轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=399&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Support Layout production and quality verification for advanced node 2. Advanced node path finding for best speed, power and area by using layout technique. 3. Methodology development for layout optimization, productivity and quality enhancement. 4. Machine Learning/AI exploratory for layout quality and productivity enhancement. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

高速類比SerDes電路全客製化佈局設計及自動化流程設計 Fully custom layout design for analog high-speed SerDes circuit and layout automation flow development.

職責要求 RTL Coding Required • Expert-level SystemVerilog / Verilog HDL for synthesizable RTL精通 SystemVerilog/Verilog HDL，能夠寫出可綜合的 RTL 程式碼 • Deep understanding of clocking, reset strategies, and clock domain crossing (CDC) 深入理解時脈、重設策略和時脈域交叉 (CDC) • Proficient in finite-state machine (FSM) design and pipeline microarchitecture精通有限狀態機 (FSM) 設計與管線微架構 • Low-power design techniques: clock gating, power gating, multi-Vt, retention flops低功耗設計技術：時脈門控、電源閘控、多閾值電壓 (Vt)、保持觸發器 • Experience coding to timing closure constraints and meeting PPA targets具備根據時序收斂限制進行編碼並達到 PPA 目標的經驗 Microarchitecture Required • Ability to own microarchitecture spec from concept to sign-off能夠獨立完成從概念到最終定稿的微架構規範 • Strong grasp of on-chip interconnects: AXI4, AHB-Lite, APB, TileLink, CHI/ACE精通片上互連：AXI4、AHB-Lite、APB、TileLink、CHI/ACE • Cache coherency, memory subsystem, and NoC design experience具備快取一致性、記憶體子系統和片上網路 (NoC) 設計經驗 • Skilled in defining and documenting microarchitecture specification documents能夠定義和編寫微架構規範文檔 • Ability to drive design partitioning and IP integration at SoC level能夠在 SoC 層級推動設計劃分和 IP 集成 Functional Verification Required • Familiarity with UVM / OVM testbench methodology熟悉 UVM/OVM 測試平台方法 • Ability to write self-checking RTL testbenches能夠撰寫自我檢測測試RTL 測試平台 • Coverage-driven verification planning and closure覆蓋率驅動的驗證規劃與收尾 • Experience with formal property verification (JasperGold, VCFormal) 具備形式化屬性驗證經驗（JasperGold、VCFormal） Design Sign-off Required • Static timing analysis (STA) review and ECO coordination靜態時序分析 (STA) 審查和工程變更協調 • CDC / RDC lint and equivalence checking (Conformal, Spyglass) CDC/RDC 程式碼檢查和等效性檢查（Conformal、Spyglass） • DFT-aware design: scan insertion, BIST, JTAG / boundary scan考慮可設計性的設計：掃描插入、BIST、JTAG/邊界掃描 • Familiarity with PD handoff flow and P&R feedback loops熟悉 PD 交接流程和佈局佈線回饋迴路 Technical Leadership Required • Lead a team of 4–10 RTL designers across one or more IP blocks領導一個由 4-10 位 RTL 設計師組成的團隊，負責一個或多個 IP 模組 • Define and enforce RTL coding guidelines and review standards制定並執行 RTL 編碼規範和審查標準 • Mentor mid-level and junior engineers; conduct technical career development指導中級及初級工程師；進行技術職涯發展規劃 • Drive design schedule, milestone tracking, and risk identification推動設計進度、里程碑追蹤和風險識別 • Interface with DV, DFT, PD, and software teams — own design integration與設計驗證 (DV)、測試驗證 (DFT)、產品開發 (PD) 和軟體團隊對接—負責設計集成 • Represent RTL design in architecture reviews and cross-functional meetings代表 RTL 設計參與架構評審與跨職能會議 任職資格 • B.Sc in Electrical / Electronic Engineering or Computer Engineering; M.Sc preferred • 3 or more successful ASIC tapeouts in a lead or senior contributor role • Excellent written and verbal communication — able to author clear micro-arch specs • Comfortable driving cross-team technical decisions under schedule pressure • Strong debugging mindset: able to root-cause simulation failures and silicon bugs

