轉職熱搜工作
您正在找半導體製程工程師的工作,共計994筆職缺在等你,馬上去應徵吧!
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【2027 TSMC RDSS & AO】Process Engineer (PE)
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22579&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程,改善機台製程參數的設定,提升良率並讓機台每單位時間產出增加,也降低生產成本;半導體製程可大致分為四大模組,大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.展開 -
【2027 TSMC RDSS & AO】Process Integration Engineer (PIE)
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22578&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率,提供給客戶具有競爭力且高品質的晶片,讓電子產品不但先進且效能穩定;製程整合工程師為半導體製造中的重要協調者,需要與客戶溝通了解客製化的晶片應用需求,再將訊息帶回廠內,與各工程單位合作。良率精進工程師監控晶片的良率與缺陷,使用量測機台監測晶片的缺陷,找出可能的問題,再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.展開 -
【2027 TSMC RDSS & AO】Product Engineer (PE)
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22583&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電,成為產品工程師,你將有機會參與世界級先進製程技術,與頂尖團隊合作,挑戰技術極限!你將負責協助產品導入量產、提升良率,並確保產品符合客戶的最高標準。在這裡,你將學習到最先進的半導體技術,並為推動科技發展貢獻力量。我們的專業涵蓋非常廣,從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試,能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝〝More than Moore〝〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.展開 -
【2027 TSMC RDSS & AO】Quality & Reliability Engineer (Q&R)
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22585&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師:為守護客戶產品不受任何缺陷影響,建立優良的產品品質與可靠度,以協助客戶在市場上搶得先機、強化競爭力;QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法,應用於我們的產線,確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案,同時提供最先進的材料與故障分析等服務,成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis with reliability modeling, manufacturing production quality management and reliability assessment, research, and development of new analysis methodology/technique. 3. Customers problem resolving production quality / reliability issues. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.展開 -
2027 台積電預辦登積計畫 2027 TSMC RDSS & AO Program
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22573&source=1111&tags=AO+2027_1111 因為期待無限可能,所以選擇台積電! 台積公司致力於營造一個充滿挑戰、持續學習且充滿樂趣的工作環境,並提供高於業界平均水準的薪酬與福利。加入台積電,您將有機會與世界一流的卓越夥伴共事,透過最先進的製程技術,共同成就改變世界的偉大事業。每一項突破與創新,都凝聚了我們的努力與心血。 2027年台積電預辦登積計畫:招募2027年應屆畢業生與研發替代役 台積電誠摯邀請「志同道合」的您,透過「線上應徵」事先註冊履歷。符合資格者將享有優先面試的機會!參與2027年預聘暨研發替代役熱門職缺,您將可: ▪ 畢業前即拿到聘書 ▪ 與優秀產業菁英共事 ▪ 在國際舞台盡情發揮 截止收件日:2026/10/31 如您對此計畫感興趣,台積電將前往校園辦理徵才活動;活動當天安排畢業校友與同學們互動交流,機會難得,敬請把握。 此外,為同學安排了校園實體與線上說明會,歡迎踴躍報名參加,以便了解公司市場趨勢、組織概況,並掌握求職技巧! 報名連結請參考官網 建議您根據學習領域與專業,投遞申請以下2~4個職位。符合主管需求者,將會收到面談邀請通知。 ▋歡迎志同道合的你,一起加入台積電 ▋世界上的每一個夢,都由我們來圓夢 Join TSMC: Where Infinite Possibilities Await. At TSMC, we believe in creating a challenging, continuous learning, and enjoyable work environment. We offer competitive compensation and benefits that exceed industry averages. Join us, and you‘ll collaborate with world-class talent, leveraging the most advanced process technologies to achieve breakthroughs that change the world. Every innovation and advancement carry the mark of our dedication. Are you ready to make an impact? We invite like-minded individuals to pre-register and submit resumes online through the 2027 TSMC RDSS&AO Program. Qualified applicants will receive priority interview opportunities! We are organizing both on-campus recruitment and online information sessions. We encourage you to sign up for the upcoming events to gain insights into the market trends, organizational overview, and master essential interview skills. Registration Link: Please refer to the career website Please apply online for this Campus Recruitment Event. If you already have preferred job openings, you may additionally apply for 2 to 4 positions from the list below. ▋2027 台積電預辦登積計畫熱門職缺 2027 TSMC RDSS&AO Recruitment Hot Jobs : (Please refer to the job in the career website for the details for each job below): R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D) 1-2 Design and Technology Platform Engineer (DTP) 1-3 Specialty Engineer (Specialty) 1-4 Advanced Packaging Technology Development (APTD) Operations (營運組織) 2-1 Process Integration Engineer (PIE) 2-2 Process Engineer (PE) 2-3 Equipment Engineer (EQ) 2-4 Intelligent Manufacturing Engineer (IMC/MFG) 2-5 Facility Engineer (FAC) 2-6 Product Engineer (PE) 2-7 Advanced Packaging Technology and Service Engineer (APTS) 2-8 Quality & Reliability Engineer (Q&R) Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT) 3-2 Corporate Planning Organization (CPO) 3-3 Materials Management (MM) 3-4 Human Resources (HR)展開 -
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自動化設備調整助理工程師(台中)(薪資含加班可達5萬)
面議(經常性薪資達4萬元或以上) 40000元 台中市西屯區 工作經歷不拘1. 監控與維護自動化生產設備(搬運機器人、自動測試設備等)。 2. 收集與分析設備運行數據,支援製程改善與自動化專案。 3. 協助新設備導入、測試與自動化流程優化。 4. 與製程工程師、設備工程師及 IT 團隊合作解決設備及系統問題。 5. 遵守晶圓廠 Cleanroom 規範及設備操作安全規範。 條件要求 • 專科或以上機電、自動化、電機或相關科系畢業。 • 具備自動化設備排除故障經驗。 • 能接受輪班。 加分條件 • 半導體晶圓廠工作經驗者優先。 • 英文讀寫能力佳,可閱讀技術文件。展開 -
自動控制技術人員(台中)(薪資含加班可達4.5萬)
面議(經常性薪資達4萬元或以上) 45000元 台中市西屯區 工作經歷不拘1. 安裝自動化生產設備(搬運機器人、自動測試設備等)。 2. 協助新設備導入、測試與自動化流程優化。 3. 遵從製程工程師、設備工程師指派業務。 4. 遵守晶圓廠 Cleanroom 規範及設備操作安全規範。 加分條件 • 半導體晶圓廠工作經驗者優先。展開 -
Data analysis & AI solution engineer for advance process nodes
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 4~5年工作經驗* 根據積體電路設計流程、半導體器件、良率提升等相關知識進行數據分析 * 建立人工智慧框架與工作流程,以提升數據運營與分析的生產力 * 與不同的內部及外部團隊溝通協作,提出策略建議展開 -
IC 封裝資深工程師/技術副理
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 8~9年工作經驗1. IC封裝/晶圓凸塊技術開發與管理 2. 與封裝廠合作完成規劃之技術開發 3. 先進封裝技術開發,品質驗證與生產良率管理 4. 定期與不定期執行bumping/fan-out/WLCSP廠品質稽核展開
