轉職熱搜工作

職務說明： MPQE (Manufacturing Product Quality Engineering) 部門說明： 產品品質工程致力於以最適品質與成本進行監控，並在期限內完成品質卓越的產品； 量產後產品品質異常處理& 客退品軟體問題再現與分析& 客退品軟體類別改善推展。 Product：Wearable device / outdoor / Marine support Job scope： 1. SW Quality problem solving and monitoring (a) Production quality KPI tracking (b) Production abnormal quality handling with 8D approach (c) Lesson learned feedback 2. Customer return failure analysis and monitoring (a) Return rate KPI tracking (b) Failure analysis and 8D report preparation (c) Lesson learn feedback 3. Data Analysis & Reporting (a) Quality data extraction & trend monitoring (b) Identify early risk signals before field escalation 4. Cross functional & Global collaboration (a) Work with Global/ASIA Quality team/SE/SQ team (b) Coordinate with international teams, participate in technical review meetings

1. 高/低速訊號完整性測試計畫 2. 訊號問題分析 3. 客戶溝通 4. 訊號量測技術研究與導入 1. High/Low speed signal validation 2. System HW validaion 3. High speed bus length review 4. System margin test 5. PCB impedance/insertion loss test

1.工站設備準備(依生產計畫等資訊來估算設備與工站數量,執行採購申請與進度追蹤) 2.工站設備架設與維護 3.問題分類/日誌收集分析追蹤 4.進行軟體實驗驗証及回歸測試 5.維持及流程優化

Job Summary/Key Responsibilities . To design, develop, and integrate diagnostic software solutions for servers, storage, and AI accelerator platforms, enabling automated testing and efficient issue resolution in collaboration with hardware and firmware teams. · Design and implement diagnostic software for hardware platforms. · Develop automation tools and scripts for testing and validation. · Integrate diagnostics with production and lab environments. · Troubleshoot hardware and software issues with cross-functional teams. · Document diagnostic procedures, tools, and technical guides. · Evaluate and adopt new tools or technologies to enhance diagnostics.

1. Responsible for Windows driver management for assigned projects 2. Windows driver issue analysis 3. Cross-team and company collaboration

1. 醫材類比/數位電子電路硬體設計，具規劃設計schematic。 2. 評估零件與規格，選用適合零組件。 3. 訊號量測分析，電路功能除錯及驗證。 4. 可與軟韌體工程師、機構工程師一同合作佳。 5. 系統問題分析與解決方案驗證。

1. 參與高階網路交換機的硬體架構設計與系統規劃 2. 設計並驗證 PCB 電路板，確保高速訊號完整性與可靠性 3. 整合 ASIC/FPGA、SerDes、PHY 等高速晶片模組 4. 開發與測試 100G/400G/800G Ethernet 介面及光模組整合 5. 進行硬體 bring-up、功能驗證與效能測試 6. 與韌體/軟體工程師合作，確保硬體與系統整合順暢 7. 撰寫技術文件、測試報告，並支援量產與品質控管

1.開發機器人應用程式、通訊架構和狀態機 2.開發底層硬體的韌體 (Firmware)，控制感測器、致動器等硬體元件 3.負責機器人的遠端監控、數據收集與分析、韌體更新 (OTA)、多機器人協同作業、雲端 AI 運算

1.無人機建模、飛行控制方法研究 2.無人機飛行控制軟韌體開發 3.無人機地面站軟體開發 4.協助排查無人機機電整合問題