RTL coding - Required • Proficient in SystemVerilog and Verilog HDL for synthesizable RTL精通 SystemVerilog 和 Verilog HDL，能夠寫出可綜合的 RTL 程式碼 • Solid understanding of synchronous design, clocking, and reset strategies紮實的同步設計、時脈控制與重設策略知識 • Experience with clock domain crossing (CDC) techniques and metastability handling具備時脈域交叉 (CDC) 技術與亞穩態處理經驗 • FSM coding, pipelining, and retiming for timing closure熟悉有限狀態機 (FSM) 編碼、管線和時序重整化以實現時序收斂 • Familiarity with low-power techniques: clock gating, isolation cells, retention flops熟悉低功耗技術：時脈門控、隔離單元、保持觸發器 • Writing RTL that meets area, power, and performance (PPA) targets能夠編寫滿足面積、功耗和效能 (PPA) 目標的 RTL 程式碼 Microarchitecture - Required • Ability to implement designs from a microarchitecture specification能夠根據微架構規範實現設計 • Working knowledge of AMBA protocols: AXI4, AHB-Lite, APB熟悉 AMBA 協定：AXI4、AHB-Lite、APB • Understanding of data path design, FIFOs, arbiters, and flow control logic理解資料通路設計、FIFO、仲裁器和流控制邏輯 • Familiarity with SoC integration concepts: interrupts, address maps, register files熟悉 SoC 整合概念：中斷、位址對映、暫存器文件 • Experience writing or contributing to microarchitecture specification documents具備編寫或參與微架構規範編寫的經驗文檔 Functional verification Required • Experience writing directed and self-checking RTL testbenches in SystemVerilog具備使用 SystemVerilog 撰寫定向與自我檢測 RTL 測試平台的經驗 • Familiarity with UVM methodology; ability to develop UVM agents or sequences熟悉 UVM 方法論；能夠開發 UVM 代理或序列 • Able to interpret coverage reports and drive functional coverage closure能夠解讀覆蓋率報告並推動功能覆蓋率的收斂 • Experience using simulation tools (VCS, Questa) for debug and regression具備使用模擬工具（VCS、Questa）進行調試和回歸測試的經驗 • Exposure to formal property verification (assertions, assumptions, cover points) 熟悉形式化屬性驗證（斷言、假設、覆蓋點） Design sign-off - Required • Reading and interpreting STA reports; understanding setup/hold slack and critical paths能夠閱讀和解讀 STA 報告；理解建立/保持時間裕量和關鍵路徑 • Awareness of CDC and RDC lint checks; able to resolve common violations了解 CDC 和 RDC 代碼檢查；能夠解決常見違規問題 • DFT awareness: scan chain insertion, test mode design considerations了解 DFT：掃描鏈插入、測試模式設計注意事項 • Ability to work with PD feedback and make RTL changes to resolve place-and-route issues能夠根據 PD 回饋進行 RTL 修改，以解決佈局佈線問題

在系統級封裝（SiP）與 PCB 佈局的極早期階段，就將 EMC 對策融入設計中。您將與 IC 設計、封裝、軟韌體及功能安全（ISO 26262）團隊緊密合作，確保我們的產品能一次性通過全球最嚴苛的 Tier-1 與車廠認證標準。 關鍵工作內容 (Key Responsibilities) 1. 系統設計 (Board Co-Design for EMC)： • 設計與優化電源分配網路（PDN），制定去耦電容（Decoupling Capacitor）的佈局與選型策略，從源頭降低電磁輻射（EMI）與提升耐受性（EMS）。 2. 先進電磁模擬與預測 (Advanced EM Simulation)： • 在投片（Tape-out）與洗板（PCB fabrication）前，利用 3D 電磁模擬軟體（如 Ansys, CST）進行系統級的輻射與傳導雜訊模擬分析，提前發現並消除潛在的 EMC 風險。 3. 車規標準合規與驗證 (Automotive Standard Compliance)： • 確保產品符合全球車規 EMC 標準，包含 CISPR 25, ISO 11452, ISO 7637, ISO 16750 以及各大車廠（OEM）的客製化規範。 • 將系統級（System-level）的車規要求，向下拆解並定義為 IC 與 SiP 模組級（Component-level）的設計規格。 4. 實驗室除錯與跨部門技術指導 (Debugging & Cross-functional Leadership)： • 帶領團隊在無響室/電波暗室進行產品測試。當面臨 EMI/EMS 挑戰時，能迅速進行根因分析（Root Cause Analysis）。 • 提出軟硬體整合的解決方案（例如指導韌體團隊設定 Spread Spectrum Clocking, SSC 展頻技術，或調整硬體濾波器），並驗證其有效性。

