轉職熱搜工作

***Please upload English resume onto our official platform: https://reurl.cc/9WEqOV NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries. Opportunity Join a world class team working on state of the art Tier 1 automotive products. NXP‘s Highly Profitable Business Line Advanced Power Solutions is seeking experienced Mobile Power Analog Designers. We engage directly with the most visible and successful mobile companies. Site Job Description Working in the Power Delivery group of the Advanced Power Solutions business line, candidate will be part of a team developing fast charging and power delivery solutions for mobile applications. Task and responsibilities - Responsible for technical executions from block design, verification, and validation for mixed signal integrated circuits, Guarantee the technical deliverables of his jobs in terms of quality and performance; - This includes system definition, block architecture, circuit design, simulation and layout. All aspects require good engineering skills together with analysis, creativity, collaboration and customer interaction. - Must have strong expertise in analog design theory and device physics, and be capable of applying these to original and novel techniques that can provide significant value. - Write articles for technical publications and conferences, and provide email and phone support for assigned products. - Documentation for design reviews and design notes, layout guidance, and other cell design activities. - Our work culture encourages engineering innovation and creativity. Engineers are expected to file patents, publish papers or technical articles and to maintain awareness of current technical developments. Design engineers are part of a team and interact globally and locally with customers, design partners, product, test and packaging engineers, program management, quality, and business teams. Qualifications - Candidate needs to hold a minimum of a B.S. degree in electrical engineering. M.S. degree is preferred. - At least 10 years direct experience designing analog and mixed-signal transistor level circuitry for power management applications. - Ability to design traditional analog MOS and BJT circuits such as bandgap references, amplifiers, oscillators, detection circuits, linear LDO and switching regulators. - Ability to design multiphase DC-DC switching converter and experienced in current balance circuit. - Knowledge in digital controlled loop design. - Other desirable skills include experience with mixed-signal design tools and flow, reading and writing Verilog AMS models.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

1.NPI階段主導NUDD的製作，參與EE分析，幫助TPM解決相關技術問題。 2.測試coverage評估, 從DFx角度提出改善建議和方案. 3.FA相關會議參與與決議執行, readness準備,分析需求設備評估與購買,分析資料收集,Lab建設與分析工站架設. 4.客戶DOE執行與MIL問題追蹤.

半導體自動測試機研發 1.類比電路設計 2.電路圖繪製Orcad 3.電路區塊之Layout placement規劃 4.產品量產技術移轉

測試線體日常誤測分析改善及異常處理: 1. 產線日常誤測狀況追蹤 2. 測試線日常Topx誤測項目優化改善 3. Retest/NTF daily FA report製作 4. DOE&CR retest FA report製作 5. 測試異常分析報告製作 6. 物料差異分析 7. 維護工程師/技術員技能培訓 8. Equipment BOM清單確認

1. 負責新擴廠之廠務乾燥無塵室、生產空調、辦公空調、冰水、機械空調系統規劃、設計、發包、監造、驗收等專案管理及相關建廠事務的執行。 2. 撰寫計劃書、專案報告、評估報告、工作簡報及相關會議記錄。 3. 歐洲輪調出差，支援歐洲建廠現場空調機電相關之技術支援及溝通。 4. 空調建廠及運轉成本估算、空調機械相關系統設計規範制訂與修正 5. 其他主管交辦事宜。

1.負責高速光電元件量測與驗證 2.執行矽光子（SiPh）/ VCSEL / uLED 光電元件特性分析 3.操作高頻量測設備（VNA、Sampling Scope、PPG、Laser Source 等） 4.建立與優化量測流程、測試治具及自動化程式 5.協助量測數據分析與技術報告撰寫 6.支援晶圓級（Wafer Level）與封裝後光電測試驗證 7.協助部門相關研究計執行，建立研發能量與成果。

