轉職熱搜工作

1. Interpret customers’ functional safety requirements into SoC requirements 2. Define the SoC level architectures to meet functional safety requirements 3. Communicate and coordinate safety designs with cross-function IP teams 4. Perform system safety analysis (ex: FMEDA)

1. Develop scalable platform clocking architecture for automotive SoC 2. Enhance SoC clock architecture and technology development to address the automotive SoC requirements 3. Drive clock architecture and designs to optimize power, performance, and implementation, including physical design and timing closure

1. USB4 Controller Development 2. Short term =＞ Improve current design quality of USB4 controller 3. Long term =＞ Next gen USB4 controller architecture define and implementation

* Lead specific architectural domains for SoC architecture design and product technical feasibility studies (e.g., AI, ISP, heterogeneous computing, memory, interconnect, power, safety, vehicle E/E, in-vehicle network). * Lead or support automotive SoC architecture, focusing on system performance and power based on product requirements. * Lead or support technical feasibility studies of product requirements; collaborate with domain architects and product marketing to develop competitive product design specification. * (If manager) Manage the design architecture team, focusing on both technological advancement and talent development.

We are looking for candidates that can communicate complex engineering subjects effectively to cross functioning technical teams and upper management. Strong DFT and leadership skills will be put to good use. Successful DFT architects interact with many external teams and must confidently represent his/her organization. Key Responsibilities • Drive DFT Excellence: Define DFT architecture specifications that enhance ATE and production test environments, optimize test costs, and improve quality across future MTK ASIC product portfolios. • End-to-End DFT Leadership: Manage comprehensive DFT activities spanning architecture definition, design implementation, verification, and test deployment for new product launches • Manufacturing Integration: Serve as a key contributor within MTK’s Global Quality and Operations organization to deliver optimal manufacturing test solutions from early product conception through post-silicon validation • Design Collaboration & Quality Assurance: Partner closely with design teams to ensure accurate implementation of DFT structures and compliance with specifications • Cross-Functional Team Coordination: Lead internal DFT teams in developing and implementing robust test solutions aligned with architectural requirements • Yield Optimization Strategy: Develop comprehensive plans for diagnosability enhancement and systematic yield improvement • Location: Hsinchu, Taipei, Singapore, USA

Our team‘s mission is to leverage next-generation technologies to enhance productivity in MediaTek‘s various processes. This technical position requires a combination of knowledge in IC design and expertise in machine learning/generative AI to identify and define opportunities, design feasible and stable solutions, and improve processes to enhance product quality. We are looking for engineers and data scientists who are passionate about introducing new ideas from diverse fields, enjoy working with complex data, uncovering insights, and are eager to tackle challenges. As a key member of a small and versatile team, you will provide the most appropriate solutions through rapid iterations. In terms of soft skills, you need to have a proactive attitude, an open and continuously adaptive learning ability, excellent verbal and written communication skills, and the ability to collaborate across teams. In terms of hard skills, you need to have strong programming abilities, sufficient knowledge 我們團隊的使命是利用下一代技術，協助MediaTek在各研發流程中提升生產力。此職缺為技術職，需結合IC設計領域知識與機器學習技術/生成式AI，識別並定義機會點，設計可行且穩定的解決方案，以改善研發流程並提升產品品質。 我們正在尋找熱衷於從多元領域引入新想法的工程師及數據科學家，喜歡處理複雜數據、發現洞見，並樂於挑戰困難。作為一個小而多才多藝的團隊關鍵成員，你將以快速迭代的方式提供最適當的解決方案。 在軟技能方面，你需要具備主動積極的心態、開放且持續調整的學習能力、良好的口頭與書面溝通技巧，以及跨團隊協作的能力。硬技能方面，你需要有良好的程式撰寫能力，對機器學習有足夠認知，能與團隊成員合作，並有機會與全球的合作單位有效展開協作。

此職位高度重視執行力、組織協調以及所有ASIC設計的準時交付。 該職位負責協調涵蓋設計、驗證、PD、測試、DFT、封裝測試、營運和供應鏈等多個領域的複雜跨學科工作。 專案經理確保所有內部團隊從概念到生產全程保持一致，同時識別並克服所有風險和跨職能依賴關係。 This role is highly focused on execution excellence, organizational alignment and on-time delivery of all ASIC designs. This role coordinates complex multi-disciplinary efforts spanning, Design, Verification, Physical Design, Test Vehicles, DFT, Packaging Test, Operations and supply chain. The program manager insures that all internal groups are aligned from concept through production while identifying and overcoming all risks and cross functional dependencies.

1.負責 ABF Flip Chip（FC-BGA / FC-CSP）載板 Layout 設計 2.依 IC 封裝規格進行： | Bump / Pad assignment | RDL / Trace routing | Power / Ground 網路規劃 3.與客戶進行技術溝通與問題改善

1. FPGA數位電路設計、除錯、修改、模擬驗證 2. FPGA晶片周邊電路設計與功能電路設計 3. 數位電路規格書與功能測試程序書撰寫

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=532&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Front-end to back-end large scale digital circuit design for system-on-chips and 3DICs, responsible for designing with the state-of-the-art process technologies and developing corresponding CAD flows that explores cutting edge design methodologies and latest EDA tools, either for internal first-in-the-industry testchips or leading customer’s products Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.