轉職熱搜工作

工作項目： 1. Responsible for ASIC Backend / Physical Implementation, including floorplan, power plan, physical synthesis, clock tree synthesis, routing, si, DFM, DRC/LVS in both hierarchical and low power designs. 2. Responsible for Physical Design flow research, development and automation. 應徵條件： 1. 大學以上電機資訊相關科系畢 2. 熟悉 IC 後段設計流程, 具相關 APR 經驗者佳. 3. 對於開發及推廣 Physical Design Flow 有興趣者. 4. 熟悉相關 tools(Astro, Encounter, IC Compiler)者尤佳 5. 具程式設計(TCL,Perl,C/C++)能力者佳。

工作項目： 1. FinFET製程記憶體設計開發。 2. 客製化記憶體設計開發。 3. 支援記憶體智財量產性能,良率提升。 應徵條件： 1. 碩士以上; 電機工程、電子工程相關科系畢業為主。 2. 熟悉 Hspice, Spectre, XA, Solido等 simulation tool, Virtuso, Laker等 layout tool. 3. 具3年以上下列經驗之一者為佳 (1) 熟知 CMOS元件與 SRAM/其他記憶元件特性。 (2) 熟稔並執行過 SRAM/CAM電路開發工作。 (3) 具 FinFET電路設計與佈局設計經驗。

主要負責半導體測試硬體研發，工作內容如下： 1. 類比半導體測試相關電路開發。 2. 負責類比放大器及 DC-DC 電源等電路設計，提供IC測試使用時精密量測電路 3. 精密 DAC/ADC 相關電路設計規劃。 4. SMU (Source Measure Unit ) 設計及測試驗証。訊號測試驗証

工作項目： 1. High-Performance CPU/GPU Timing & Power Integrity Signoff 2. High-Performance CPU/GPU Post-Silicon Validation & Debug, Sim-to-Silicon Correlation 3. 協同開發 CPU/GPU Advanced DFT, On-Chip PVT Sensor, Performance Improvement & Power Management 等先進技術 4. 支援產品 SoC Projects，協同執行 High-Performance CPU/GPU 專案開發，導入先進 IP 及技術 應徵條件： 1. 碩士以上；電機、資工、電子相關科系畢業為主。 2. 熟悉 SoC Integration & Design Flow、Frontend/Backend/DFT/Timing/IR Drop/Power Analysis EDA Tools。 3. 有 ARM Cortex-A CPU/Subsystem Design/Integration/PPA Optimization/Sign-off 經驗尤佳。 4. 有 Chip-Level, Package & PCB Power Integrity Optimization 經驗尤佳。 5. 有On-Chip PVT Sensor 開發經驗尤佳。 6. 有Post-Silicon Validation, Debug 及 RMA 分析經驗尤佳。 7. 積極負責、溝通協調能力強、勇於迎接挑戰，對於 High-Performance CPU/GPU Technology 有興趣者。

【公司介紹】 喬訊科技股份有限公司專注於高頻高速、高電流連接器產品之研發、製造與全球市場開發，產品應用涵蓋 AI Server、資料中心、工業自動化、電動車、機器人、通訊設備與高階電子設備等領域。公司初期將建立核心研發團隊，從產品設計、機構開發、材料選用、模具導入、樣品驗證到量產轉移，打造具國際競爭力的連接器產品線。 喬訊科技的目標，不只是成為一家連接器公司。我們希望建立具全球競爭力的高速傳輸與高功率互連技術平台，服務 AI、資料中心、工業自動化、機器人及新能源產業。 未來五年，我們將以台灣研發中心為核心，逐步建立中國製造基地、美國市場據點及新加坡區域營運中心。如果您期待的不只是工作，而是參與一家企業從 0 到 1、從台灣走向世界的成長歷程，我們誠摯邀請您加入。 本職位為喬訊科技創業初期核心職位，將直接參與公司產品策略、市場布局及全球營運體系建立。優秀人才未來將有機會晉升核心幹部並參與公司長期激勵與持股計畫。 我們不是在找員工，而是在尋找未來一起打造國際級連接器品牌的創業夥伴。 【工作內容】 1. 負責高頻高速、高電流連接器產品之機構設計與開發。 2. 依據客戶需求、應用場景與產品規格，進行連接器結構設計、材料選用與製程評估。 3. 使用 3D CAD 軟體進行產品建模、2D 工程圖、公差分析與設計文件建立。 4. 參與新產品開發流程，包括概念設計、樣品製作、測試驗證、設計修正與量產導入。 5. 與模具、沖壓、射出、電鍍、組裝、品保及供應鏈團隊協作，確保產品可製造性與品質穩定性。 6. 協助執行 DFMEA、設計審查、可靠度測試、失效分析與工程變更。 7. 支援業務與 FAE 團隊進行客戶技術溝通、規格確認及客製化設計。 8. 協助建立公司連接器產品標準、設計規範、測試規範與技術資料庫。 9. 針對高頻高速產品，協助 SI 工程師進行阻抗、串擾、插入損耗、回波損耗等設計優化。 10. 參與專利佈局與新技術平台開發。 11. 需配合供應商、製造基地或客戶端出差。 【薪資待遇】 依能力與資歷面議。具連接器產業資深經驗者另議。 除固定薪資外，公司提供： ■ 年度績效獎金 ■ 專案獎金 ■ 新產品開發獎勵 ■ Design Win 獎勵 ■ 業績達成獎勵 ■ 年度盈餘分紅制度 ■ 關鍵人才長期激勵計畫 ■ 未來員工持股計畫（ESOP） 依個人及團隊績效表現核發。 【教育訓練與人才培育】 公司重視人才培養與長期發展，提供： ■ 新人培訓計畫 ■ 專業技術訓練 ■ 專案管理訓練 ■ 領導管理課程 ■ 海外市場實戰培養計畫 優秀人才將有機會參與美洲、歐洲、新加坡、東南亞及大中華區市場開發專案。

