轉職熱搜工作

1. NB placement 2.領導工程師Notebook 機構零件設計與整機組裝設計（A/B/C/D Cover, Hinge, Bracket 等） 3.模具開發與量產異常分析（Injection, Die-casting, Stamping, CNC） 4.結構強度與可製造性評估（DFM / DFA / DOE / CAE 分析） 5.與跨部門（ID, EE, DQA, MFG）協作進行設計驗證與問題解決

【AITE】(Automation Infrastructure and Tools Engineering) team: provide automation & tools solution to support server design, validation and MFG production. (1) BMC/BIOS/HW/performance test tools and automation (2) MFG L6/L10/L11 etc. test solution (3) Automation test platform development 工作內容: 1.負責伺服器診斷軟體與自動化測試工具開發，支援 Design Validation（DV）與 Manufacturing（MFG）需求。 2. 開發與維護 X86 Server 平台診斷工具、自動化測試程式與 Validation Framework。 3. 設計與實作 Diagnostic Features、Test Scripts 與 Validation Utilities。 4. 執行系統除錯（Debugging）、問題分析（Troubleshooting）與 Root Cause Investigation。 5. 分析 Server 平台相關問題，包括 CPU、DIMM、NIC、GPU、Switch、Storage、NVMe 等系統模組。 6. 持續優化自動化測試效率、軟體品質與開發流程。 7. 帶領小型開發團隊，掌握專案時程、交付品質與問題收斂。 8. 與硬體、韌體、Validation、Manufacturing 團隊跨部門合作，快速定位與解決問題。 9. 支援量產環境之問題分析、測試改善與軟體優化。 ※依學經歷、工作年資敘薪 Job Description: 1. Develop server diagnostic software and automation tools to support Design Validation (DV) and Manufacturing (MFG) environments. 2. Develop and maintain diagnostic tools, automation test programs, and validation frameworks for X86 server platforms. 3. Design and implement diagnostic features, test scripts, and validation utilities. 4. Perform system debugging, troubleshooting, and root cause investigation. 5. Analyze server platform issues related to CPU, DIMM, NIC, GPU, Switch, Storage, NVMe, and related subsystems. 6. Continuously improve automation efficiency, software quality, and development productivity. 7. Lead small development teams and manage project execution, delivery quality, and issue closure. 8. Collaborate with hardware, firmware, validation, and manufacturing teams to resolve technical issues efficiently. 9. Support production issue analysis, test optimization, and software enhancement.

【AITE】(Automation Infrastructure and Tools Engineering) team: provide automation & tools solution to support server design, validation and MFG production. (1) BMC/BIOS/HW/performance test tools and automation (2) MFG L6/L10/L11 etc. test solution (3) Automation test platform development 工作內容: 1.負責伺服器診斷平台於設計驗證（Design Validation, DV）與量產製造（Manufacturing, MFG）階段之整體架構規劃與設計。 2.建立並制定 Diagnostic Platform、Validation Framework、Automation Infrastructure 與測試流程標準。 3.規劃並整合 X86 Server 系統相關診斷方案，涵蓋 CPU、DIMM、NIC、GPU、Switch、PDU、Storage、NVMe 與相關子系統。 4.主導系統架構演進、技術決策與平台最佳化，提升系統可擴展性（Scalability）、可維護性（Maintainability）與穩定性（Reliability）。 5.建立跨 Design Validation 與 Manufacturing 共用之診斷框架與平台架構。 6.與硬體、韌體、軟體、Validation、Manufacturing 及全球研發團隊跨部門合作，制定技術策略與開發標準。 7.提供全球開發團隊技術方向與架構指導，推動跨區域（Cross-Geo / Cross-Site）技術合作與最佳實務建立。 8.評估新技術與新平台需求，制定未來 Server Diagnostic Platform 技術藍圖（Technical Roadmap）。 9.帶領開發團隊落實架構設計，協助解決高複雜度系統問題與平台整合議題。 ※依學經歷、工作年資敘薪 Job Description: 1. Lead architecture planning and design of server diagnostic platforms across Design Validation (DV) and Manufacturing (MFG) environments. 2. Define and establish diagnostic platforms, validation frameworks, automation infrastructure, and testing standards. 3. Architect and integrate diagnostic solutions for X86 server systems, including CPU, DIMM, NIC, GPU, Switch, PDU, Storage, NVMe, and related subsystems. 4. Drive platform evolution, technical decision-making, and system optimization to improve scalability, maintainability, and reliability. 5. Establish unified diagnostic frameworks and shared platform architecture across validation and manufacturing environments. 6. Collaborate cross-functionally with hardware, firmware, software, validation, manufacturing, and global engineering teams to define technical strategies and development standards. 7. Provide technical leadership and architectural guidance to global development teams while promoting cross-geo technical collaboration and best practices. 8. Evaluate new technologies and define future technical roadmaps for server diagnostic platforms. 9. Lead development teams in implementing architecture designs and resolving complex system-level technical issues.

