轉職熱搜工作

在系統級封裝（SiP）與 PCB 佈局的極早期階段，就將 EMC 對策融入設計中。您將與 IC 設計、封裝、軟韌體及功能安全（ISO 26262）團隊緊密合作，確保我們的產品能一次性通過全球最嚴苛的 Tier-1 與車廠認證標準。 關鍵工作內容 (Key Responsibilities) 1. 系統設計 (Board Co-Design for EMC)： • 設計與優化電源分配網路（PDN），制定去耦電容（Decoupling Capacitor）的佈局與選型策略，從源頭降低電磁輻射（EMI）與提升耐受性（EMS）。 2. 先進電磁模擬與預測 (Advanced EM Simulation)： • 在投片（Tape-out）與洗板（PCB fabrication）前，利用 3D 電磁模擬軟體（如 Ansys, CST）進行系統級的輻射與傳導雜訊模擬分析，提前發現並消除潛在的 EMC 風險。 3. 車規標準合規與驗證 (Automotive Standard Compliance)： • 確保產品符合全球車規 EMC 標準，包含 CISPR 25, ISO 11452, ISO 7637, ISO 16750 以及各大車廠（OEM）的客製化規範。 • 將系統級（System-level）的車規要求，向下拆解並定義為 IC 與 SiP 模組級（Component-level）的設計規格。 4. 實驗室除錯與跨部門技術指導 (Debugging & Cross-functional Leadership)： • 帶領團隊在無響室/電波暗室進行產品測試。當面臨 EMI/EMS 挑戰時，能迅速進行根因分析（Root Cause Analysis）。 • 提出軟硬體整合的解決方案（例如指導韌體團隊設定 Spread Spectrum Clocking, SSC 展頻技術，或調整硬體濾波器），並驗證其有效性。

我們正在尋找充滿熱情的產品安全工程師或研究員 (Offensive Security)，加入我們的團隊，共同鞏固我們的產品安全。這個職位將為您提供豐富的學習和成長機會，讓您在快速發展的資安領域中脫穎而出。 [工作內容] 1. 安全威脅建模: 對系統安全進行威脅建模，提出安全設計改善建議，並完善安全設計規範。 2. 漏洞分析測試: 對軟體安全進行漏洞分析、安全代碼審查，以及進行模糊/滲透測試。 3. 滲透測試開發: 發展用於漏洞發現的滲透測試方法、腳本或測試工具。 4. 前沿攻擊研究: 研究最先進的攻擊/駭客方法及趨勢，以精進各項安全測試工具及手法。 實際工作內容和範圍將根據所參與的任務而定。 [工作地點] 台北/新竹 [學習成長機會] 1. 技術多樣性: 有機會學習和接觸各式各樣的產品核心技術，擴展您的技術知識面。 2. 實戰的經驗: 與世界一流的資安研究人員合作進行安全性審查，獲得寶貴的實戰經驗。 3. 國際的視野: 參與國際資安會議，了解最新的安全趨勢和技術，提升您的專業知識。 4. 跨領域合作: 與不同技術領域的專家合作，提升您的跨領域協作能力。 加入我們，您將有機會在一個充滿挑戰和機遇的環境中成長，並為全球的產品安全做出貢獻。如果您對資安充滿熱情，並希望在這個領域中不斷進步，我們誠摯邀請您加入我們的團隊!

