轉職熱搜工作

1. Develop and implement EVB procurement and business strategies. 2. Coordinate with R&D/Engineering to confirm EVB specs, quantities, uses, budget, and delivery schedule. 3. Source suitable EVB suppliers and manage second source options. 4. Issue RFQs, compare quotations, and assist supplier selection. 5. Support technical reviews and sample testing. 6. Confirm procurement terms, place orders, and track delivery. 7. Manage goods receipt, handle issues, and provide after-sales support. 8. Establish and monitor key KPIs, resolve issues promptly, and implement process controls. 9. Maintain supplier evaluation and procurement procedures; conduct audits and acceptances. 1. 制定並執行EVB採購及營運策略。 2. 與研發/工程部門協調，確認EVB規格、數量、用途、預算及交期。 3. 探尋合適的EVB供應商，並管理第二來源選項。 4. 發送詢價單，比較報價，協助供應商選擇。 5. 支援技術審查及樣品測試。 6. 確認採購條件，下單並追蹤交貨進度。 7. 管理收貨驗收、處理異常問題，並提供售後服務。 8. 建立及監控關鍵KPI，及時解決問題，並實施流程管控。 9. 維護供應商評估及採購流程，執行稽核與驗收流程。

1. 2.5D/3.5D package technology development​ 2. SoC/Memory heterogeneous integration package development​ 3. Package technology integration, NPI and MP​ 4. Project management​

職責要求 • 與總經理及各部門一級主管緊密合作 Work closely with the GM and senior department heads • 專注於半導體市場與產業研究 Conduct semiconductor industry and market research • 規劃Go-to-Market策略 Develop Go-to-Market strategies • 主導Segment Marketing與策略分析 Lead segment-level marketing and strategic planning 任職資格 • 大學以上，主修化學、物理或相關理工科系，並具備半導體製程知識者尤佳 • 有1至2年半導體廠製程工程師經驗者尤佳 • 活潑、積極，對科技新技術抱有熱忱 • 喜歡與人互動、溝通能力佳 • 具備邏輯思考與策略判斷能力 • 英文精通

1. Automotive Packaging development, New product introduction, Mass production, Supplier management.​ 2. Develop and evaluate the advanced IC Package technology.​ 3. Collaborate with the assembly subcontractors to complete the technology development.​ 4. Qualification and yield improvement for the advanced IC Packages.​ 5. Audit subcontractors.

1. 車用客戶品質窗口，負責前期品質相關討論(APQP,RFQ,PPAP..etc)與量產品質持續改善 2. 負責車用客戶異常退貨分析與溝通 3. 協助車用客戶生產品質改善 4. 推動內部品質系統流程精進

先進封裝技術開發 1. 先進新產品導入技術開發 (新產片試產規劃, DRC/DRM檢驗, DOE及良率改善規劃, 量產區間及良率分析) 2. 熟悉先進chiplet及3DIC封裝技術開發 3. 晶圓級與面板級先進封裝結構設計