Role Summary/Purpose Experienced hardware designer will closely work with worldwide engineers to perform engineering works for hardware testing solutions of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting-edge requirements and future technology, work here can be interesting and exciting. Job Description • Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers • Collect and analyze customer input, make sure it is complete and feasible • Provide constructive suggestions of interface hardware solutions to customers to close electrical/mechanical gaps, ensure smooth execution of customer project • Evaluate and provide project sizing including schedule, cost, resource, feasibility • Hands on critical part of high complexity project such as high-speed signal topology, RF signal, high current signal, signal integrity, mechanical consideration, design for manufacturability and design for assembly • Project execution/management including resource/task assignment, collaboration, daily mentor, schedule management, risk mitigation, quality control • Act as cross team interface between customer, manufacture and assembly supplier to ensure well project execution through close communication • Execute assigned technical roadmap research and development • Support team development through mentoring, knowledge sharing and training • Deliver hardware design training and seminars to customers • Keep close communication with worldwide Teradyne teams and customers

1、蒐集分析相關產品及零組件資訊 2、類比或數位線路功能開發及設計除錯 3、產品維護和客戶應用問題解決 4、自動測試設備的設計/實作/數據分析 5、FPGA、MCU韌體設計及軟體功能驗證、整合測試

1.執行1.5KW~7.5KW永磁同步馬達（PMSM）及無刷直流馬達（BLDC）的驅動硬體開發，包含功率電子、電源管理、驅動電路設計。 2.熟悉DC-DC、AC-DC電路設計，包括逆變器、功率開關（如 MOSFET、IGBT）的選型與應用確保系統效率與穩定性。 3.熟悉 霍爾感測器、編碼器、電流檢測、溫度監測等感測電路 設計 4.具有電磁干擾分析(EMI)及電磁相容性(EMC)設計與測試經驗 5.跨部門溝通與協作-與企劃、研發及生產團隊緊密合作，進行產品設計、驗證與量產導入 6.會使用 Altium Designer 尤佳 ✔學歷與經驗： ①電機工程、自動化控制、電子工程或相關領域本科以上學歷，碩士以上尤佳 ②3年以上馬達驅動器或電機控制系統開發經驗 ✔分析與測試能力： ①熟練使用示波器、功率分析儀等測試工具進行調試與性能驗證 ②具備故障排除和系統穩定性測試的經驗 ③撰寫設計驗證報告及可靠度測試計畫 ✔加分條件： ①具備高速電機（如無人機電機、伺服電機）控制經驗者優先考慮 ②熟悉功能安全標準（如 IEC 61508、IEC62061）者尤佳

1.負責 BOM準備與維護。 2.進行電路圖繪製及 PCB Layout 審查。 3.進行 硬體除錯及訊號測試與分析。 4.與跨部門團隊合作，確保專案順利執行。 ※依學經歷、工作年資敘薪

1. LCM/TP/Camera/PL sensor/PPG Design and Design Issue Debugging 2. Optical Design Review with Customers and Venders 3. Projects Schedule Managements for Optical Function 4. Optical Module PCBA/FPC Schematic and layout Design Review 5. LCM/TP/Camera Electrical Performance Validations 6. Defining Optical Part Incoming Inspection Criterion 7. Optical Module Assembly Troubleshooting in Factory Side 8. Optical parts roadmap planning and innovation 9. Team members coaching and technical document organization

1. 帶領研發團隊人員共同達成專案目標 2. NB主機板之電路設計、掌控線路及layout 3. 廠商、產品特性瞭解及其應用判斷 4. 客戶對應、供應商及工廠溝通協調