轉職熱搜工作

1.Work with cross-functional teams from Process Integration, Modelling, PDK, and Design Enablement to develop advanced BCD (Bipolar-CMOS-DMOS) technologies for 300mm fabrication. 2.Lead technical engagement with consumer and automotive customers to understand and define device requirements. 3.Generate BCD active and passive device P-cell layouts based on application specifications. 4.Collaborate with the Modelling team to develop accurate SPICE models. 5.Drive implementation of specialised device features into PDKs and ensure timely communication and technical validation with customers. 6.Enhance BCD device performance to meet evolving application needs.

1.Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions. 2.Design and qualify new process modules and RF device structures to enhance platform capability and performance. 3.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications. 4.Collaborate closely with customers on new product verification, process customization, and technical alignment. 5.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.

1.規劃每日工單下線排程及要求生產配合 2.收集與分析各製程站生產週期能力及限制條件 3.急件材料交期之跟催及回覆 4.排除廠內生控人員異常狀況 5.規劃與控制投入之材料規格 6.確認每日收料與營收達到預期目標 7.其他上級交辦事項

At UMC, your growth is engineered for resilience. We combine long-term stability with non-linear, adaptable career paths, giving you the opportunity to make real impact, while growing with purpose. With our newly expanded Fab and facilities in Singapore, we’re investing in a future-ready workforce equipped to lead in the world’s most advanced manufacturing environments. With us, you can expect at UMC: • Career Resilience: Be part of a stable, values-led company with a track record of supporting our people, even in uncertain times • Growth that Fits You: Explore flexible development paths, cross-functional opportunities, and internal mobility • Meaningful Impact: Help deliver technologies that power everything from AI to smart mobility and sustainable innovation Main Responsibilities You’ll lead work that powers the day-to-day technologies behind modern life, from mobility and connectivity to smart systems and sustainable design. As a Quality Assurance Engineer (Customer) in our team, you will: • Plan and implement the Abnormal Handling (ABS/PAR/IEAR/BPD) system, assisting the FAB reviewing process abnormalities establishing an early warning notification system, with the aim of reducing quality loss and cost for the company and customers, and supervising the effectiveness of system execution. • Plan and implement the MRB (Material Review Board), assisting the FAB reviewing waived products resulting from process abnormalities, in order to reduce quality loss and cost for the company and customers, and supervising the effectiveness of the system. • Plan and implement internal audits, assisting the FAB in identifying processes and systems with quality risks, and supervising the effectiveness of improvements to risk processes. Plan and implement the MSA (Measurement System Analysis) system, assisting the FAB in performing calibration and capability assessment of measuring instruments to ensure the reliability of measurement values and thus ensure product quality. • Implement the automotive service package, assisting the FAB in planning executable methods and systems, and auditing and supervising the execution process for automotive products.

1.Day to Day monitoring and ownership to timely address in-line defect abnormality escalation, handling and disposition 2.Render support in Production ramp-up, New process implementation and process characterization for project success 3.Evaluate and implement productivity projects for DM Production, Tool and Cost index improvement 4.Define and deploy inspection tool recipes BKM to ensure detection capability 5.Assist in Customer audits on inspection strategy deployment and execution 6.Perform baseline defect improvement

1.負責 eNVM IP開發 2.負責eNVM IP規格分析 3.負責加速及強化eNVM電路設計及模擬驗證 4.負責Design Kits 產生加速及自動化,強化品質驗證 5.負責Testchip 架構及電路設計,以驗證 eNVM IP 6.負責eNVM IP客戶支援

(1) 導入智慧製造技術-新技術調研與標竿學習-分析競爭者資料及市場解決方案 (2) 導入智慧製造技術-新技術導入-建立技術方案選用標準 (3) 導入智慧製造技術-培育智慧製造人員-規劃教育訓練 (4) 導入智慧製造技術-培養智慧製造人員-評鑑智慧製造人員 (5) 整合智慧製造專案- POC專案推動-提出&評估適切方案 (6) 整合智慧製造專案- POC專案推動-審查技術標準/規範 (7) 其他上級交辦事項

• SIMS/TEM sample preparation, SIMS/FIB/TEM operations. • Material analysis (EDX and EELS analysis) • 6S and ESH maintenance • Equipment maintenance and new technology development.

1.New Device Introduction: Perform tape-out/tooling operations for customer design database and achieve the goal of first pilot success. 2.Project coordination: Customer interface and cross department coordination with seamless communications. 3.Manage conference calls, meetings and customer visits with professional presentation skills and logistics arrangement for project success. 4.Project management: Documentation, summary, meeting minutes and ability to recap keynote of meetings for management team review.

1. 擬定課內目標、計劃及預算，執行業務日常管理並定期檢討執行結果。 2. 督導及審核產品管理系統之規劃、導入及運作。 3. 推動與整合產品管理相關標準化及精進專案。 4. 適時預防及處理課內作業的異常及分析課內業務提出改善方案。