轉職熱搜工作

1.監控系統異常狀況，維持正常運作並即時修正錯誤 2.軟硬體的安裝與維護 3.定期撰寫監測效能報告 4.拉線配管，例如電腦週邊、網路設備、軟體及資訊系統展示、設定教學等。

1. 與團隊進行Server機櫃機構結構設計 2. 產品開發過程與各Function team進行結構設計檢討與改善 3. 量產前需與工廠檢討量產問題分析與問題改善 4. 生產過程中能及時解決生產問題

主要工作內容 1. 辦理軟體/應用系統更新及換版作業。 2. 維運版本控管、虛擬桌面(VDI)等系統。 3.管理營運資料與媒體。 ※必要資格條件 1.學歷：國內、外大學畢業，且已取得學士(含)以上學位(畢業)證書。 2.須提供在學成績單(大學/碩士)。 ※口試加分條件 1.資訊或理工科系。 2.具備資訊相關證照。 3.具金融業資訊作業經驗。 ※ 一律經由研訓院官網報名，逾期及其他報名方式，恕不受理。 ◎求才網站：金融研訓院官網求才專區 ◎報名連結：https://svc.tabf.org.tw/115fisc02 ◎報名時間：115年1月29日(星期四)10:00至115年2月11日(星期三)17:00止 簡章各項內容若有變更，以台灣金融研訓院及財金資訊股份有限公司網站最新公告為準。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=7197&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development. 2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

[研發工程師]半導體技術研發、製程技術研發、智財開發(IP Development) [製程整合工程師]半導體製程整合、推動量產產品良率改良及持續製程最佳化 [製程工程師]半導體製程品質改善及維護 [智慧製造/資訊工程師]數據平台系統及資料工程、深度學習建模與開發、物聯網系統整合、IT整合、應用軟體開發及整合 及其他半導體相關工作

1. 協助工程師值班 ( 包含: 日班/假日及夜間) 2. 協助工程師機況排除 3. 協助工程師依SOP執行機台保養, 零件組裝與校正 4. 協助工程師處理SPC/FDC/PDS相關異常

1. 協助軟體工程師支援開發應用程式、前端網頁或報表等 2. 其他主管交辦事項 (如新技術或創新工具應用評估等) 3. 學期間每周至少兩天、寒/暑假期間每周4~5天

1.主被動光學元件，如調變器、檢測器、光波導、耦合器等之設計、模擬與優化。 2.執行矽光子元件及系統級的電性測試的量測，包括光學特性(如插入損耗、反射、頻寬等)與電性測試，並支援光電協同驗證相關量測。 3.分析量測數據，撰寫報告並提出設計優化建議。 4.協助製程團隊進行元件製作流程規劃，並針對製程結果進行設計修正。 5.與跨部門團隊合作，推動產品開發進度，解決技術問題。 6.使用相關軟體 (如Lumerical、COMSOL、Synopsys等)進行光學與電學模擬分析。