轉職熱搜工作

們正在尋找主動積極的「車用產品工程師」，負責監督晶圓製造流程、推動良率提升並解決生產與品質異常。您將與晶圓代工廠及內部跨部門團隊緊密合作，確保我們的車用 IC 產品符合嚴格的「零缺陷 (Zero Defect)」可靠度標準，並遵守相關車規法令規範。

先進封裝技術開發 1. 先進新產品導入技術開發 (新產片試產規劃, DRC/DRM檢驗, DOE及良率改善規劃, 量產區間及良率分析) 2. 熟悉先進chiplet及3DIC封裝技術開發 3. 晶圓級與面板級先進封裝結構設計

1. CPU功耗分析 (設計 vs. 量測), 確保CPU功耗體質 2. CPU最大電流分析 (設計 vs. 量測), 驗證過電流保護機制確保系統穩定性 3. PMIC+PDN+CPU 功耗效率優化 1. CPU power pre-silicon vs. post-silicon correlation. Ensure CPU power quality 2. CPU max. current pre-silicon vs. post-silicon correlation. Validate max. current protection technique for system stability 3. PMIC+PDN+CPU power efficient optimization

1. Automotive Packaging development, New product introduction, Mass production, Supplier management.​ 2. Develop and evaluate the advanced IC Package technology.​ 3. Collaborate with the assembly subcontractors to complete the technology development.​ 4. Qualification and yield improvement for the advanced IC Packages.​ 5. Audit subcontractors.

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek: * Scan chain insertion & ATPG pattern generation * Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.) * Diagnosis to help manufacture process improvement 2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC: * PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation * Develop & integrate DFT-related RTL design modules to test chip

Role Summary: We are seeking a Principal Product Engineer to support advanced optical product development, NPI, manufacturing transfer, production ramp, and sustaining engineering in Taiwan. This is a senior individual contributor role requiring deep hands-on experience in fiber optics, optical module manufacturing, process integration, yield improvement, and cross-functional execution with engineering, operations, quality, supply chain, and contract manufacturing teams. The ideal candidate will serve as a technical lead for optical product engineering in Taiwan, helping drive products from development builds through qualification, pilot production, and high-volume manufacturing. Key Responsibilities: • Lead product engineering execution for optical products from prototype builds through qualification, production release, and sustaining support. • Support NPI planning, engineering builds, manufacturing readiness, test readiness, process transfer, and ramp execution. • Drive technical issue resolution across optical assembly, fiber attach, process integration, module test, final test, reliability, and customer quality. • Work closely with design engineering, optical engineering, packaging, test, reliability, operations, quality, and supply chain teams. • Partner with contract manufacturers and suppliers to resolve yield, quality, process, material, and production ramp issues. • Lead data-driven yield improvement using production data, failure pareto analysis, root-cause investigation, corrective action, and process optimization. • Support development and release of optical assembly and fiber attach processes, including process flows, control plans, inspection criteria, process windows, and manufacturing release criteria. • Provide technical leadership for product characterization, margin analysis, failure analysis, reliability learning, and production excursion response. • Help define manufacturing specifications, test limits, outgoing quality controls, and product-level production metrics. • Support customer or supplier technical escalations related to product quality, manufacturing performance, or reliability.

1. 與業務使用者進行需求訪談與流程討論 2. IT 相關服務的專案管理 3. 公司商務領域的數位化（應用系統、人工智慧、數據）轉型 1. Engagement and Process Discussion with Business Users. (FIN domain) 2. Project Management on IT Service 3. Digitalization (application, AI, data) Transformation for business domain

1. 2.5D/3.5D package technology development​ 2. SoC/Memory heterogeneous integration package development​ 3. Package technology integration, NPI and MP​ 4. Project management​

1.陶瓷材料研發與改善 2.參與新產品與新材料開發，提升產品競爭力 3.規劃並執行實驗，驗證新材料、新技術與製程可行性 4.具豐富材料研發、製程開發或半導體相關產業經驗，熟悉材料分析、製程改善及量產導入流程 5.豐富的研發及專案管理經驗及跨部門整合經驗