轉職熱搜工作

We are looking for a Senior DFT Engineer to define and implement DFT architectures for data center ASIC products. The role involves developing test strategies, integrating DFT features, and improving test coverage for mass production. You will work closely with design teams to ensure robust DFT solutions, yield improvement, and quality. Key Responsibilities • Develop and optimize test strategies to achieve coverage and manufacturing goals; analyze and improve test coverage. • Integrate DFT features at RTL and gate-level, supporting both top and block-level DFT planning and implementation. • Perform ATPG, fault simulation, and coverage analysis. • Collaborate with BE and PD teams to ensure DFT-friendly timing and support IR convergence in test mode. • Lead silicon bring-up and debug of test features; conduct failure and yield analysis. • Work with product teams to facilitate pattern generation, validation, and DPPM improvement.

Work in Analog/Mixed-Signal Modeling and Verification Methodology Development group to establish, streamline and enhance new and existing AMS Behavioral Modeling related development method, coding and validation process and integration flows, and work hands-on with AMS IP Teams for AMS Behavioral Modeling flow and process experiments, demonstrations, adaptions, and deployment. The candidate will work with AMS IP teams including digital design, analog design, analog behavioral modeling and design verification members, apply and advance existing and evolving AMS Behavioral Modeling methodologies and processes, and contribute to establish and maintain Modeling Platform to ensure High Quality and High Efficiency of Pre-Si AMS Modeling, Validation and Verification delivery towards high quality silicon products. • Work in methodology development group to establish, streamline and enhance new and existing AMS Behavioral Modeling related development method, coding and validation process and integration flows. • Work with teams to enable deployment of new AMS Behavioral Modeling flow and processes through experiments, demonstrations, adaptions (for real projects in specified areas such as RF, etc) and integration. • Document on new flows and processes for AMS Behavioral Modeling. • Apply wide range of AMS Behavioral Modeling skills to help and support AMS IP or Chip Teams to establish or enhance new or existing Modeling capabilities, including but not limited to Model Development, Model Validation to ensure Consistency of Behavior with Original Circuit, Integration of Models into various Verification Environment, fixing Modeling issues found in simulation, etc. • Contribute to continuous improving on AMS Behavioral Modeling process for better quality and efficiency through methodology and process improvements. • Communicate and collaborate with global architecture, design, verification teams to address new needs or requirement on AMS Behavioral Modeling. Job Locations: • Taiwan:Hsinchu/Taipei • India: Bangalore • Singapore • USA:Santa Clara, CA/San Diego, CA

1. Develop 3.5D methodology from RTL to GDS and Package 2. Coordinate Thermal and PI/SI team to deal with high power design 3. Execute the project at different phases

We are seeking a highly skilled DFT/DFM Engineer to join our automotive ADAS SoC chip design team. The successful candidate will be responsible for DFT and DFM methodologies, design, and implementation for our advanced automotive system-on-chip (SoC) designs. The candidate will also collaborate with the design and layout teams to integrate DFT/DFM requirements. • SoC testing architecture design • Support project NPI(new product introduction) to MP(mass production) (test program development, coverage enhancement, yield improvement, cost reduction) • Cowork w/ IP, test engineer, process team, board design to fulfill CP/FT/SLT test requirement.

• Chip to Chip 介面類比 PHY 電路，例如 UCIe 標準或客製化的 Die to Die 連結類比電路設計 • HBM/DDR/LPDDR類比PHY電路設計與混合模式/高速電路設計等。

1. Interpret customers’ functional safety requirements into SoC requirements 2. Define the SoC level architectures to meet functional safety requirements 3. Communicate and coordinate safety designs with cross-function IP teams 4. Perform system safety analysis (ex: FMEDA)

(請留意：為加快面試安排時間，2026校招僅限定投遞5個職缺)我們在找這樣的你： 資工/資管/電子/電機/電信/通訊/電控相關研究所背景，對行動通訊、無線及寛頻連結、家庭娛樂晶片解決方案有濃厚興趣的2026年應屆畢業生。 勇於表達意見，以團隊成功為目標，面對困難不輕易放棄，總是在想更好的做法，擁有創新及不斷學習的精神。 聯發科技邀請您，與全球最頂尖的菁英一同合作，彼此激盪最新的創意與解法，共同挑戰每一個不可能。

1. Develop scalable platform clocking architecture for automotive SoC 2. Enhance SoC clock architecture and technology development to address the automotive SoC requirements 3. Drive clock architecture and designs to optimize power, performance, and implementation, including physical design and timing closure

1. Define power states and management hardware architecture for optimal power performance. 2. Design microprocessor-based power management controller and HW assistance designs. 3. Define power architecture by performing power rail tradeoff analysis with adaptive voltage scaling consideration

1. 具備先進製程SoC 晶片 top flow 的專業知識。 2. Advance CTS design 3. 開發先進制程的 Power Mesh 經驗。