轉職熱搜工作

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

Role Summary/Purpose Experienced hardware designer will closely work with worldwide engineers to perform engineering works for hardware testing solutions of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting-edge requirements and future technology, work here can be interesting and exciting. Job Description • Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers • Collect and analyze customer input, make sure it is complete and feasible • Provide constructive suggestions of interface hardware solutions to customers to close electrical/mechanical gaps, ensure smooth execution of customer project • Evaluate and provide project sizing including schedule, cost, resource, feasibility • Hands on critical part of high complexity project such as high-speed signal topology, RF signal, high current signal, signal integrity, mechanical consideration, design for manufacturability and design for assembly • Project execution/management including resource/task assignment, collaboration, daily mentor, schedule management, risk mitigation, quality control • Act as cross team interface between customer, manufacture and assembly supplier to ensure well project execution through close communication • Execute assigned technical roadmap research and development • Support team development through mentoring, knowledge sharing and training • Deliver hardware design training and seminars to customers • Keep close communication with worldwide Teradyne teams and customers

職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班。 1. 負責 Probe Card 飛針測試包含開發、驗證與量產前測試 2. 撰寫與維護 飛針測試程式 3. 進行 電性量測（Continuity / Short / Open / Resistance / Leakage 等） 與測試結果分析 4. 協助 Probe Card 組裝後電性驗證、良率分析與問題排除 5. 與 製程、設計、製造、客戶端工程師 溝通測試需求與規格 6. 分析測試異常，提出 改善方案與測試流程優化建議 7. 建立與維護 測試規範、SOP、FA 報告與技術文件

1. 根據設計圖紙及說明書，精確組裝各類設備零組件。 2. 執行設備的初步調試，確保各部件間的協同運作，熟悉各種設備的硬體結構與工作原理。 3. 使用專業儀器及工具，進行設備的組立裝配、功能測試與性能檢測，發現錯誤並進行故障排除或回報研發工程師。 4. 記錄並分析測試數據，撰寫測試報告，提供改進建議以提升設備運行效能。 5. 提供現場設備的安裝與技術支援。 6. 與設計、製造及品質控制部門合作，反饋組裝與測試過程中的問題，並管理相關技術文件。 7. 遵循工作場所的安全操作規範，確保工作環境及人員的安全。 歡迎加入我們，成為我們團隊的一員，共同致力於打造高品質的電腦及週邊設備！期待您的加入！

a.工作能力需求: 硬體工程技術開發、硬件系統設計、電路板佈局規劃 b.工作內容: 開發無人機相關電子零組件。在無人機或相關技術產業的硬體設計和測試方面擁有經驗。對電力和通訊系統有深入的了解；具航模、無人機相關電子零組件經驗者優先。精通電路設計和分析軟體。具有焊接、返工電路和建構原型的實務經驗。分析技能：能夠分析電力和通訊系統，將複雜的資訊綜合成易於理解的圖表和圖形。

1.學習醫療軟體系統與健保相關規定。 2.透過連線或通訊遠端協助醫療院所排除系統故障與健保相關業務。 【其它條件】 1.具備服務熱忱與耐心，不會對與客戶互動恐懼. 2.具備相關經驗者，優先錄用 . 【發展與福利】 1.可依興趣與能力輪調系統研發、業務、輔導師、硬體工程師。 2.公司台北、桃園、台中、高雄、花蓮、嘉義有分公司，可依需要調整。 3.採360度評量，三節獎金依績效0.5-2.5萬，2萬國外旅遊補助、個人月績效獎金，部門月獎金與年終獎金。 4.★★滿一年以上平均含獎金(包含年終)與其他給付,月薪約為月薪之1.4-1.6倍★★

1.筆電擴充基座產品開發 2.電路設計(OrCAD)、驗證、除錯 3.PCB Layout review (Allegro) 4.與其他單位協同合作 5.產品問題之分析處理。

1.PCB Layout design全任務 : 負責完整PCB Layout設計流程，包含Pre-Layout、Placement、Routing、Split/Mix Plane、DRC及Gerber Out等。 2.PCB Layout modify : 執行PCB Layout修改與優化，整合機電設計需求，並符合EMC相關規範。 3.PCB Manufacture matter : 涵蓋設計、製造與組裝階段之工程問題回覆與解決，並具備良好跨部門溝通與協調能力。 4.PCB Layout evaluation : 負責可行性評估（含尺寸規劃），並執行外包專案管理及與板廠進行技術Q&A討論。 5.負責專案報告撰寫、文件審核與輸出，以及Layout相關新零件建立與整合工作。 6.帶領團隊運作，進行人員管理、指導與培訓，促進團隊整體能力提升。 7.熟悉Allegro、PADS等PCB Layout相關軟體操作。 8.負責零件資料庫建立及維護，確保資料完整性與一致性。 9.具備BGA/CSP及HDI多層板結構設計經驗。 10.其他主管交辦事項。