你是否擁有機器視覺系統或AOI設備的相關實務經驗？想加入一個不斷創新且充滿挑戰的團隊嗎？我們正在尋找技術熱忱與解決問題能力兼備的你，歡迎您成為我們成功路上的重要夥伴！ ▲主要職務內容： 1.設計並開發客製化報表輸出與測試分析工具軟體(C#)，根據客戶需求持續優化解決方案。 2.收集並分析客戶新應用的量測/檢測需求，並提出可行的開發建議。 3.向客戶進行測試原理說明及進行機台 Demo 演示，協助他們瞭解解決方案的價值。 4.支援業務/PM提供專業 Proposal，確保解決方案滿足客戶的具體需求。 5.規格內的新應用或樣品(DUT)的測試，確保符合技術標準。 6.協助 R&D 團隊進行軟體設計上的 Debug，提升產品穩定性。 7.參與新應用的治具設計，提升產品設計及測試效率。 8.針對 TE 無法處理的 Recipe，協助建立新樣品的量測參數。 ▲理想人才特質： 1.具備軟體程式撰寫經驗及熟悉統計分析工具 2.具備顯微系統整合經驗及影像處理演算法基礎，使用過 Euresys、Halcon 等工具。 3.善於跨領域協調溝通，願意面對新興產業中的光學量測需求並提出解決方案。 4.能夠分析現有產品的技術問題，及時提出解決方案建議。 5.具備良好的英文或日文溝通能力。 ▲加入我們的團隊，您將持續向前： 1.持續學習與成長的機會：參與前沿技術項目，拓展你的技術能力。 2.國際視野的提升：出差機會讓你接觸全球市場，提升職業競爭力。 3.成長導向的工作環境：重視專業發展，鼓勵創新與技術突破，激發你的潛力。 立即申請這個充滿挑戰性和成長潛力的FAE工程師職位，和我們一起引領機器視覺技術的未來！

1. 負責 CDU（Cooling Distribution Unit）液冷設備之產品系統設計與整合。 2. 規劃 CDU 整體結構配置、液冷管路配置、泵浦、閥件、感測器與相關零組件整合。 3. 負責液冷系統之流量、壓力、壓損、管路配置與維修性設計評估。 4. 與機構、電控、熱流、製造、品質及供應商協作，完成產品設計、樣機開發、測試驗證與量產導入。 5. 整合 CDU 內部機電系統，包括電控箱、配電、感測器、控制介面、告警與保護機制。 6. 支援產品規格定義、BOM 建立、設計審查、問題分析與改善對策追蹤。 7. 參與客戶技術需求討論，協助將客戶需求轉換為產品設計規格。

【工作職責】 1.專案全生命週期管理： 負責 AI 資料中心空調與冷卻系統（包含磁浮冰水主機、冷卻水塔、CDU 液冷系統、熱通道封閉等）的工程進度管控、預算審核與施工品質監督。 2.設計審查與技術優化： 審查統包商 (EPC) 提交之設計圖說（含 CSD/BIM）、流體力學 (CFD) 散熱模擬與管網水力分析 (FNM)，確保冷卻能力滿足單櫃極端熱負載。 3.介面協調與整合： 擔任跨部門/跨廠商的技術樞紐，協調空調水路與 IT 機櫃（如 NVIDIA 系統）、電力系統（不斷電與備援發電機）、BMS 環控系統與漏水偵測 (LDS) 之介面整合。 4.試俥與驗收主導： 規劃並督導五階段功能測試（Level 1 FAT 至 Level 5 IST），協同第三方驗證單位 (CxA) 執行滿載測試、連續冷卻（斷電模擬）及各項冗餘備援情境演練。 5.變更管理與風險控制： 具備敏銳的工程風險意識，處理施工過程中的變更設計 (Change Order)，防範潛在的結露、壓降、水質異常或時程延宕風險。 6.運維移交與SOP建置： 協助將竣工系統平順移交給運維團隊 (FM)，參與建立標準作業程序 (SOP) 與緊急應變計畫 (EOP)。