轉職熱搜工作

1. 電力系統計算與分析，照明系統設計，動力與接地系統設計，弱電與消防系統設計，避 雷針保護半徑計算書，及相關電力許可申請、建造與試車，操作和維修及報竣作業。 2. 設計電力圖面，如廠務電力系統，製程電力系統，照明系統，一般電力與插座系統，建築物與無塵室接地系統，及避雷系統。 3. 統計電力系統設備材料數量，並彙整成電力系統標單。 4. 與採購合作準備電力相關系統報價單，完成報價作業。 5. 擔任駐廠工程師，帶領電力監工及承包商執行專案。 6. 審查廠商所有送審圖面及資料; 與分包商協調解決並回覆RFI。 7. 其他上級交辦事項。

1. 熟悉功率元件的設計、模擬（如 TCAD 或 SPICE 模擬工具）、封裝及可靠性測試。 2. 熟悉高功率密度與高效率電路設計（如 DC-DC 轉換器、逆變器、車載充電系統等）。 3.有電性參數萃取、開關元件特性分析、EMI/EMC分析等相關經驗 4.熟悉汽車電子的驗證標準（如 AEC-Q101、AEC-Q200）。 5.協助串聯功率元件上中下游廠商

R&D Pilot Line Fab • Updating the Fab engineers on customer issues and technology needs. • Supporting root cause defect and unique fail mode analysis. Process Integration • Delivering advanced technology to meet future product nodes. • Developing recipes to meet structural & electrical requirements. • Managing wafers though Wet&Dry etch levels in support of special requirements. Other Process Areas • Working in cross-functional teams to jointly develop device structures. • Supporting cross-functional failure analysis and yield improvement. Wet or Dry Etch peers • Maintaining or developing expertise in multiple process, hardware, or technology areas. • Serving as a resource for peers in recipe & process development. Qualifications: • Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena • Solid trouble shooting, experimental design and data analysis skills • Strong computer skills, including MS Office • Basic understanding of wet process /plasma etching • Understanding in the principles of wet etch or dry etch processing • Rudimentary understanding of process control and Statistical Process Control (SPC) Education/Experience: MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics 『具工作經驗者，薪資另議』

R&D Pilot Line Fab • Updating the Fab engineers on customer issues and technology needs. • Supporting root cause defect and unique fail mode analysis. Process Integration • Delivering advanced technology to meet future product nodes. • Developing recipes to meet structural & electrical requirements. • Managing wafers though Dry Etch levels in support of special requirements. Other Process Areas • Working in cross-functional teams to jointly develop device structures. • Supporting cross-functional failure analysis and yield improvement. Dry Etch peers • Maintaining or developing expertise in multiple process, hardware, or technology areas. • Serving as a resource for peers in recipe & process development. Qualifications: • Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena • Solid trouble shooting, experimental design and data analysis skills • Strong computer skills, including MS Office • Basic understanding of plasma sources used in plasma etching • Understanding in the principles of dry etch processing • Rudimentary understanding of process control and Statistical Process Control (SPC) Education/Experience: MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics 『具工作經驗者，薪資另議』

1.與製程工程師合作, 共同改善製程的良率 2.微機電產品製程開發，導入量產 3.新材料評估及相關實驗之進行 4.製程整合開發和產品維護

1.半導體晶圓TF薄膜製程開發值班工程師。 2.需配合日夜值班工作。 3.理工相關科系，有經驗者佳。 『具工作經驗者，薪資另議』

1. Conductor etch量產產品品質維護及機台穩定性的保持。 2. 新世代產品、新型機台、少量多樣化產品試產及導入。 3. 新產品Sub-system建立與維護(BR, SPC, TDAS, FDC…)。 4. 製程配方優化的分析與擴展。 5. 設備穩定度的提升與改善。 6. 生產線產品異常管理與改善。 7. 提升產品良率等相關改善工作。 8. 產能規劃、調整與提升。 9. 支援研發新產品試產。 10. Cost reduction專案改善。 『具工作經驗者，薪資另議』

1.監控線上SPC Chart，並針對異常部分即時處理。 2.製程異常分析，並維護產品品質。 3.可以輪替值班為佳，協助線上處理異常。 『具工作經驗者，薪資另議』

R&D Pilot Line Fab • Updating the Fab engineers on customer issues and technology needs. • Supporting root cause defect and unique fail mode analysis. Process Integration • Delivering advanced technology to meet future product nodes. • Developing recipes to meet structural & electrical requirements. • Working in cross-functional teams to jointly develop device structures. • Supporting cross-functional failure analysis and yield improvement.

奇鼎科技創立於2003年，服務項目包括半導體精密恆溫設備、曝光機鏡組保護設備、濕式製程AMC去除設備及節能工程。主要客戶包括國際半導體晶圓廠、高階封裝測試廠與外商半導體設備商，裝機範圍遍布兩岸、美國、德國、瑞士、日本、韓國與新加坡等地。於2024/11/22完成興櫃，並以上櫃為目標，以落實永續經營之政策。 【願景】 為全世界最精密製程提供最佳的製程環境；並協助企業及國家達成碳平衡。 【使命】 以尖端的技術，為半導體產業提供精密製程微環境控制、與節能減碳方案。 【公司文化】 互相關懷、創新學習、使命必達、快樂工作 1.繪圖、 機構設計規劃 2.新零件/技術導入 3.研發專案計畫執行 (計畫書提案/撰寫/預算編列/進度追蹤) 4.客戶/供應商對應