轉職熱搜工作

1. 於客戶端執行設備的安裝、保養、維修及機台異常排除等。 2. 協助設備操作、參數設定，並進行試樣製程與樣品測試等。 3. 依公司安排至客戶端進行短期出差。（依公司差旅制度辦理） 4. 配合任務性質，支援國內外客戶端之服務需求。

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

1. 製程研發： 負責新製程的研發、優化與實驗，以滿足產品需求，在3D結構產品實現均勻鍍膜 2. 參數設定與驗證： 設定新設備參數並進行量產驗收，確保新製程穩定。 3. 設備改善： 進行設備改造、升級或開發。 *須出差

1.NPI階段主導NUDD的製作，參與EE分析，幫助TPM解決相關技術問題。 2.測試coverage評估, 從DFx角度提出改善建議和方案. 3.FA相關會議參與與決議執行, readness準備,分析需求設備評估與購買,分析資料收集,Lab建設與分析工站架設. 4.客戶DOE執行與MIL問題追蹤.

測試線體日常誤測分析改善及異常處理: 1. 產線日常誤測狀況追蹤 2. 測試線日常Topx誤測項目優化改善 3. Retest/NTF daily FA report製作 4. DOE&CR retest FA report製作 5. 測試異常分析報告製作 6. 物料差異分析 7. 維護工程師/技術員技能培訓 8. Equipment BOM清單確認

1.機械設計相關經驗，熟悉AutoCad、Inventor或Solidworks等操作軟體，具熱誠能服務客戶者，機械本科系應屆畢業有相關經驗，或工作兩年以上3D繪圖軟體及動畫經驗佳，能獨立作業者優 2.進行機械設計電子設備圖面，並施作BOM表，選用適合物件材料 3.協助跨部門相關單位，處理客戶端對於電子設備問題、或製程參數問題 4.處理製造組裝測試所衍生的相關問題，並確認組裝完成後，出貨設備與設計圖面原意相符 5.對於半導體先進封裝設備、光電專用設備、PCB電路板生產設備有興趣者 6.工作態度認真負責、人格特質樂意團隊合作者優先邀請面試

1. 解決半導體客戶應用技術問題，並回饋給相關單位。 2. 撰寫客戶端的技術文件與規格說明。 3. 提供客戶正確的產品規格與應用資訊，作為客戶設計產品、優化製程的參考依據。 4. 提供客戶偵錯服務與技術支援，協助發現並解決產線試產時所發生的問題。 5. 提供客戶量產測試服務，分析並解決量產時發生的問題。

1.機構設計,模擬分析與方案結構提案。 2.半導體專用自動化設備研製/機構設計與結構評估。 3.繪製機構設計圖面,熟2D,3D。 4.設備功能&製程改善 5.機構材料的測試與選用。 6.可行性評估 7.測試與安裝