轉職熱搜工作

《工作內容》 負責無人機通訊模組系統軟韌體開發，涵蓋跨模組共通性介面設計、嵌入式系統及周邊驅動程式開發、硬體和軟體的整合與排程優化、通訊戶外場域驗證，打造自主無人機遠距圖傳通訊開發平台，應用於救災、國防與巡檢等關鍵群飛任務。 《職務亮點/優勢》 1. 通訊技術於無人機實際飛行測試，跨 PHY／MAC／系統層與 RF、FPGA、韌體與通訊演算法團隊深度合作。 2. 研發成果應用於救災、巡檢等無人機群飛任務，並實際與戶外進行OTA測試。

1. General tasks of EE engineers 2. In-depth research and optimization of Optical and SerDes systems 3. Advanced artificial intelligence research and automated test development 4. Optical transceiver design and verification 5. SI (signal integrity) and PI (power integrity) simulation 6. Able to cooperate with business trips abroad and participation in exhibitions

想要在電線電纜產業中留下自己的足跡嗎 ？ 宏展電線電纜致力於以最專業的知識、最熱情的服務，為全球市場提供高品質產品。我們以30年的深厚經驗作為基石，融合了創新技術，產品涵蓋電線電纜的研發、製造與創新。這裡不僅有專業的團隊，還有多元化的發展機會，讓您在這個快速發展的行業中開創屬於自己的未來💡🌟！ 我們期待您成為團隊一員，主要職責包括： 1.塑料產品規劃與功能驗證 2.產品導入工廠與客戶端溝通使用需求 3.電纜生產技術與產品設計 加入宏展，您不僅會擁有專業的舞台，還享有以下福利亮點💼💖： - 優厚的福利待遇：三節獎金、全勤獎金、年終獎金、伙食津貼等，讓努力的您備感尊重 - 多元休假選擇：育嬰假、家庭照顧假及產檢假…滿足您的每個生活階段需求 - 活力滿滿的工作環境：尾牙、員工聚餐、自強活動…工作+生活，一樣燦爛 - 成長無限的學習平台：提供專業培訓與清晰的升遷規劃，支持每一步成長 - 人性化企業關懷：假日安心休息，勞健保由公司包辦，更有鬆弛的下午茶時光🍵 💌 快來加入我們這個友善、專業又充滿挑戰的團隊，一起為未來鋪上更輝煌的電纜之路吧！

工作項目： 1.協助Power/AFE IP功能與規格驗證，確保設計品質 2.協助工程師FT產線開發平台與測試板更換事宜(需進無塵室) 3.協助工程師討論並定義工程規格，參與產品規格制定流程 4.協助部門儀器校驗 5.具備焊接能力，能獨立更換IC 應徵條件: 1.大學以上學歷電機、電子、通訊、資訊等相關科系畢業 2.熟悉電力電子、電源轉換器設計/ AFE(ADC, DAC, PLL)相關知識與驗證者為佳 3.可接受無塵室工作者為佳 4.會焊接IC和PCB Layout者為佳 5.具C#或其它程式語言撰寫能力者為佳

※具市場競爭力的薪資制度，提供保障年薪 13 個月 ※外商的優渥福利制度 ※優於勞基法的特別休假與彈性休假 ※各式福委會補助與活動 【工作內容】 1. 操作 Teradyne UltraFLEX / UltraFLEX Plus / J750 等自動化測試平台，執行 PCB 電性測試、驗證與故障分析 (Debug / Diagnostics)。 2. 進行機台設定、測試程式下載、配置變更及設備保養維護，確保測試系統穩定運作。 3. 依據測試流程及規範，執行成品與半成品檢驗，記錄測試數據與異常結果。 4. 針對異常樣品進行分析、撰寫異常報告 (Failure Report)，並協助工程師改善良率。 5. 支援新產品導入 (NPI) 測試驗證與量產轉換 (Mass Production Ramp-up)。 6. 配合生產進度，確保測試作業按時完成，維持設備稼動率與品質穩定性。 ＊此職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班＊

職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班。 1. 負責 Probe Card 飛針測試包含開發、驗證與量產前測試 2. 撰寫與維護 飛針測試程式 3. 進行 電性量測（Continuity / Short / Open / Resistance / Leakage 等） 與測試結果分析 4. 協助 Probe Card 組裝後電性驗證、良率分析與問題排除 5. 與 製程、設計、製造、客戶端工程師 溝通測試需求與規格 6. 分析測試異常，提出 改善方案與測試流程優化建議 7. 建立與維護 測試規範、SOP、FA 報告與技術文件

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

Role Summary/Purpose Experienced hardware designer will closely work with worldwide engineers to perform engineering works for hardware testing solutions of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting-edge requirements and future technology, work here can be interesting and exciting. Job Description • Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers • Collect and analyze customer input, make sure it is complete and feasible • Provide constructive suggestions of interface hardware solutions to customers to close electrical/mechanical gaps, ensure smooth execution of customer project • Evaluate and provide project sizing including schedule, cost, resource, feasibility • Hands on critical part of high complexity project such as high-speed signal topology, RF signal, high current signal, signal integrity, mechanical consideration, design for manufacturability and design for assembly • Project execution/management including resource/task assignment, collaboration, daily mentor, schedule management, risk mitigation, quality control • Act as cross team interface between customer, manufacture and assembly supplier to ensure well project execution through close communication • Execute assigned technical roadmap research and development • Support team development through mentoring, knowledge sharing and training • Deliver hardware design training and seminars to customers • Keep close communication with worldwide Teradyne teams and customers

1.PCB Layout design全任務 : 負責完整PCB Layout設計流程，包含Pre-Layout、Placement、Routing、Split/Mix Plane、DRC及Gerber Out等。 2.PCB Layout modify : 執行PCB Layout修改與優化，整合機電設計需求，並符合EMC相關規範。 3.PCB Manufacture matter : 涵蓋設計、製造與組裝階段之工程問題回覆與解決，並具備良好跨部門溝通與協調能力。 4.PCB Layout evaluation : 負責可行性評估（含尺寸規劃），並執行外包專案管理及與板廠進行技術Q&A討論。 5.負責專案報告撰寫、文件審核與輸出，以及Layout相關新零件建立與整合工作。 6.帶領團隊運作，進行人員管理、指導與培訓，促進團隊整體能力提升。 7.熟悉Allegro、PADS等PCB Layout相關軟體操作。 8.負責零件資料庫建立及維護，確保資料完整性與一致性。 9.具備BGA/CSP及HDI多層板結構設計經驗。 10.其他主管交辦事項。

1.電路板開發、 產品電路設計、產品測試除錯，軔體編輯 2.樣品製作實驗、樣品承認、建BOM 3.據產品設計人員進行PCB Layout 4.進行PCB佈局和 layout工作 5.協助硬體工程師完成PCB板及軔體調試 6.開發案文件管理 7.管理儀器與設備. 8.工程樣本製作