轉職熱搜工作

1. Participate in the design and development of Base-Band or RF HW System-in-Package(SiP) modules 2. Use simulation tools such as Cadence, HFSS, Siwave and ADS for design verification and optimization 3. Electrical measurements using power supplies, oscilloscopes, VNAs, and signal generators 4. SiP module schematic design, layout planning and BOM release 5. Collaborate with packaging, layout, and process teams to evaluate the impact of SiP, fan-out, and substrate structures on electrical performance

1.新產品生產前協助產品通過認證，並向相關單位申請安全認證。 2.安規測試及申請作業簡單化，正確性之改善。 3.熟悉IEC 62368-1/IEC 60950-1 4.無相關經驗可，有完整教育訓練培訓

※ Excellent English and communication skills, capable of working independently ※ Project management capabilities, including new product feasibility assessment and cost estimation ※ New product testing process planning and SOP development ※ 5+ years of experience in plastic mold development, product design, and manufacturing ※ 5+ years of experience in extrusion, die-casting, and CNC machining processes ※ Familiarity with plastic mold manufacturing, injection molding, plastic materials, and general metal materials ※ Knowledge of mechanical and electronic integration concepts and related practical experience ※ Experience in drone product development is preferred

1.Experience in signal integrity simulation of system boards and lab instruments, including VNA and TDR. 2.Experience with PDN characterization and trade off performance & cost. 3.Excellent communication and presentations skills are mandatory

工作內容： 作為產品工程團隊的一員，設計團隊中的電子工程師，須與大家一起驅動新產品的開發，工作重點放在電子系統分析與設計。 主要負責： 1. 電子電路設計與光電產品系統設計 2. 設計文件建立與修改 3. 樣品原型驗證與檢討。 4. 與設計團隊進行產品整合及測試。 5. 研究分析最新技術 6. 將最新技術導入設計並量產。

◆AT BU 產品服務： 晶圓重組、晶圓/成品測試&生技醫療產品封裝、通訊模組封裝─Bio、RF 1.功率元件電性量測分析、測試報告產出、新產品測試方案導入量產 2.具備量測設備操作經驗(Curve Tracer,Oscilloscope,Source Meter,ATE...eta) 3.評估新測試儀器、對接設備供應商、執行前期規格驗證 *工作待遇/職稱：將依學經歷及專長等條件進行敘薪。