工作項目： 1. CPU & GPU Backend Implementation (APR) 2. CPU/GPU Backend Flow Development, Enhancement & Automation 3. Advanced CPU/GPU Technology Development: High-performance, Low Power, and PPA Optimization 應徵條件： 1. 碩士以上；電機、資工、電子相關科系畢業為主。 2. 熟悉 APR Tools (Innovus、ICC2、Fusion Compiler…)，有Synthesis、STA/IR Analysis、Physical Verification等相關經驗者佳。 3. 具備程式設計能力，熟悉 TCL/Perl/C++/Python。 4. 有 High Performance CPU/GPU APR經驗尤佳。 5. 個性積極負責、勇於迎接新挑戰，對於 High-Performance CPU/GPU Technology 有興趣者。

We are seeking a highly skilled and motivated Field Application Engineer to provide advanced customer engineering support across our key semiconductor customers. This role will act as a critical technical interface between customers and our internal teams, focusing on problem solving, project execution, and proactive alignment with customer requirements and technology roadmaps. The successful candidate will play a hands-on role in delivering world-class technical support, ensuring rapid issue resolution, and strengthening long-term customer relationships. Key Responsibilities: 1. Advanced Technical Support · Provide expert-level advice on hardware requirements to enable successful loadboard/module design projects. · Conduct schematic capture, component placement, and routing support when needed to address complex technical challenges. · Act as a senior technical resource for diagnosing hardware-related feasibility and performance issues. 2. Customer Engagement & Relationship Building · Gather and validate customer requirements to ensure sufficient information for initiating design projects. · Serve as the primary technical contact, managing expectations and maintaining clear communication with customer engineering teams. · Manage customer interactions throughout the project lifecycle to ensure satisfaction and successful delivery. 3. Application Engineering & Solution Development · Assess and estimate project schedule, cost, and feasibility to define realistic plans. · Support design-in activities by translating customer requirements into technical hardware solutions. · Deliver technical updates, training, and presentations to customers and internal stakeholders. 4. Cross-Functional Collaboration · Collaborate with internal design and project management teams to align project execution with customer requirements. · Provide structured feedback from design projects to influence product development and continuous improvement. · Ensure alignment of project execution with both tactical problem solving and longer-term strategic direction. Preferred Traits: · Resilient and Professional Under Pressure – Remains calm and constructive when facing challenges, escalations, or changing requirements. · Proactive Problem Solver with Strong Ownership – Takes initiative, drives resolution, and ensures customer satisfaction while balancing immediate issue-solving with long-term improvements. · Collaborative and Organized Team Player – Demonstrates a positive “can-do” attitude, manages multiple priorities effectively, and works seamlessly with cross-functional and global teams. This job description serves as a general guide to the responsibilities and qualifications expected for the role and may be subject to modification based on the specific needs of the organization.

Job function: 1. Work with Digital Design team for Physical Design of SoC chips including top level floor planning, block partition, timing budgeting, power planning, block integration, whole chip timing closure, and tape out. 2. Responsible for physical design methodology research and development. 3. Cross site projects coordination and management. Requirement: 1. MS with 5+ years of experience in Physical Design. 2. Familiar with Unix/Linux environment and scripts. 3. Familiar with ASIC design flow. 4. Familiar with Physical Design EDA tools. 5. Good communication and team working skills. 6. Experience in handling large scale SoC chip implementation is a plus.

DIS Tech’s Project Management team designs custom hardware connecting DUTs to ATE testers (e.g., Teradyne, Advantest). We’re hiring a Project Manager to lead interface projects from concept to delivery. This customer-facing role involves translating requirements into test hardware while managing timelines, resources, and scope. Ideal candidates are engineers ready to grow into leadership, with strong communication, spatial reasoning, attention to detail, and urgency. Mentorship and hands-on training provided. Key Responsibilities: • As a Project Manager, you will be responsible for leading, executing and managing all the engineering activities of the new product design and development project with a high degree of independence and creativity. • Work closely with customers (both internal and external) to gather requirements and acceptance criteria. • Perform project sizing (scope, cost, schedule). • Create statement of work to align clearly with customer about scope, deliverables, schedule, acceptance criteria, risks and mitigation plan. • Create, track and manage detailed project plans and keep customers informed of project status. • Track, assess and communicate impact of changes (change management). • Drive PCB schematic and layout design, working with internal PCB design team. • Drive SI/PI performance optimization, working with internal simulation team. • Manage design reviews and milestone approvals. • Understand our supplier’s DFM rules/requirements/capabilities, and guide design accordingly. • Define PCB materials, stack-up, layout rules. • Work with operations team to ensure project manufacture/assembly/logistics are on-track, lead to resolve any schedule slipping by working out improvement plan • Provide continuous technical support for products already in the field. • Visit or travel to DIS Tech and customer sites as required. • Attend periodic night-time meetings with customers or teams in other regions (EU, US oversea customer when needed).

熟悉 layout tool : Virtuoso/CustomCompiler verification : Hercules/calibre/ICV 『具工作經驗者，薪資另議』