轉職熱搜工作

1. Baseband Hardware Design & Schematic Capture Design and own baseband circuits, including schematic capture, component selection, BOM maintenance, and multi-layer PCB stack-up definition. 2. PCB Layout Review & Design Guidance Guide layout engineers and perform detailed layout reviews to meet high-speed signal integrity (SI), power delivery network (PDN), and impedance control requirements. 3. Power Consumption & PDN Performance Tuning Conduct power domain analysis, power rail ripple measurement, and PDN/LDO optimization to improve overall system power consumption and stability. 4. System Integration, Board Bring-up & Debugging Execute board bring-up, baseband signal verification, and system-level performance testing; perform root-cause analysis for hardware bugs and drive technical issues to resolution. 5. Certification & Manufacturing Support Assist with regulatory/compliance certifications (e.g., FCC/CE) and support NPI (New Product Introduction) and mass production line issues.

- 經理級 1. 負責新型運算裝置的機構概念發想、堆疊設計 (Architecture Stacking) 與可行性評估 2. 針對創新機構件、新材料應用或獨特作動機構進行專利佈局與技術攻關 3. 整機解決方案: 協同解決光機模組、感測器或新型顯示技術的機構空間布置與光路干涉問題，並能協助高效能散熱空間評估，提供可靠的結構設計方案 4. 從結構設計端出發，引進新材料、新工藝（如 CNC、模內射出、複合材料、3D 列印） 5. 供應商技術團隊深度對接，確保創新設計具備量產可行性與成本競爭力 6. 主導 Demo 樣品的零件發驗、整機組裝、功能調試，並針對功能缺陷快速迭代 - 副理級 1. 負責新型運算裝置的機構堆疊設計 (Architecture Stacking) 與可行性評估 2. 針對創新機構件、新材料應用或獨特作動機構進行專利佈局與技術攻關 3. 整機解決方案協同開發，提供可靠的結構固定與防護方案 4. 從結構設計端出發，引進新材料、新工藝（如 CNC、模內射出、複合材料、3D 列印） 5. 供應商技術團隊深度對接，確保創新設計具備量產可行性與成本競爭力 6. 協助 Demo 樣品的零件發驗、整機組裝、功能調試

1.Familiarity with VHDL/Verilog coding and FPGA/CPLD design flow is a must 2.Familiarity with FPGA/CPLD design in server application and bus protocols including I2C / power sequence / SPI / LPC / SGPIO / I2C switch/ UART / PWM / eSPI 3.Familiarity with Lattice/Altera EDA design tool. 4.Strong HW and x86 architecture knowledge. 5.Integration and simulation experience 6.Issue Fail symptom Anlayze and Tracker ※依學經歷、工作年資敘薪

1.擬定及執行產品測試作業。 2.督導執行測試記錄與測試報告之完成。 3.規劃執行測試設備配置。 4.開發引進新測試技術。 5.改善測試設備。 6.測試技術傳承&教導。 ※依學經歷、工作年資敘薪

1.擬定及執行產品測試作業。 2.督導執行測試記錄與測試報告之完成。 3.規劃執行測試設備配置。 4.開發引進新測試技術。 5.改善測試設備。 6.測試技術傳承&教導。 ※依學經歷、工作年資敘薪

1.Baseband Circuit Design & Schematic/PCB Layout Review 2.HW Bring-up & System Debug 3.Power Consumption & Performance Optimization 4.System Integration / Certification / Validation 5.Factory Production Support & Failure Analysis (FA /Root casue)

1. 專案硬體相關設計 2. 硬體設計問題分析與解決能力 3. 與支援工廠,測試單位試產相關問題解決 4. 跨部門溝通協調.廠商端的問題澄清與溝通 ※依學經歷、工作年資敘薪

1、IoT／網通產品WiFi Router、Network Device 硬體架構規劃與電路設計開發 2、MCU電路設計與整合 3、WiFi／Ethernet 電路設計與高速訊號規劃 4、BLE與無線通訊介面設計 5、PCB設計與Layout協作電路佈線與驗證 6、EMI / EMC / RF 測試與問題分析改善 7、樣品驗證與量產導入

1. LCM/TP/Camera/PL sensor/PPG Design and Design Issue Debugging 2. Optical Design Review with Customers and Venders 3. Projects Schedule Managements for Optical Function 4. Optical Module PCBA/FPC Schematic and layout Design Review 5. LCM/TP/Camera Electrical Performance Validations 6. Defining Optical Part Incoming Inspection Criterion 7. Optical Module Assembly Troubleshooting in Factory Side 8. Optical parts roadmap planning and innovation 9. Team members coaching and technical document organization

1. BMS產品的電子設計經驗 2.熟電子產品生產流程 3.具不良產品之分析能力 4.具電池或電源設計者佳 5.主管交辦事項