1. Serdes PMA IP architecture planning 2. Serdes PMA IP RTL coding 3. Serdes PMA IP front-end and back-end integration 4. Co-work with PCS and MAC design team and DV team for IP verification 5. Co-work with Analog design team for PHY co-simulation 6. Co-work with Algorithm team for algorithm implementation and bit-true verification

1. 先進封裝BGA基板佈線與佈線實體驗證 2. 2.5D IC (CoWoS_S; CoWoS_L; CoWoS_R; EMIB) RDL 與基板佈線與佈線實體驗證 3. 與封裝設計工程師合作完成封裝設計需求與目標 4. 新封裝佈線方式評估與開發 5. 新封裝佈線輔助設計軟體評估

加入 MediaTek「先進製程平台 DFT」團隊，你的工作直接影響 N4/N3/N2 及更先進世代 Cloud ASIC 的可靠度與良率。 - DFT 架構與插入：針對先進節點 SoC 及 chiplet/3D-IC 設計，定義並實作 Scan（full-scan、compressor）、MBIST、BSD/JTAG 架構；使用 Synopsys / Siemens (Tessent) EDA 工具執行端到端插入流程。 - ATPG 與 Advanced Fault Model：開發並優化 stuck-at、transition delay、cell-aware、path-delay 等 fault model 的 ATPG pattern；驅動 fault coverage closure 並交付 DRC-clean pattern。 - 模擬與驗證：透過 gate-level simulation（VCS/Xcelium）驗證 DFT 邏輯正確性；解決 DFT rule violation 與 coverage gap，確保 tapeout 品質。 - 後矽驗證與測試：主導 CP / FT / HTOL / HVS 各階段 DFT 工作，包含 test mode 驗證、scan chain 連通性測試、MBIST 執行與 repair 確認。 - Volume Diagnosis 與 Yield Ramp：運用 scan/MBIST diagnosis 資料分離系統性缺陷，與製程及 FA 團隊協作加速 yield learning 與技術成熟。 - RMA / DPPM 除錯：利用 DFT diagnosis 流程調查 field return，協助降低 DPPM 並防止 escape。 - 產業前沿：持續追蹤 Cloud ASIC chiplet 測試趨勢、ATE 技術進展與 EDA 新功能，主動將新觀念帶入團隊。 職務要求

28nm及以下先進製程(含FinFET) IO電路和ESD防護設計, 工作內容包含 (1) GPIO電路設計(包含ESD/LU防護) (2) 特殊應用IO (SD3.0/SIM card/eMMC等)電路設計(包含ESD/L防護) (3) 高速IO和特殊應用IO在事業部專案上展開和執行 - Advance node (28nm and beyond, including FetFET) IO circuitry and ESD protection design covering fields for (a) General purpose IO circuit design (with ESD/LU protection) (b) Specialty IO (SD3.0/SIM card/eMMC etc.) circuit design (with ESD/LU protection) (c) Project related implementation for high speed/specialty IO Interface - High speed IO, specialty IO circuit design, ESD protection circuit design and simulation. Work with project leader, layout, packaging and system engineers to meet design and system specifications. Work with IO library modeling, characterization teams closely for IP release.