轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=19476&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Supervise the DTP quality performance to ensure customer-satisfactory design services. 2. Maintain DTP quality certification and automotive certification through quality guidance and audits. 3. Enhance DTP quality procedures from a technical perspective, covering the process from upstream to downstream. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1. 架構和數位電路設計 2. RTL實做和驗證 3. SoC chip整合和RTL到gate level實現, 包含timing分析跟量產測試 4. 設計方法和整合流程改善

1. 無線網通系統, 數位設計 2. Micro Processor, 系統架構, low power/效能分析 3. SOC 整合/驗證 4. 工作地點:竹北/台北

我們正在尋找在半導體設計實現 (semiconductor design enablement) 領域具備深厚背景的專家，主要負責先進製程與封裝 (如 3DIC, CoWoS) 的 PDK 開發及 RC 萃取開發。

1. SoC平台記憶體(Memory)系統驗證 2. Memory驗證包含Pre-silicon與Post-silicon階段之功能測試、電性量測與系統穩定度驗證 3. Memory驗證工作與SoC設計、PHY設計、SI/PI團隊及軟體團隊密切合作，確保記憶體子系統於量產前達到最佳效能與穩定性

1. 開發高速介面IP與子系統, 包含PCIe/USB/MIPI/DisplayPort/HDMI/CSI 等等 2. 開發Security, Fusa 等功能於PCIe/USB/MIPI/DisplayPort/HDMI/CSI 等等IP系統

1. ARM CPU subsystem platform design & integration 2. CPU post-silicon issue resolving

1. SoC 上的 MEMSYS 架構設計與 RTL 實現 2. SoC MEMSYS 平台設計（高速、高效率、低功耗、測試） 3. SoC MEMSYS IP 整合（前端 RTL 和設計約束整合、設計流程品質控制、實體時序分析、專案整合任務協調）

軟體：HSI（USB、PCIE、MIPI、UFS、DP、HDMI等）系統軟體（Driver／FW）－設計與驗證 硬體：HSI（USB、PCIE、MIPI、UFS、DP、HDMI等）系統硬體（PCB／PHY）－設計、驗證及PPA分析