About the Role: Bring your GPU driver expertise and work closely with our Architecture and Micro-architecture teams. In this role, you will contribute across the GPU software stack and help extract maximum performance from the silicon while supporting the development of our next-generation GPU designs. This is not a siloed driver role. You will have opportunities to work across industry-standard graphics and compute APIs, kernel-mode drivers, GPU firmware, performance optimization, and hardware/software integration. What You‘ll Do — The Full Stack: • API Layer: Develop, debug, and optimize features for industry-standard APIs including Vulkan, DirectX, OpenGL ES, and OpenCL. • Kernel & Firmware: Work on kernel-mode drivers and GPU firmware to improve hardware control, stability, scheduling, memory management, and execution efficiency. • Performance: Analyze and optimize bottlenecks across the stack, including driver overhead, memory bandwidth, GPU scheduling, compute throughput, and power/performance tradeoffs. • Cross-Team Collaboration: Work closely with Architecture, Micro-architecture, Compiler, and GPU Model teams to validate GPU behavior, debug complex issues, and improve software/hardware interaction. • System-Level Debugging: Investigate issues across user-mode drivers, kernel-mode drivers, firmware, and hardware models to improve stability, correctness, and performance. Why This Role? • No Silos: You are not restricted to only one layer of the stack. You will have the opportunity to work across APIs, drivers, firmware, and performance. • Hardware-Software Impact: Your work will help the software stack fully utilize GPU hardware capabilities. • Next-Gen GPU Exposure: You will collaborate with architecture, compiler, and modeling teams on technologies that shape future GPU products. Ready to work across the entire GPU stack? Apply today.

• 主導 6G 頻譜接取（spectrum access）、初始接取（initial access）、能源效率（energy efficiency）或 MIMO 等技術的開發與 3GPP 標準化，推動功能從概念落實至正式核定的規格。 • 在 3GPP 及其他標準組織中撰寫並推動技術提案（contributions），並凝聚共識以促成其採納。 • 爭取並擔任 3GPP 關鍵領導職位——包含 feature lead 與 rapporteur——並代表公司策略性競選。 • 跨 3GPP 各工作組（working groups），以及在標準化團隊與產品實現團隊之間進行協作，確保技術可行性與設計一致性。 • 指導資淺工程師熟悉標準化流程與技術開發。

Do you want to be part of a smart and passionate team of researchers, advancing artificial intelligence to the next level of end-user experience in their daily lives? MediaTek Research Taiwan is seeking driven and brilliant young students to join our efforts by providing Internship placements. We are currently working on Natural Language Processing, AI for Chip Design and more! We hope you can join us as we embark on the a journey from research to product! The ideal candidate is open-minded, passionate about realizing AI in practical use cases, and looks forward to cutting-edge challenging problems. • You have experience on Frontend/Backend/Full-Stack Web programming • You have basic understanding of the foundations and engineering aspects of AI, hands on experience with machine Learning frameworks (PyTorch, Tensorflow, JAX) is a plus. • You are a proficient scientific communicator. You are committed to your goals and working in a team. • You are eager to tackle real-world applications with state of the art methodologies. We want your ideas to shine! As an Engineering Intern in our team, you will collaborate with our researchers and worldwide colleagues and develop applications and algorithms that make a real difference in everyday devices. Your developments would significantly enhance the experience of numerous end users across our product range.

We are looking for AI hardware architect/designer to join our team and play a pivotal role in designing, developing, and optimizing architecture of the neural processing unit (NPU). As an architect/designer, you will be responsible for creating innovative hardware and software solutions that meet the performance, scalability, and efficiency requirements of our advanced NPU environment. The ideal candidate will have a strong background in computer architecture, microarchitecture, and digital design, as well as experience with industry-standard tools and methodologies. You are expected to transform novel ideas into practical proposals for future NPU products, and vet the proposals via prototyping. Extensive knowledge in compiler and operating system is a plus. International travel may be required.

車用無線通訊軟體開發，包含： 1. 802.11 無線網路驅動程式與韌體開發 2. Android/Linux 嵌入式系統驅動軟件開發整合 3. WLAN/Wi-Fi通訊系統協定軟件設計及開發 4. 內部跨單位與車用平台單位及世界級車廠合作開發至產品量產

1) 負責設計與定義先進4G、5G及6G通訊系統內數據擷取控制系統架構，以作到系統行為分析、系統效能優化，以及問題解決。 2) 開發、優化並維護數據擷取控制系統的底層驅動程式與軟體控制流程。 3) 研究並導入以AI為基礎的自動化工具，以強化問題診斷、異常偵測與數據分析能力。