轉職熱搜工作

1. RFP Technical response: Generate H/W Documents as FRU Spec., Qual-Checklist, ProgramIC List, DMI spec., etc… 2. Manufacture Engineering: Technical support/debug for global factories especially for testing. 3. Lead the FA/critical issues & find out the root cause 4. Global EC handling 5. JIRA handle & response 6. New Product Transfer/Enablement into global factories 7. 2nd Source technical evaluation

產品線: Server產品 1.Familiarity with VHDL/Verilog coding and FPGA/CPLD design flow is a must 2.Familiarity with Lattice/Altera/Xilinx EDA design tool. 3.Familiarity with FPGA/CPLD design in server application and multiple bus protocols including I2C / power sequence / SPI / LPC / SGPIO / I2C switch/ UART / PWM / eSPI 4.Strong HW and x86 architecture knowledge is a plus. 5.Fluent English written and verbal communication skills. 6.Integration and test experience 7. Highly self-motivated, able to work independently in a lab environment.

1.車載系統規劃設計 2.硬體開發(電路、元件、Layout) 3.支援研發流程管理 4.研發外包管理與設計確認 5.需求分析及可行性評估 ※工作待遇：將依學經歷進行敘薪。

【About Garmin】 Garmin是一間著重多元發展的跨國企業公司，涉足的領域包含車用、戶外健身、航空、航海等消費性電子產品。 【About Electronics Engineer】 電子產品工程師是Garmin各種產品能順利誕生的核心人物，舉凡新技術的研究、產品性能驗證、量產導入等，電子產品工程師都是不可或缺的重要角色，工作內容如下 : 1. 電路除錯及產品之特性分析與驗證。 2. 產品量產導入，包括試產之準備、測試流程方法、電氣治具設計與品質把關。 3. 產品實測，近距離與市場接觸。 4. 與世界各地的工程團隊交流與解決問題。 【Good to have】 1. 電機電子相關背景，具電路分析與電路設計的能力。 2. 熟習電子儀器及模擬軟體使用。 3. 基礎資料分析與程式能力。 4. 喜歡學習新知識與技術，保持開放積極的態度且富有好奇心。 5. 樂於與人溝通合作，且有外語交流能力。 6. 善於解決問題，且有責任感。 *投遞履歷請詳閱下方【其他條件】欄位*將優先審核履歷

一、質量校正與測試工作執行： 1. 法碼校正 2. 系統維護: 定期進行系統查核確保系統正常運作。 二、力量感測系統之研發與整合： 1. 參與力量感測系統硬體電路設計與製作。 2. 進行力量感測系統軟體開發與整合。 3. 進行力學領域相關技術研究，如壓力、應力、扭力等。

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs. Responsibilities include: • Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. • Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. • Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. • Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes • Contribute to validation team on improving test plan/method to validate features and verify fixes • Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool • Define and drive the system debug process implementation and ingredient owner engagement and alignment Qualifications: The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following: • Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform • Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels • Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred • Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. • Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. • Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; • Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

【主要職責】 負責系統模組 SoM（System-on-Module）之電子電路／系統設計及軟硬體開發工作。 【職務內容】 1. 負責電子電路系統的規劃與研發設計。 2. 執行電路圖設計與電路板佈局規劃。 3. 規劃產品驗證項目，並協助導入至量產階段。 4. 研發過程中與EMC等相關單位協作，確保產品符合規範。 5. 進行備料規劃與BOM建置。

※公司福利： (1). 穩定發展的優良企業。 (2). 一年兩次年度獎金(夏季及冬季)發放。 (3). 本公司屬東京證券上市公司NEC的關係企業。 (4). 本公司屬東京證券上市公司的日本航空電子全資子公司。 (5). 工作環境舒適，2024上半年度離職率只有1.95％。 (6). 本公司提供團體保險，退休禮品，輪班津貼，加班誤餐費，久任禮金。 ※福利會補助: • 生日禮券。 • 結婚禮金。 • 生育補助金。 • 喪事慰問金。 • 三節商品券。 • 住院慰問金。 • 社團活動補助。 • 特約商店優惠 (飯店•遊樂園•餐廳等) ※工作內容: 1.連接器製品設計開發。 2.連接器關聯實驗。 3.圖面、規格書作成。 4.開發成本計算。 5.具車載相關經驗優先錄取。

1. 熟悉電路設計與pcb layout 軟體,, 2. 熟悉VNA/SCOPE操作, DEBUG能力佳, 3. 具獨立思考與解決問題能力, 4. 需有團隊合作精神。 5. 其他主管交辦事項。