轉職熱搜工作

1. Smartphone新產品導入階段硬體研發和測試驗證 2. OLED顯示器光學設計及電路驗證和試產 3. Touch sensor電路設計、驗證和試產 4. 負責Display/Touch失效分析與技術驗證 5. 具備英文溝通能力以與客戶技術研討 6. 配合出差海外協助客戶設計開發與測試驗證

1. Performing reliability testing including Mechanical, Environmental, IPX and chemistry tests...etc. 2. Reliability test equipment customs clearance, setup, calibration, maintenance and test data analysis 3. Arranging technician to perform every reliability tests, track the test schedule, collect the test datas and compose test report. 4. Providing reliability test report and highlight reliability test issues 5. Optimizing the reliability test methods and test specifications 6. Training on testing skills and ensure the SOP has been followed strictly; 7. Follow-up and push-up with the test to meet the schedule;

1.AC/DC 電源供應器電子電路設計研發 2.電子零件規格設定與選用 3.產品規格制定與功能特性驗證 4.客戶規格制訂 5. 產品承認書製作

1.AC/DC or DC/DC 電源供應器電子電路設計研發 2.電子零件規格設定與選用 3.產品規格制定與功能特性驗證 4.客戶規格制訂 5.產品承認書製作

1. FPGA功能驗證 2. FPGA與周邊晶片功能驗證 3. 撰寫測試報告 4. 與相關部門溝通與討論 5. 分析問題與除錯

負責產品：IP cam、Dash cam 1. 影像品質調整 2. 影像品質測試驗證 3. 產線測試結果分析與確認 4. 開發相機產品相關測試項目

FPGA-數位電路研發/整合/驗證 工作內容包含: 1. SoC FPGA架構設計 2. SoC FPGA整合 3. 數位電路設計 4. 數位電路驗證 5. 系統平台驗證

1. 車廠產品客訴、售後服務處理、會判作業、結案報告提交 (需常出差工廠；苗栗三義) 2. Tier1零配件量產前品質確認作業執行 3. BP/SOP執行及案件反饋與統計 4. 配合零件物流中心及各地保養廠重大客訴件現場會判與紀錄 5. 產品/產線交付等作業溝通與協助

1.Own end-to-end RF module/SIP development to bring products from concept to mass production 2.Responsible for module/SIP technology selection, part selection, vendor evaluation, and perform cost/technology/performance analysis 3.Develop module architecture, schematic, layout and work with vendors for DFM and manufacturing 4.Perform simulation analysis (RF circuit simulation, 3D EM Simulation and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, validation RF modules/SIPs 5.Collaborate closely with cross-functional teams and vendors to ensure RF performance are met at component, board and system level 6.Evaluate new advanced packaging technology, including design and validate prototypes