轉職熱搜工作

崗位職責： 1. 負責CP/FT/SLT/Burn-in 測試配件開發與驗證 2. 先進封裝測試配件新技術新需求開並導入量產 3. 測試配件供應商管理 1. CP/FT/SLT/Burn-in test accessary(probe card/loadboard/socket) development 2. vendor engagement to find out the best testing solustion for advanced package new requirement 任職要求： 1. 8年以上 CP/FT/SLT/Bur測試配件開發並導入量產經驗 2. 具有先進封裝測試配件開發經驗 3. 具有配件供應商管理經驗 4. 跨部門溝通能力佳(英文:流利) 1. 8+ years CP/FT/SLT/Burn-in test accessary(probe card/loadboard/socket) development experience 2. Experience in CP/FT/SLT/Burn-in bring up 3. Experience in advanced package CP probe card new technology development 4. Experience in vendor engagement 5. Good comunication skill (English: flunt)

崗位職責： 1、Responsible for the overall Burn-in solution, including test planning, program development, BIB board design, and customer negotiations. Provide solutions and technical support for customer products. 2、Collaborate with other departments (such as R&D, Quality Control, Software, etc.) for Burn-in testing and verification. 3、Manage OSAT to ensure test quality and mass production targets. 4、Manage suppliers to ensure supplier quality, problem resolution, and continuous improvement. 1、負責Burn-in整體解決方案，包括測試規劃、程式開發、BIB板設計及客戶洽談。為客戶產品提供解決方案及技術支持。 2、與其他部門（如研發、品管、軟體等）協作進行Burn-in測試和驗證。 3、管理外包廠，確保測試品質及量產目標。 4、管理供應商，確保供應商品質，解決問題並持續改進。 任職要求： 1、Bachelor‘s degree or above, with over 5 years of work experience. 2、Familiar with Burn-in hardware, firmware, and program development, able to analyze test data, write test reports, and provide professional advice on test results. 3、Familiar with BIB design and able to liaise with suppliers. 4、Proficient in C/C++, C# programming or MCU programming 5、Experience in vendor engagement. 6、Good communication skills (English: fluent). 7、Able to accommodate short-term domestic and international business trips. 1、大學及以上學歷，具有5年以上工作經驗。 2、熟悉Burn-in硬體、韌體及程式開發，能夠分析測試數據、撰寫測試報告，並對測試結果提供專業建議。 3、熟悉BIB設計，能與供應商對接。 4、精通C/C++、C#程式設計或MCU程式設計。 5、具有供應商管理經驗。 6、良好的溝通能力（英語：流利）。 7、能夠配合國內外短期出差。

崗位職責： 1. 負責CP/FT/SLT/Burn-in 測試配件開發與驗證 2. 先進封裝測試配件新技術新需求開並導入量產 3. 測試配件供應商管理 任職要求： 1. 8年以上 CP/FT/SLT/Bur測試配件開發並導入量產經驗 2. 具有先進封裝測試配件開發經驗 3. 具有配件供應商管理經驗 4. 跨部門溝通能力佳(英文:流利)

1. 企業/家用WIFI AP路由器 開發經驗者尤佳 2. 高速介面應用, 驗證及除錯 e.g. USB, PCIe, xGMII, Ethernet, DDR 3. 802.11 a/b/g/n/ac/ax/be WiFi SoC及Ethernet SoC驗證, 公板設計及驗證 4. Power/Thermal/EMI 防治對策 5. 支持客戶應用及量產導入 6. 熟悉HW設計的TOOL 如OrCAD, PADS, Allegro

1. 高速信號介面及系統電源應用規劃整合、除錯等手機系統應用. 2. Baseband系統驗證方法開發、電源規格訂定及驗證規劃 3. 客戶參考設計文件訂定及量產相關技術支援.

1.研讀並分析網路運營商規格（spec），明確界定需進行技術評估的範疇 2.協調並分派研發團隊（RD）進行MTK產品的合規性（compliance）評估，並與研發團隊進行技術討論 3.統籌規劃網路運營商規格評估專案，負責專案時程與產出品質的控管 4.彙整並完善評估結果，撰寫產品認證相關文件，提交給網路運營商及客戶 5處理客戶提出的合規性需求，並協調相關單位進行跨部門討論與資源整合 6. 負責嵌入式系統平台的BSP相關開發與維護, 支援作業系統（如Linux、RTOS）在新硬體平台上的移植 1. Review and analyze mobile network operator specifications to clearly define the scope for technical evaluation. 2. Coordinate and assign R&D teams to assess the compliance of MTK products, and engage in technical discussions with R&D. 3. Plan and oversee operator spec evaluation projects, ensuring project deliverables are on schedule and meet quality standards. 4. Consolidate and refine evaluation results, prepare product certification documents, and submit them to operators and customers. 5. Address customer compliance requirements and coordinate cross-functional discussions with relevant departments. 6. Responsible for the development and maintenance of BSP (Board Support Package) for embedded system platforms. Support the porting of operating systems (such as Linux, RTOS) to new hardware platforms

Analog circuit design, including ADC, DAC, PLL, PGA, OPAMP and analog front end circuit design.