試完成的晶圓會送至後段封測作packing test後出貨.所以TCP是介於整個半導體製程前段與後段最關鍵的角色 (2)TCP和ME有何不同 TCP ：晶圓測試 、ME：晶圓製造，在ME做完晶圓製造後，產品準備到後段封測前都必需經由TCP來做最後的晶圓測試，所以TCP是介於整個半導體製程前段與後段最關鍵的角色 (3) -工作地點:台南 -初期training 及輪班作業會在台中后里廠區,待新廠建置完成後,隨機台裝機數量陸續轉換至台南工作 About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

1.日常產線指標解析與改善 2.任務型各製程站點改善(Assy / FC/ Bumping /FT /WLCSP) 3.各站能力OCAP & SOP 執行步驟優化與KPI 追蹤改善 4. 品質異常追蹤分析

1.Process 開發與改善、線上異常處理、Defect 改善、製程穩定度改善 2.Process tuning and improvement 3.線上異常處理及後續成效追蹤 4.Defect source trace and improvement 5.SPC trend chart monitor

1. 根據工程圖或實樣，準備加工所需材料、工具、刀具及相關設備。 2. 操作精密加工設備進行機件製作，執行簡易加工及修配工作。 3. 分析零件加工製程能力，提出改善方案以優化製造成本。 4. 協助工程師完成設備設計、組裝、測試及操作等任務。 5. 執行機台的例行性清潔與保養，排除操作過程中故障。 6. 循照半導體製程規範進行零件加工，確保產品質量達要求。

1.整理客戶報告、資料分析(excel樞紐、vlookup) 2.文書彙整與報表建立 3.協助工程業務執行 4.其他主管交辦事項

此角色在關鍵工作內容上需承擔專業判斷與結果責任，適合能在清楚標準下持續精進、並為專業輸出負責的人。 1.展機失敗調查 / 處置 2.Process與M/C alarm調查 / 診斷 / 處置 3.製程能力提升 Fan out (參數 / 機台 / Tooling)

1.確實執行全方位製程掌控，以符合客戶產品需求，提高客戶滿意度 2.整合各Module建立process flow，以符合客戶產品需求 3.產品良率維持/提昇，以降低客戶die cost，提高客戶滿意度 4.WAT電性參數SPC monitor (real time)，keep process quality 5.Customized/New process development，滿足客戶需求 6.品質issue分析/解決，即時改善異常

執行產品及技術開發各項工作，分析問題並處理異常，配合團隊完成所執行之任務 1.負責管理產品(及LOT)之製程流程及參數 2.建立元件電性及WAT量測條件，整理及分析電性資料 3.線上材料及產品故障分析 4.工程及技術資料收集，並針對異常或問題解析與處理 5.改善元件特性並提昇產品良率

(1)Lead the development of advanced package 2.5D interposer and 3D wafer-on-wafer platforms. (2)Co-work with module teams to evaluate new processes and resolve issues. (3)Drive FMEA for new product/process integration by aligning cross-module controls, updating control plans, and validating risk mitigations. (4)Monitor and improve yield by analyzing in-line and WAT data, driving process window optimization, and maintaining/updating Best-Known Methods (BKM). (5)Establish and validate new process flows in Design Support Manual (DSM) for customer-specific applications.