轉職熱搜工作

1.負責電腦專案研發之作業系統與驅動程式相關問題分析 ( 功能異常、使用者行為定義、藍底白字畫面、黑畫面 )。 2.客戶需求與供應商驅動程式規格確認、專案時程規劃及驅動程式發佈控管、風險評估與進度確認。 3.驅動程式之系統相容性與可靠性相關問題分析及解決進度追蹤管理。 4.Microsoft和驅動程式相關產品文件與新功能學習。 5.公司內跨部門、客戶端及供應商之驅動程式相關事宜溝通協調。

[Key Responsibilities] # Backend (Go) - Maintain and reconstruct RESTful API based on Gin + GORM framework - Implementation and optimization of ODB++/Allegro schematic file parser - Design and Implementation Physical View data model - Complete the migration CLI tool and establish an automated DB schema management process - Strengthen authentication and authorization # Frontend (React + TypeScript) - Maintain and expand the front-end UI based on the React-Admin framework - Integrate Cytoscape.js graphics engine for topology view interaction: node dragging, connection establishment, layout algorithm (Klay/COSEBilkent) - Implement custom DataProvider and error handling - Develop cable routing interactive interface: component panel, connection settings, attribute editing, multi-select operation - Work with backend APIs to ensure Content-Range pagination works correctly - Maintain i18n (Chinese and English), supplement UI components and styles # DevOps & Testing - Complete unit testing and integration testing - Optimize Makefile and CI/CD processes: wire/swag/tygo tool chain automation - Maintain Docker Compose development environment and deploy Dockerfile - Assist in creating test data sets and migration seed scripts

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for HPC and AI server architectures. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. • Familiarity with L10~L12 internal/external cable form factors and applications, as well as cable routing management, space planning, and related infrastructure assessment. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1. Responsible for schematics capture, layout checking , BOM generating, and debugging and testing of server mother boards/add-in cards/backplane / GPU products. 2.Collaborate with layout engineers, validation engineers, software engineers, firmware engineers, power engineers and other teams to discover and solve any issues of designs in early stage to ensure and enhance the quality of the products. 3.Accomplish the products to conform to engineering specifications , customer performance expectations. 4. Perform other duties as assigned.

(1)Responsible for automotive product development: part survey, schematics capture, layout checking, simulation, BOM generating, debugging and testing. (2)Responsible for automotive product development documents: DFMEA, PPAP…etc (3)Collaborate with layout engineers, validation engineers, software engineers, firmware engineers, power engineers and other teams to discover and solve any issues of designs in early stage to ensure and enhance the quality of the products. (4)Accomplish the products to conform to engineering specifications, customer performance expectations. Understand the vehicle certification/regulations/customer testing requirements. (5)Understand the factory production process and testing methods.

1. PCB疊構與阻抗設計 2. Signal Integrity與Power Integrity的模擬與分析 3. Layout 的rule制定與審核 4. 訊號量測的審核與除錯 5. 流程自動化改進與in-house utilities開發 6. TDR/VNA量測

1. 規劃測試機台運作流程與排程，以提升測試產能。 2. 管理測試設備硬體，並提昇機台的穩定性。 3. 管理機台量測，以及異常事件的即時防堵和調查追蹤。 4. 規劃、評估新廠及新機台的擴增效益。 5. 導入新產品時，協助製程或研發設計的評估、解析與改善。 6. 撰寫、維護與修改測試機台應用軟體，以提昇機台檢出產品缺陷的能力。 7. 評估並選擇合適的機台零件或耗材廠商，以降低成本支出。 8. 即時監控產品品質報表。 10. 即時解析異常產品，或協調研發、製程等相關工程師共同解析。 11. 建立及發展測試缺陷紀錄的資料庫。

-品質管理系統活動推行與維護 -系統文件、國家/國際/產業法規或標準，客戶標準資料維護管理 -汽車產業與客戶要求標準化推動與執行 -協調和促進項目管理的品質活動以及組織內的跨職能活動 -對設計/流程文件進行品質工程審查以符合規定的要求，包括品質記錄 -擁有對應內部/客戶/第三方稽核和車用品質系統認證稽核經驗尤佳 -確保與遠端製造工廠進行有效溝通，以防止和/或解決品質問題和客戶客訴

1.Take the initiative to communicate with customers and develop a clear product design direction. 2.Lead function team to come out a practical proposal to the customer in concept and plan phase. 3.Responsible for integrating and managing server system specifications. 4.Support development team in new technology and feature definition and criteria. 5.Critical issue clarify and debug support.

1.測試團隊管理與領導： 領導 TE 部門，負責人員培訓、績效考核及資源調度。 建立標準化測試開發流程，提升團隊技術能力與專案執行效率。 2.RFI/RFQ 專案評估與提案： 負責新專案（NPI）的測試技術評估，撰寫與回覆 RFI/RFQ。 規劃測試治具/設備（Fixture/Equipment）之架構與預算成本分析（Cost Estimation）。 3.車用電子系統整合測試開發： 主導車用電子產品（Automotive Electronics）之軟/硬體整合測試方案開發。 定義測試計畫（Test Plan），涵蓋功能測試（FCT）、整合測試（EOL )及壓力測試。 4.測試方法驗證與導入： 開發自動化測試程式，驗證測試覆蓋率（Test Coverage）與穩定性。 協助工廠端導入量產測試，並解決 NPI 階段之工程問題。